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1. 发明授权

US06203414B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06203414B1
公开(公告)日：2001-03-20
申请号：US09053062
申请日：1998-04-01
申请人： Minoru Numoto , Takao Inaba , Kenji Sakai , Hisashi Terashita , Manabu Satoh
发明人： Minoru Numoto , Takao Inaba , Kenji Sakai , Hisashi Terashita , Manabu Satoh
IPC分类号： B24B722
CPC分类号： B24B37/30 , B24B49/16
摘要： The polishing apparatus comprises a turn table, which polishes a semiconductor wafer, and a holding and pressing part, which holds and presses the semiconductor wafer against a polishing surface of the turn table. The holding and pressing part transmits a force from an air bag to the semiconductor wafer via a pressurized fluid layer to thereby press the semiconductor wafer against the polishing surface via the pressurized fluid layer, so that the semiconductor wafer can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer.
摘要翻译：抛光装置包括：抛光半导体晶片的转台，以及将半导体晶片压靠在转台的抛光表面上的保持和按压部分。保持和按压部分经由加压流体层将气体从气囊传递到半导体晶片，从而经由加压流体层将半导体晶片压靠在抛光表面上，从而可以抛光半导体晶片。由此，能够均匀地研磨半导体晶片。

2. 发明授权

US5931725A Wafer polishing machine 失效
标题翻译：晶圆抛光机
公开(公告)号：US5931725A
公开(公告)日：1999-08-03
申请号：US899759
申请日：1997-07-24
申请人： Takao Inaba , Masaaki Oguri , Kenji Sakai , Minoru Numoto , Hisashi Terashita
发明人： Takao Inaba , Masaaki Oguri , Kenji Sakai , Minoru Numoto , Hisashi Terashita
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , B24B53/00 , B24B53/017 , B24B57/02 , H01L21/304 , H01L21/306 , B24B7/22
CPC分类号： B24B53/017 , B24B37/04 , B24B57/02 , H01L21/30625
摘要： A semiconductor wafer is held by a wafer mount plate, which is loosely inserted into a housing. An air chamber is formed between the wafer mount plate and the housing. A retainer ring encloses the semiconductor wafer, and the semiconductor wafer as well as the retainer ring contacts with a polishing pad. An roughness is formed at the bottom of the retainer ring so as to dress the polishing pad. Polishing liquid is supplied to the inside of the retainer ring. Thus, the polishing pressure can be uniformly applied and the polishing liquid can be uniformly supplied on the whole surface of the semiconductor wafer, and the polishing for the semiconductor wafer and the dressing for the polishing pad can be performed at the same time.
摘要翻译：半导体晶片由松散地插入壳体中的晶片安装板保持。在晶片安装板和壳体之间形成空气室。保持环围绕半导体晶片，并且半导体晶片以及保持环与抛光垫接触。在保持环的底部形成粗糙度，以便打磨抛光垫。抛光液被供应到保持环的内部。因此，可以均匀地施加抛光压力，并且可以在半导体晶片的整个表面上均匀地供应抛光液，并且可以同时执行用于半导体晶片的抛光和抛光垫的修整。

3. 发明授权

US6027398A Wafer polishing apparatus 失效
标题翻译：晶圆抛光装置
公开(公告)号：US6027398A
公开(公告)日：2000-02-22
申请号：US131690
申请日：1998-08-10
申请人： Minoru Numoto , Kenji Sakai , Manabu Satoh , Hisashi Terashita
发明人： Minoru Numoto , Kenji Sakai , Manabu Satoh , Hisashi Terashita
IPC分类号： B24B41/06 , B24B49/16 , B24B5/00 , B24B29/00
CPC分类号： B24B37/30 , B24B41/06 , B24B49/16
摘要： A wafer is polished while it is pressed against a polishing cloth through a pressure air layer, and a polished surface adjustment ring as well as the wafer are pressed against the polishing cloth. The wafer is polished in the state wherein a collapsing position of the polished surface adjustment ring with respect to the polishing cloth is set in such a way that the polishing pressure which is applied from the polishing cloth to the wafer can be constant.
摘要翻译：在通过压力空气层压在抛光布上的同时对晶片进行抛光，并将抛光的表面调节环以及晶片压在抛光布上。在抛光表面调节环相对于抛光布的塌缩位置被设置成使得从抛光布施加到晶片的抛光压力可以是恒定的状态下，抛光晶片。

