专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080142941A1 3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA 审中-公开
标题翻译：具有增强接地性能和嵌入式天线的3D电子包装结构
公开(公告)号：US20080142941A1
公开(公告)日：2008-06-19
申请号：US11612563
申请日：2006-12-19
申请人： Ming-Chih Yew , Chien-Chia Chiu , Kou-Ning Chiang , Wen-Kun Yang
发明人： Ming-Chih Yew , Chien-Chia Chiu , Kou-Ning Chiang , Wen-Kun Yang
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/97 , H01L25/16 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1005 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19015 , H01L2924/3025 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention proposes a 3D electronic packaging structure with enhanced grounding performance and embedded antenna, and the packaging unit can achieve multi-chip stacking through the signal contacts on the top and bottom surfaces of the unit. A single or multiple grounding layers are on the back of the substrate in the packaging unit to facilitate the grounding for the semiconductor element; further, the packaging unit is applicable to a wafer level packaging process, so the manufacturing cost of each individual packaging unit is reduced. The above grounding layers are also the signal transmission paths of the electronic elements in the packaging structure of the invention, and a single or multiple via holes around the electronic element layers allow electrical signal connection between the top and bottom surfaces of the packaging structure, and thus enable more functionality in the packaging unit. Moreover, the grounding layers may have circular signal channels to construct a 3D stacked packaging structure with embedded antenna.
摘要翻译：本发明提出了具有增强的接地性能的3D电子封装结构和嵌入式天线，并且封装单元可以通过单元的顶表面和底表面上的信号触点实现多芯片堆叠。单个或多个接地层位于封装单元中的衬底的背面，以便于半导体元件的接地; 此外，封装单元适用于晶片级封装工艺，因此减少了各个封装单元的制造成本。上述接地层也是本发明的包装结构中的电子元件的信号传输路径，并且电子元件层周围的单个或多个通孔允许包装结构的顶表面和底表面之间的电信号连接，以及从而在包装单元中实现更多功能。此外，接地层可以具有圆形信号通道，以构建具有嵌入式天线的3D堆叠封装结构。

2. 发明授权

US07884464B2 3D electronic packaging structure having a conductive support substrate 有权
标题翻译：具有导电支撑基板的3D电子封装结构
公开(公告)号：US07884464B2
公开(公告)日：2011-02-08
申请号：US11475131
申请日：2006-06-27
申请人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
发明人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
IPC分类号： H01L23/04
CPC分类号： H01L23/5389 , H01L24/19 , H01L24/24 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2225/1005 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.
摘要翻译：本发明提供了一种3D电子封装单元，其具有能够通过该单元两侧的信号触点实现多芯片堆叠的导电支撑基板。包装单元可以在晶片或基板上批量生产，从而降低每个单独包装单元的制造成本; 此外，导电支撑基板可以用于提供电子元件的信号传输，并且支撑基板可以用作所携带的电子元件的接地端子，以增强电子元件的电性能。支撑基板也是良好的热导体，其可以有效地释放由电子元件产生的热能并且沿着衬底积聚在封装内部的热量，以增强封装结构的可靠性。

3. 发明申请

US20070296065A1 3D electronic packaging structure having a conductive support substrate 有权
标题翻译：具有导电支撑基板的3D电子封装结构
公开(公告)号：US20070296065A1
公开(公告)日：2007-12-27
申请号：US11475131
申请日：2006-06-27
申请人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
发明人： Ming-Chih Yew , Chang-Ann Yuan , Chan-Yen Chou , Kou-Ning Chiang
IPC分类号： H01L23/552
CPC分类号： H01L23/5389 , H01L24/19 , H01L24/24 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2225/1005 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.
摘要翻译：本发明提供了一种3D电子封装单元，其具有能够通过该单元两侧的信号触点实现多芯片堆叠的导电支撑基板。包装单元可以在晶片或基板上批量生产，从而降低每个单独包装单元的制造成本; 此外，导电支撑基板可以用于提供电子元件的信号传输，并且支撑基板可以用作所携带的电子元件的接地端子，以增强电子元件的电性能。支撑基板也是良好的热导体，其可以有效地释放由电子元件产生的热能并且沿着衬底积聚在封装内部的热量，以增强封装结构的可靠性。

