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1. 发明授权

US06547650B2 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06547650B2
公开(公告)日：2003-04-15
申请号：US09782069
申请日：2001-02-12
申请人： Takao Inaba
发明人： Takao Inaba
IPC分类号： B24B700
CPC分类号： B24B37/345 , B24B41/005 , H01L21/67155
摘要： In a wafer polishing apparatus 1 according to this invention, waiting units 43 having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit 3 to a polishing head 42 or vice versa are provided to a polishing unit 4, and the upper/lower stage wafer placement tables can move individually. A spindle-washing unit 44 for washing polishing heads is disposed inside a lower space below the waiting units.
摘要翻译：在根据本发明的晶片抛光装置1中，具有用于将晶片从负载/卸载单元3临时保持到抛光头42或反之亦然的上下两级晶片放置台的等待单元43被提供给抛光单元4，上/下级晶片放置台可单独移动。用于洗涤抛光头的主轴洗涤单元44设置在等待单元下方的下部空间内。

2. 发明授权

US06203414B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06203414B1
公开(公告)日：2001-03-20
申请号：US09053062
申请日：1998-04-01
申请人： Minoru Numoto , Takao Inaba , Kenji Sakai , Hisashi Terashita , Manabu Satoh
发明人： Minoru Numoto , Takao Inaba , Kenji Sakai , Hisashi Terashita , Manabu Satoh
IPC分类号： B24B722
CPC分类号： B24B37/30 , B24B49/16
摘要： The polishing apparatus comprises a turn table, which polishes a semiconductor wafer, and a holding and pressing part, which holds and presses the semiconductor wafer against a polishing surface of the turn table. The holding and pressing part transmits a force from an air bag to the semiconductor wafer via a pressurized fluid layer to thereby press the semiconductor wafer against the polishing surface via the pressurized fluid layer, so that the semiconductor wafer can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer.
摘要翻译：抛光装置包括：抛光半导体晶片的转台，以及将半导体晶片压靠在转台的抛光表面上的保持和按压部分。保持和按压部分经由加压流体层将气体从气囊传递到半导体晶片，从而经由加压流体层将半导体晶片压靠在抛光表面上，从而可以抛光半导体晶片。由此，能够均匀地研磨半导体晶片。

3. 发明授权

US4496258A Writing pen with space behind nib 失效
标题翻译：书写笔与笔尖后面的空格
公开(公告)号：US4496258A
公开(公告)日：1985-01-29
申请号：US499026
申请日：1983-06-02
申请人： Isao Tanaka , Takao Inaba
发明人： Isao Tanaka , Takao Inaba
IPC分类号： B43K8/02 , B43K5/08 , B43K5/18
CPC分类号： B43K5/1845 , B43K5/1863
摘要： A writing pen wherein a valve element is operated to supply a writing nib held in a pen holder with ink from an ink reservoir is disclosed. The pen is characterized by having an ink guide stem between the writing nib and the valve element and a small ink-retaining space that is provided at least between the rear end of the nib and the front end of the ink guide stem.
摘要翻译：公开了一种书写笔，其中操作阀元件以将保持在笔架中的笔尖供给来自墨水容器的墨水。该笔的特征在于在书写笔尖和阀门元件之间具有墨水引导杆，并且至少在笔尖的后端和墨水引导杆的前端之间设置有小的墨水保持空间。