4. 发明授权

US6059636A Wafer polishing apparatus 失效
公开(公告)号：US6059636A
公开(公告)日：2000-05-09
申请号：US112287
申请日：1998-07-09
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
IPC分类号： B24B37/04 , B24B37/005 , B24B49/02 , B24B49/04 , B24B49/06 , H01L21/304 , B24B49/00
CPC分类号： B24B37/013 , B24B37/005 , B24B49/04 , B24B49/06
摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

5. 发明授权

US06302762B1 Wafer polishing apparatus 失效
标题翻译：晶圆抛光装置
公开(公告)号：US06302762B1
公开(公告)日：2001-10-16
申请号：US09432269
申请日：1999-11-02
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B37/005 , B24B49/04 , B24B49/06
摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.
摘要翻译：传感器在抛光期间检测到晶片的库存移除，并且CPU根据来自传感器的信息计算库存移除。 CPU比较传感器检测到的实际库存清除量和存储在RAM中的库存清单，并根据实际库存清除与库存清除之间的差异确定修整和更换抛光垫的时间。确定结果显示在显示屏上。

6. 发明授权

US06354914B1 Wafer polishing apparatus 失效
标题翻译：晶圆抛光装置
公开(公告)号：US06354914B1
公开(公告)日：2002-03-12
申请号：US09432268
申请日：1999-11-02
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B37/005 , B24B49/04 , B24B49/06
摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.
摘要翻译：传感器在抛光期间检测到晶片的库存移除，并且CPU根据来自传感器的信息计算库存移除。 CPU比较传感器检测到的实际库存清除量和存储在RAM中的库存清单，并根据实际库存清除与库存清除之间的差异确定修整和更换抛光垫的时间。确定结果显示在显示屏上。

7. 发明授权

US06346037B1 Wafer polishing machine 失效
标题翻译：晶圆抛光机
公开(公告)号：US06346037B1
公开(公告)日：2002-02-12
申请号：US09509110
申请日：2000-03-20
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai
IPC分类号： B24B500
CPC分类号： H01L21/67219 , B24B37/345 , B24B41/005
摘要： A CMP machine of the invention includes first and second polishing bases 14 and 15, first and second wafer holding heads 31 and 32, a wafer loading unit 41, a wafer unloading unit 42, first and second head rotating mechanism rotating the first and second wafer holding heads so as to position then above the first and second polishing bases, wafer loading unit, or wafer unloading unit, a first transportation mechanism transporting an unpolished wafer to the wafer loading unit, and a second transportation mechanism, transporting a polished wafer from the wafer unloading unit. The first and second polishing bases are located mutually adjacently, the wafer loading unit and wafer unloading unit are located mutually adjacently, the first polishing base and wafer loading unit are located diagonally, the second polishing base and wafer unloading unit are located diagonally. Owing to this structure, transportation of a wafer to the wafer loading unit and transportation of a wafer from the wafer unloading unit are achieved by the different transportation mechanisms. This leads to a minimized adhesion of dust to an unpolished wafer.
摘要翻译：本发明的CMP机器包括第一和第二抛光基座14和15，第一和第二晶片保持头31和32，晶片装载单元41，晶片卸载单元42，第一和第二磁头旋转机构，其使第一和第二晶片保持头以便位于第一和第二抛光基座，晶片加载单元或晶片卸载单元之上，将未抛光晶片传送到晶片加载单元的第一输送机构，以及第二输送机构，将抛光晶片从晶片卸载单元。第一和第二抛光基座相互相邻地设置，晶片加载单元和晶片卸载单元相互相邻地定位，第一抛光基底和晶片加载单元对角定位，第二抛光基底和晶片卸载单元对角定位。由于这种结构，通过不同的输送机构实现晶片向晶片装载单元的输送和晶片从晶片卸载单元的输送。这导致灰尘对未抛光晶片的附着力最小化。