4. 发明授权

US4781364A Elastic beam-torsion rod connection 失效
标题翻译：弹性梁 - 扭力杆连接
公开(公告)号：US4781364A
公开(公告)日：1988-11-01
申请号：US541862
申请日：1983-10-14
申请人： Bernard J. Finn , Ming-Chih Yew
发明人： Bernard J. Finn , Ming-Chih Yew
IPC分类号： B60G11/18 , B60G21/05 , F16F1/368 , F16F1/18 , B60G19/00 , F16F1/14
CPC分类号： F16F1/3686 , B60G11/181 , B60G21/05 , B60G2202/132 , B60G2204/4307 , B60G2204/82 , B60G2204/8302
摘要： A twist isolating connection between a distal end of an elastic beam disposed transversely of a vehicle sprung mass and an adjacent end of a torsion rod disposed longitudinally of the sprung mass between a suspension control arm and the elastic beam distal end, the connection including a yoke rigidly attached to the end of the torsion rod with a pair of legs straddling a platform member on the distal end of the elastic beam, and a pair of protuberances on the legs engaging opposite sides of the platform member in a common transverse plane of the sprung mass but at laterally spaced locations. The elastic beam is thus clamped between the protuberances which transfer torsional moments to the elastic beam for resistance in bending modes but which isolate the elastic beam from the torsion rod with respect to twisting of the beam due to beam bending of the torsion rod.
摘要翻译：弹性梁的远端设置在横向于车辆弹簧质量的远端之间的扭转隔离连接以及设置在悬挂控制臂与弹性梁远端之间的簧上质量纵向的扭转杆的相邻端，该连接包括轭刚性地连接到扭力杆的端部，一对腿跨过弹性梁的远端上的平台构件，并且腿上的一对突起，在弹簧的共同横向平面中接合平台构件的相对侧但在横向间隔的位置。因此，弹性梁被夹紧在突起之间，该突起将扭转力矩传递到弹性梁以抵抗弯曲模式，但是由于扭杆的梁弯曲，弹性梁相对于梁的扭转而与扭转杆隔离。

5. 发明授权

US4540197A Vehicle wheel suspension 失效
标题翻译：车轮悬挂
公开(公告)号：US4540197A
公开(公告)日：1985-09-10
申请号：US516034
申请日：1983-07-22
申请人： Bernard J. Finn , Ming-Chih Yew
发明人： Bernard J. Finn , Ming-Chih Yew
IPC分类号： B60G11/18 , B60G11/44 , B60G21/05 , F16F1/26 , B60G3/00
CPC分类号： F16F1/26 , B60G11/181 , B60G11/44 , B60G21/05 , B60G2202/132 , B60G2204/4307 , B60G2204/82 , B60G2204/8302
摘要： A vehicle wheel suspension includes transverse control arms for an opposed pair of road wheels and a primary suspension spring beam spaced longitudinally of the vehicle away from the control arms and interconnected therewith by torsion rods installed on axes located outboard of the swing axes of the transverse control arms.
摘要翻译：车轮悬架包括用于相对的一对车轮的横向控制臂和沿着车辆纵向间隔离控制臂并与其相连的主悬架弹簧梁，该扭矩杆安装在位于横向控制器的摆动轴外侧的轴上武器。

6. 发明授权

US08946888B2 Package on packaging structure and methods of making same 有权
标题翻译：包装结构及其制作方法
公开(公告)号：US08946888B2
公开(公告)日：2015-02-03
申请号：US13250606
申请日：2011-09-30
申请人： Wen-Yi Lin , Ming-Chih Yew , Po-Yao Lin , Jing Ruei Lu , Jiun Yi Wu
发明人： Wen-Yi Lin , Ming-Chih Yew , Po-Yao Lin , Jing Ruei Lu , Jiun Yi Wu
IPC分类号： H01L23/10 , H01L25/10 , H01L23/36 , H01L23/367 , H01L23/42 , H01L23/498 , H01L23/00
CPC分类号： H01L25/50 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/42 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/105 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/17519 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer.
摘要翻译：包装结构上的包装通过在第一和第二包装之间引入销售的热耦合器来提供改善的热传导和机械强度。第一封装具有第一衬底和穿过第一衬底的通孔。第一组导电元件与第一衬底的通孔对准并耦合到第一衬底的通孔。固体热耦合器耦合到第一组导电元件和第二封装的管芯。第二组导电元件耦合到管芯，并且底部衬底耦合到第二组导电元件。热耦合器可以是例如插入件，散热器或导热层。

7. 发明授权

US08624392B2 Electrical connection for chip scale packaging 有权
标题翻译：电子连接用于芯片级包装
公开(公告)号：US08624392B2
公开(公告)日：2014-01-07
申请号：US13152734
申请日：2011-06-03
申请人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
发明人： Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Chia-Jen Cheng , Hsiu-Mei Yu
IPC分类号： H01L23/485
CPC分类号： H01L24/13 , H01L21/76885 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/82 , H01L2224/02235 , H01L2224/02255 , H01L2224/0235 , H01L2224/02375 , H01L2224/0401 , H01L2224/05005 , H01L2224/05008 , H01L2224/05022 , H01L2224/05541 , H01L2224/05569 , H01L2224/05572 , H01L2224/10155 , H01L2224/13005 , H01L2224/13006 , H01L2224/13007 , H01L2224/13024 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/00014 , H01L2924/01029 , H01L2924/351 , H01L2924/35121 , H01L2924/207 , H01L2924/2076 , H01L2224/05552
摘要： A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化和欠掺杂金属化的系统和方法。一个实施例包括大于上覆下凸点金属化的后钝化层。延伸超过下凸块金属化的后钝化层屏蔽下层不受材料的热膨胀系数的不匹配产生的应力。