4. 发明申请

US20070212159A1 Direct-fluid-supply writing implement 有权
标题翻译：直接供液书写工具
公开(公告)号：US20070212159A1
公开(公告)日：2007-09-13
申请号：US11715946
申请日：2007-03-09
申请人： Tetsuhiro Kurita , Takao Inaba
发明人： Tetsuhiro Kurita , Takao Inaba
IPC分类号： B43K8/08 , B43K8/06
CPC分类号： B43K7/10 , B43K8/04
摘要： A direct-fluid-supply writing implement has a pentip, an ink occlusion body connected to a rear end of the pentip, an ink tank that directly stores ink and is arranged at a rear of the ink occlusion body, a plurality of communication tubes that connects the ink tank to the ink occlusion body and a partition wall provided between the ink occlusion body and the ink tank. Forward end portions of the communication tubes are protruded forward from a front face of the partition wall, and are located inside the ink occlusion body. At least one of the communication tubes is provided such that a rear end of the communication tube is protruded backward from a rear face of the partition wall and is located inside the ink tank.
摘要翻译：一种直接供液式书写工具具有一个连接到该五角形后端的墨水吸收体，一个直接存储墨水并设置在墨水吸收体后部的墨水罐，多个连通管，将墨水盒连接到墨水封闭体和设置在墨水吸收体和墨水容器之间的分隔壁。连通管的前端部从分隔壁的前表面向前方突出，并且位于吸墨体的内部。连通管中的至少一个设置成使得连通管的后端从分隔壁的后表面向后突出并且位于墨罐内。

5. 发明授权

US06354914B1 Wafer polishing apparatus 失效
标题翻译：晶圆抛光装置
公开(公告)号：US06354914B1
公开(公告)日：2002-03-12
申请号：US09432268
申请日：1999-11-02
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai , Manabu Satoh
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B37/005 , B24B49/04 , B24B49/06
摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.
摘要翻译：传感器在抛光期间检测到晶片的库存移除，并且CPU根据来自传感器的信息计算库存移除。 CPU比较传感器检测到的实际库存清除量和存储在RAM中的库存清单，并根据实际库存清除与库存清除之间的差异确定修整和更换抛光垫的时间。确定结果显示在显示屏上。

6. 发明授权

US06346037B1 Wafer polishing machine 失效
标题翻译：晶圆抛光机
公开(公告)号：US06346037B1
公开(公告)日：2002-02-12
申请号：US09509110
申请日：2000-03-20
申请人： Takao Inaba , Minoru Numoto , Kenji Sakai
发明人： Takao Inaba , Minoru Numoto , Kenji Sakai
IPC分类号： B24B500
CPC分类号： H01L21/67219 , B24B37/345 , B24B41/005
摘要： A CMP machine of the invention includes first and second polishing bases 14 and 15, first and second wafer holding heads 31 and 32, a wafer loading unit 41, a wafer unloading unit 42, first and second head rotating mechanism rotating the first and second wafer holding heads so as to position then above the first and second polishing bases, wafer loading unit, or wafer unloading unit, a first transportation mechanism transporting an unpolished wafer to the wafer loading unit, and a second transportation mechanism, transporting a polished wafer from the wafer unloading unit. The first and second polishing bases are located mutually adjacently, the wafer loading unit and wafer unloading unit are located mutually adjacently, the first polishing base and wafer loading unit are located diagonally, the second polishing base and wafer unloading unit are located diagonally. Owing to this structure, transportation of a wafer to the wafer loading unit and transportation of a wafer from the wafer unloading unit are achieved by the different transportation mechanisms. This leads to a minimized adhesion of dust to an unpolished wafer.
摘要翻译：本发明的CMP机器包括第一和第二抛光基座14和15，第一和第二晶片保持头31和32，晶片装载单元41，晶片卸载单元42，第一和第二磁头旋转机构，其使第一和第二晶片保持头以便位于第一和第二抛光基座，晶片加载单元或晶片卸载单元之上，将未抛光晶片传送到晶片加载单元的第一输送机构，以及第二输送机构，将抛光晶片从晶片卸载单元。第一和第二抛光基座相互相邻地设置，晶片加载单元和晶片卸载单元相互相邻地定位，第一抛光基底和晶片加载单元对角定位，第二抛光基底和晶片卸载单元对角定位。由于这种结构，通过不同的输送机构实现晶片向晶片装载单元的输送和晶片从晶片卸载单元的输送。这导致灰尘对未抛光晶片的附着力最小化。

