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    • 3. 发明授权
    • Non-volatile memory devices having trenches
    • 具有沟槽的非易失性存储器件
    • US07259421B2
    • 2007-08-21
    • US11020920
    • 2004-12-23
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L29/788
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 4. 发明申请
    • Non-volatile memory devices having trenches and methods of forming the same
    • 具有沟槽的非易失性存储器件及其形成方法
    • US20060027855A1
    • 2006-02-09
    • US11020920
    • 2004-12-23
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L29/788
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 5. 发明申请
    • METHODS OF FORMING NON-VOLATILE MEMORY DEVICES HAVING TRENCHES
    • 形成具有斜面的非易失性存储器件的方法
    • US20070066003A1
    • 2007-03-22
    • US11558634
    • 2006-11-10
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L21/8238
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 8. 发明授权
    • Method of forming non-volatile memory having floating trap type device
    • 形成具有浮动陷阱型装置的非易失性存储器的方法
    • US06677200B2
    • 2004-01-13
    • US10194182
    • 2002-07-12
    • Chang-Hyun LeeJung-Dal ChoiSung-Hoi Hur
    • Chang-Hyun LeeJung-Dal ChoiSung-Hoi Hur
    • H01L213366
    • H01L29/792H01L21/28282H01L29/66833Y10S438/954
    • A method of forming a non-volatile memory having a floating trap-type device is disclosed in the present invention. In the method, a relatively thick thermal oxide layer is formed at a semiconductor substrate and patterned to leave a thick thermal oxide pattern at a high-voltage region (a high-voltage region defining step). An oxide-nitride-oxide (ONO) layer is formed over substantially the entire surface (the substantial surface) of the semiconductor substrate and patterned to leave an ONO pattern at a cell memory region (a cell memory region defining step). After the high-voltage region defining step and the cell memory region defining step, a thermal oxidizing process is performed with respect to the semiconductor substrate where a low-voltage region is exposed, thereby forming a relatively thin gate insulation layer for a low-voltage type device (a low-voltage region defining region).
    • 在本发明中公开了形成具有浮动陷阱型装置的非易失性存储器的方法。 在该方法中,在半导体衬底上形成相对较厚的热氧化物层,并将其图案化以在高电压区域(高电压区域限定步骤)处留下厚的热氧化物图案。 在半导体衬底的基本上整个表面(基本表面)上形成氧化物 - 氧化物(ONO)层,并将其图案化以在单元存储区(单元存储区定义步骤)处留下ONO图案。 在高电压区域定义步骤和电池存储区域限定步骤之后,对于暴露低电压区域的半导体衬底进行热氧化处理,从而形成用于低电压的较薄的栅极绝缘层 (低电压区域限定区域)。
    • 9. 发明授权
    • Methods of forming non-volatile memory devices having trenches
    • 形成具有沟槽的非易失性存储器件的方法
    • US07501322B2
    • 2009-03-10
    • US11558634
    • 2006-11-10
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L21/336
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。