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1. 发明授权

US08638542B2 Capacitor containing a large number of filamentous conductors and method of manufacturing the same 有权
标题翻译：含有大量丝状导体的电容器及其制造方法
公开(公告)号：US08638542B2
公开(公告)日：2014-01-28
申请号：US12833185
申请日：2010-07-09
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
IPC分类号： H01G4/06 , H01G4/005 , H01G7/00
CPC分类号： H05K1/162 , H01G4/012 , H01G4/232 , H01G4/302 , H05K1/0287 , H05K1/0306 , H05K2201/09263 , H05K2201/09563 , H05K2201/09609 , H05K2201/097 , H05K2201/09945
摘要： A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.
摘要翻译：电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

2. 发明申请

US20110013340A1 CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电容器及其制造方法
公开(公告)号：US20110013340A1
公开(公告)日：2011-01-20
申请号：US12833185
申请日：2010-07-09
申请人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
IPC分类号： H01G4/06 , H05K3/30
CPC分类号： H05K1/162 , H01G4/012 , H01G4/232 , H01G4/302 , H05K1/0287 , H05K1/0306 , H05K2201/09263 , H05K2201/09563 , H05K2201/09609 , H05K2201/097 , H05K2201/09945
摘要： A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.
摘要翻译：电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

3. 发明授权

US08304664B2 Electronic component mounted structure 有权
标题翻译：电子元件安装结构
公开(公告)号：US08304664B2
公开(公告)日：2012-11-06
申请号：US12777605
申请日：2010-05-11
申请人： Tsuyoshi Kobayashi , Michio Horiuchi , Yukio Shimizu , Yasue Tokutake
发明人： Tsuyoshi Kobayashi , Michio Horiuchi , Yukio Shimizu , Yasue Tokutake
IPC分类号： H05K1/11
CPC分类号： H05K3/325 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/13147 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/83194 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15724 , H01L2924/15788 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H05K3/305 , H05K2201/09945 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.
摘要翻译：一种电子部件（芯片）安装结构，包括具有端子的芯片，具有与芯片的端子电连接的端子的布线板以及设置在芯片和布线板之间的插入板，并且具有包括绝缘基底材料具有在其厚度方向上穿透绝缘基材的大量丝状导体。芯片的端子通过设置在插入板中的多个丝状导体电连接到布线板的端子。

4. 发明申请

US20100294552A1 ELECTRONIC COMPONENT MOUNTED STRUCTURE 有权
标题翻译：电子元件安装结构
公开(公告)号：US20100294552A1
公开(公告)日：2010-11-25
申请号：US12777605
申请日：2010-05-11
申请人： Tsuyoshi KOBAYASHI , Michio Horiuchi , Yukio Shimizu , Yasue Tokutake
发明人： Tsuyoshi KOBAYASHI , Michio Horiuchi , Yukio Shimizu , Yasue Tokutake
IPC分类号： H05K1/16
CPC分类号： H05K3/325 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/13147 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/83194 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15724 , H01L2924/15788 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H05K3/305 , H05K2201/09945 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2924/05432 , H01L2924/05042 , H01L2924/05032 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.
摘要翻译：一种电子部件（芯片）安装结构，包括具有端子的芯片，具有与芯片的端子电连接的端子的布线板以及设置在芯片和布线板之间的插入板，并且具有包括绝缘基底材料具有在其厚度方向上穿透绝缘基材的大量丝状导体。芯片的端子通过设置在插入板中的多个丝状导体电连接到布线板的端子。

5. 发明授权

US08134444B2 Inductor and manufacturing method thereof 有权
标题翻译：电感及其制造方法
公开(公告)号：US08134444B2
公开(公告)日：2012-03-13
申请号：US12895915
申请日：2010-10-01
申请人： Michio Horiuchi , Yukio Shimizu , Kazunari Sekigawa , Tsuyoshi Kobayashi
发明人： Michio Horiuchi , Yukio Shimizu , Kazunari Sekigawa , Tsuyoshi Kobayashi
IPC分类号： H01F17/04 , H01R4/58
CPC分类号： H01F17/0013 , H01F41/041 , H01F2017/002 , Y10T29/4902
摘要： An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.
摘要翻译：电感器包括芯基板，其包括在芯基板的前表面和后表面之间延伸的微小列状电导体。每个柱状电导体被绝缘材料包围，与相邻的柱状电导体绝缘。绝缘层分别形成在芯基板的前表面和后表面上。至少两个连接电导体延伸穿过每个绝缘层。每个连接电导体电连接到多个柱状电导体。在每个绝缘层上形成布线，以将所述连接电导体彼此电连接。连线，连接电导体和列状电导体被连接以形成三维方式的线圈。

6. 发明申请

US20110080247A1 Inductor and Manufacturing Method Thereof 有权
标题翻译：电感和制造方法
公开(公告)号：US20110080247A1
公开(公告)日：2011-04-07
申请号：US12895915
申请日：2010-10-01
申请人： Michio HORIUCHI , Yukio Shimizu , Kazunari Sekigawa , Tsuyoshi Kobayashi
发明人： Michio HORIUCHI , Yukio Shimizu , Kazunari Sekigawa , Tsuyoshi Kobayashi
IPC分类号： H01F17/04 , H01F41/00
CPC分类号： H01F17/0013 , H01F41/041 , H01F2017/002 , Y10T29/4902
摘要： An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.
摘要翻译：电感器包括芯基板，其包括在芯基板的前表面和后表面之间延伸的微小列状电导体。每个柱状电导体被绝缘材料包围，与相邻的柱状电导体绝缘。绝缘层分别形成在芯基板的前表面和后表面上。至少两个连接电导体延伸穿过每个绝缘层。每个连接电导体电连接到多个柱状电导体。在每个绝缘层上形成布线，以将所述连接电导体彼此电连接。连线，连接电导体和列状电导体被连接以形成三维方式的线圈。