7. 发明授权

US06196905B1 Wafer polishing apparatus with retainer ring 失效
标题翻译：带保护环的晶圆抛光装置
公开(公告)号：US06196905B1
公开(公告)日：2001-03-06
申请号：US09519424
申请日：2000-03-06
申请人： Takao Inaba
发明人： Takao Inaba
IPC分类号： B24B500
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： A rubber sheet is arranged between a head body and a retainer ring of a wafer holding head. Two O-rings air-tightly close a space between the periphery of the rubber sheet, which is located above the retainer ring, and the head body. When a pump supplies the compressed air to the space, the periphery of the rubber sheet is elastically deformed to press the retainer ring under uniform pressure.
摘要翻译：橡胶片布置在晶片保持头的头部本体和保持环之间。两个O形环气密地封闭位于保持环上方的橡胶片的周边与头部本体之间的空间。当泵将压缩空气供给到空间时，橡胶片的周边弹性变形，以在均匀的压力下按压保持环。

8. 发明授权

US6033292A Wafer polishing apparatus with retainer ring 失效
标题翻译：带保护环的晶圆抛光装置
公开(公告)号：US6033292A
公开(公告)日：2000-03-07
申请号：US84782
申请日：1998-05-27
申请人： Takao Inaba
发明人： Takao Inaba
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , B24B5/00
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： A rubber sheet is arranged between a head body and a retainer ring of a wafer holding head. Two O-rings air-tightly close a space between the periphery of the rubber sheet, which is located above the retainer ring, and the head body. When a pump supplies the compressed air to the space, the periphery of the rubber sheet is elastically deformed to press the retainer ring under uniform pressure.
摘要翻译：橡胶片布置在晶片保持头的头部本体和保持环之间。两个O形环气密地封闭位于保持环上方的橡胶片的周边与头部本体之间的空间。当泵将压缩空气供给到空间时，橡胶片的周边弹性变形，以在均匀的压力下按压保持环。

9. 发明授权

US08128304B2 Direct-fluid-supply writing implement 有权
标题翻译：直接供液书写工具
公开(公告)号：US08128304B2
公开(公告)日：2012-03-06
申请号：US11715946
申请日：2007-03-09
申请人： Tetsuhiro Kurita , Takao Inaba
发明人： Tetsuhiro Kurita , Takao Inaba
IPC分类号： B43K5/00
CPC分类号： B43K7/10 , B43K8/04
摘要： A direct-fluid-supply writing implement has a pentip, an ink occlusion body connected to a rear end of the pentip, an ink tank that directly stores ink and is arranged at a rear of the ink occlusion body, a plurality of communication tubes that connects the ink tank to the ink occlusion body and a partition wall provided between the ink occlusion body and the ink tank. Forward end portions of the communication tubes are protruded forward from a front face of the partition wall, and are located inside the ink occlusion body. At least one of the communication tubes is provided such that a rear end of the communication tube is protruded backward from a rear face of the partition wall and is located inside the ink tank.
摘要翻译：一种直接供液式书写工具具有一个连接到该五角形后端的墨水吸收体，一个直接储存墨水并设置在墨水吸收体后部的墨水罐，多个连通管，将墨水盒连接到墨水封闭体和设置在墨水吸收体和墨水容器之间的分隔壁。连通管的前端部从分隔壁的前表面向前方突出，并且位于吸墨体的内部。连通管中的至少一个设置成使得连通管的后端从分隔壁的后表面向后突出并且位于墨罐内。

10. 发明授权

US06296555B1 Wafer machining apparatus 失效
标题翻译：晶圆加工设备
公开(公告)号：US06296555B1
公开(公告)日：2001-10-02
申请号：US09420454
申请日：1999-10-18
申请人： Takao Inaba , Minoru Numoto
发明人： Takao Inaba , Minoru Numoto
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B41/061
摘要： According to the present invention, a floating mechanism of a load stage floats positioned wafers in concave parts, and then, the chucks hold the wafers by suction. Therefore, the chucks can easily hold the centered wafers.
摘要翻译：根据本发明，负载台的浮动机构将定位的晶片漂浮在凹部中，然后卡盘通过抽吸来保持晶片。因此，卡盘可以容易地保持中心的晶片。

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