8. 发明授权

US06402589B1 Wafer grinder and method of detecting grinding amount 失效
标题翻译：晶圆磨床和磨削量检测方法
公开(公告)号：US06402589B1
公开(公告)日：2002-06-11
申请号：US09581797
申请日：2000-06-15
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B49/04 , B24B49/10 , B24B49/14 , B24B49/16
摘要： The present invention provides a wafer polishing apparatus capable of controlling the polishing quantity accurately. The wafer polishing apparatus comprises a rotatable polishing stool with a polishing cloth, a carrier for bringing a wafer into contact with the polishing cloth under a predetermined pressure, a pad arranged around the wafer in such a manner as to contact the polishing cloth under a predetermined pressure, a detector for detecting the change of the relative positions of the back of the wafer or the carrier and the pad, and a control unit for controlling the polishing operation in accordance with the polishing quantity computed from the detection signal of the detector, wherein an operating unit includes a sampling unit (82) for sampling the detection signal of the detector with such a sampling period that the number of times sampled per rotation of the polishing stool is plural, a moving average calculating unit (84) for calculating the moving average data by averaging the sampling data in the number equal to an integer multiple of the number of times sampled per rotation, and a polishing quantity computing unit (85) for computing the polishing quantity from the moving average data.
摘要翻译：本发明提供能够精确地控制抛光量的晶片抛光装置。晶片抛光装置包括具有抛光布的可旋转抛光凳，用于使晶片在预定压力下与抛光布接触的载体;以预定的方式接触抛光布的方式布置在晶片周围的垫压力检测器，用于检测晶片或载体和衬垫的背面的相对位置变化的检测器;以及控制单元，用于根据从检测器的检测信号计算的抛光量来控制抛光操作，其中操作单元包括采样单元（82），用于以每次旋转抛光凳数采样次数多的采样周期对检测器的检测信号进行采样;移动平均值计算单元（84），用于计算移动平均数据通过对等于每旋转采样次数的整数倍的数量的采样数据进行平均和抛光计量量计算单元（85），用于根据移动平均数据计算抛光量。

9. 发明授权

US5876272A Semiconductor wafer polishing machine 失效
标题翻译：半导体晶圆抛光机
公开(公告)号：US5876272A
公开(公告)日：1999-03-02
申请号：US885870
申请日：1997-06-30
申请人： Takao Inaba , Masaaki Oguri , Kenji Sakai
发明人： Takao Inaba , Masaaki Oguri , Kenji Sakai
IPC分类号： B24B1/00 , B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B5/00 , B24B29/00
CPC分类号： H01L21/02024 , B24B37/30
摘要： A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.
摘要翻译：晶片安装板松散地插入壳体中，并且晶片安装板以相对于抛光垫可摆动和垂直和水平移动的方式被支撑。在晶片安装板和壳体之间形成空气室。通过控制空气室的内部压力，可以控制施加在晶片安装板上的抛光压力。由于晶片安装板的整个顶侧能够被均匀地加压，所以可以在半导体晶片的整个表面上施加均匀的抛光压力。此外，晶片安装板根据抛光垫的倾斜度的变化而倾斜，使得半导体晶片和抛光垫可以保持在平行位置。

10. 发明授权

US4844642A Cap for writing equipment 失效
标题翻译：书写设备
公开(公告)号：US4844642A
公开(公告)日：1989-07-04
申请号：US168637
申请日：1988-03-04
申请人： Takao Inaba , Kenji Sakai , Tadao Iida , Masahisa Maki
发明人： Takao Inaba , Kenji Sakai , Tadao Iida , Masahisa Maki
IPC分类号： B43K23/08 , B43K23/12
CPC分类号： B43K23/128 , B43K23/124 , B43K23/126
摘要： The cap for writing equipment comprises an air vent in the top portion, means installed on the inner peripheral surface for providing airtightness, a miniature cap movably enclosed in the axial direction in a space formed with the top face, the inner peripheral face and an annular boss for providing airtightness, a resilient seal positioned on the outside of the top of the miniature cap for blocking the ventilation between the air vent and the inside of the cap when the tip of the pen body is fitted into the cap and rebounders for pressing the miniature cap against the pen body. The annular boss for providing airtightness is so positioned as to block the ventilation in the longitudinal direction by forcing itself to contact the trunk of the pen when the tip of the pen body is fitted into the cap.
摘要翻译：用于书写设备的盖子包括顶部的通风口，安装在内周面上的用于提供气密性的装置，在轴向上可移动地封闭在由顶面，内周面和环形的空间形成的空间中的微型盖用于提供气密的凸起，位于微型盖顶部的外侧的弹性密封件，用于当笔体的顶端装配到盖中时阻止通气孔和盖内部之间的通风，并且用于按压针对笔体的微型帽。用于提供气密性的环形凸台被定位成当笔体的尖端装配到盖中时通过强制自身接触笔的躯干来阻止纵向的通风。

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