8. 发明授权

US4129817A Stepped voltage power supply with equalized discharge of battery cells 失效
标题翻译：步进电压电源，均衡放电电池
公开(公告)号：US4129817A
公开(公告)日：1978-12-12
申请号：US826372
申请日：1977-08-22
申请人： Ming-Chih Yew , Trevor O. Jones
发明人： Ming-Chih Yew , Trevor O. Jones
IPC分类号： H01H19/28 , H01H19/56 , H02J7/00 , H02P7/00
CPC分类号： H01H19/28 , H01H19/56
摘要： The adjacent terminals of adjacent battery cells are grouped in regularly spaced pairs of contacts. A first commutating member has a plurality of regularly spaced contact members effective to connect the contacts of each pair but one and is movable sequentially through a plurality of positions to vary the unconnected contact pair. One of the contact members adjacent the unconnected contact pair provides a first output terminal. A second commutating member has a single contact member effective to connect the contacts of one of said pairs and provide a second output terminal and is movable sequentially through a plurality of positions to vary the connected contact pair. Actuator means are movable sequentially through a plurality of positions in a first direction and a second direction and are connected through a unidirectional clutch to the second commutating member to move it in one direction to increase the number of cells connected across the output terminals with movement of the actuator means in its first direction and through a unidirectional clutch to the first commutating member to move it in the same one direction to decrease the number of cells connected across the output terminals with movement of the actuator means in its second direction, thereby varying the output voltage in a stepped fashion and equalizing the discharge of the individual cells with such variation.
摘要翻译：相邻电池单元的相邻端子被组合成规则间隔的触点对。第一换向构件具有多个规则间隔的接触构件，其有效地连接每对的触点，但是可以顺序地移动通过多个位置以改变未连接的触点对。与未连接的触点对相邻的接触构件中的一个提供第一输出端子。第二换向构件具有有效地连接所述对之一的触点的单个接触构件，并提供第二输出端子，并且可以顺序移动通过多个位置以改变所连接的触点对。致动器装置可沿第一方向和第二方向顺序地移动通过多个位置，并且通过单向离合器连接到第二换向构件以沿一个方向移动，以增加跨过输出端子连接的单元的数量，致动器在其第一方向上并且通过单向离合器连接到第一换向构件，以沿着相同的一个方向移动它，以通过致动器装置在其第二方向上的运动来减小连接在输出端上的单元的数量，从而改变输出电压，并以这种变化均衡各个电池的放电。

9. 发明授权

US09887144B2 Ring structure for chip packaging 有权
公开(公告)号：US09887144B2
公开(公告)日：2018-02-06
申请号：US13227983
申请日：2011-09-08
申请人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
发明人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
IPC分类号： H01L23/10 , H01L23/16 , H01L23/36 , H01L21/56 , H01L23/00
CPC分类号： H01L23/10 , H01L21/563 , H01L23/16 , H01L23/36 , H01L24/16 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/29099 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/00014
摘要： A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

10. 发明授权

US09548281B2 Electrical connection for chip scale packaging 有权
标题翻译：电子连接用于芯片级封装
公开(公告)号：US09548281B2
公开(公告)日：2017-01-17
申请号：US13269310
申请日：2011-10-07
申请人： Ming-Chih Yew , Wen-Yi Lin , Fu-Jen Li , Po-Yao Lin
发明人： Ming-Chih Yew , Wen-Yi Lin , Fu-Jen Li , Po-Yao Lin
IPC分类号： H01L23/48 , H01L21/28 , H01L23/00 , H01L23/488 , H01L23/31 , H01L23/525
CPC分类号： H01L24/06 , H01L23/3157 , H01L23/525 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05008 , H01L2224/05012 , H01L2224/05022 , H01L2224/05541 , H01L2224/05552 , H01L2224/05555 , H01L2224/05569 , H01L2224/05572 , H01L2224/061 , H01L2224/06137 , H01L2224/06179 , H01L2924/00014 , H01L2924/00012 , H01L2924/206
摘要： A system and method for providing a post-passivation opening and undercontact metallization is provided. An embodiment comprises an opening through the post-passivation which has a first dimension longer than a second dimension, wherein the first dimension is aligned perpendicular to a chip's direction of coefficient of thermal expansion mismatch. By shaping and aligning the opening through the post-passivation layer in this fashion, the post-passivation layer helps to shield the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.
摘要翻译：提供了一种用于提供后钝化开口和未接触金属化的系统和方法。实施例包括通过后钝化的开口，其具有比第二尺寸长的第一尺寸，其中第一尺寸垂直于芯片的热膨胀失配系数的方向排列。通过以这种方式通过后钝化层成形和对准开口，后钝化层有助于屏蔽下层，避免由材料的热膨胀系数的错配产生的应力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式