7. 发明授权

US06312324B1 Superabrasive tool and method of manufacturing the same 失效
标题翻译：超研磨工具及其制造方法
公开(公告)号：US06312324B1
公开(公告)日：2001-11-06
申请号：US09077024
申请日：1998-05-27
申请人： Kosuke Mitsui , Toshio Fukunishi , Kazunori Kadomura , Yukio Shimizu , Yoshio Kouta , Masaaki Yamanaka , Akio Hara
发明人： Kosuke Mitsui , Toshio Fukunishi , Kazunori Kadomura , Yukio Shimizu , Yoshio Kouta , Masaaki Yamanaka , Akio Hara
IPC分类号： B24D300
CPC分类号： B24B53/017 , B24B3/06 , B24B37/16 , B24B53/12 , B24D3/00 , B24D5/00 , B24D7/00 , B24D18/00
摘要： A superabrasive tool such as a superabrasive grindstone (101; 102), a superabrasive dresser (103; 104; 105) or a superabrasive lap surface plate (106) includes a base (20) of steel and a superabrasive layer (10) formed on the base (20). The superabrasive layer (10) includes superabrasive grains (11) consisting of diamond grains, cubic boron nitride grains or the like and a holding layer consisting of a nickel plating layer (16) and a bond layer (17), or a brazing filler metal layer (18), holding the superabrasive grains (11) and fixing the same onto the base (20). Grooves (12) or holes (14) are formed on flat surfaces (19) of the superabrasive grains (11) exposed from the holding layer (16, 17; 18). The holding layer (16, 17; 18) holding and fixing the superabrasive grains (11) so that the surfaces of the grains are partially exposed is formed on the base (20). The grooves (12) or the holes (14) are formed by irradiating the surfaces of the superabrasive grains (11) exposed from the holding layer (16, 17; 18) with a laser beam (50). Working of high accuracy can be performed by forming the grooves (12) or the holes (14) on the surfaces of the superabrasive grains (11).
摘要翻译：超研磨工具，例如超研磨磨石（101; 102），超研磨修整器（103; 104; 105）或超级磨料搭接表面板（106），包括钢的基部（20）和形成在基座（20）。超级磨料层（10）包括由金刚石晶粒，立方氮化硼晶粒等构成的超磨料颗粒（11）和由镀镍层（16）和接合层（17）组成的保持层，或钎料层（18），保持超磨料颗粒（11）并将其固定到基底（20）上。在从保持层（16,17; 18）露出的超级磨料颗粒（11）的平坦表面（19）上形成槽（12）或孔（14）。保持层（16,17; 18）在基体（20）上形成有保持和固定超磨料颗粒（11）以使颗粒的表面部分露出的部分。通过用激光束（50）照射从保持层（16,17; 18）暴露的超级磨料颗粒（11）的表面，形成凹槽（12）或孔（14）。可以通过在超级磨料颗粒（11）的表面上形成凹槽（12）或孔（14）来实现高精度的工作。

8. 发明授权

US5685442A Package containers rack frame 失效
标题翻译：包装容器架子架
公开(公告)号：US5685442A
公开(公告)日：1997-11-11
申请号：US426737
申请日：1995-04-21
申请人： Shuji Yoshino , Seiji Hirano , Yukio Shimizu
发明人： Shuji Yoshino , Seiji Hirano , Yukio Shimizu
IPC分类号： A47B57/36 , A47B43/00 , A47F5/13 , B25H3/04 , B62B3/00 , B62B3/02 , B65G1/14 , A47F5/00
CPC分类号： A47F5/137 , A47B43/00 , B62B3/006 , B62B3/025
摘要： A package containers rack frame for storing, transferring and displaying relative light-weight packages. The rack frame is constructed of a pair of side frames and a plurality of support bases which are removable from the side frames. The support bases are engaged into sockets on the side frame without disassembling of the side frames. The side frames have folding elements that are for controlling the distance between the side frames, which are folding and/or unfolding. The frame members of side frames has an adjusting member for adjusting the distance between the side frames, which thereby permits use of different width or height dimension for the containers. The support base has upward curved projections at both ends thereof for restricting in lateral movement of the containers.
摘要翻译：用于存储，传输和显示相对轻质包装的包装容器架架。机架框架由一对侧框架和可从侧框架移除的多个支撑底座构成。支撑基座接合在侧框架上的插座中，而不会拆卸侧框架。侧框架具有用于控制侧框架之间的距离的折叠元件，所述侧框架是折叠和/或展开的。侧框的框架构件具有用于调节侧框架之间的距离的调节构件，从而允许对容器使用不同的宽度或高度尺寸。支撑基座的两端具有向上弯曲的突起，用于限制容器的横向移动。

9. 发明授权

US4456652A Electrically conductive adhesive tape 失效
标题翻译：导电胶带
公开(公告)号：US4456652A
公开(公告)日：1984-06-26
申请号：US469476
申请日：1983-02-24
申请人： Toshiharu Konishi , Zenzo Honda , Yutaka Hori , Yukio Shimizu , Hideyuki Okada
发明人： Toshiharu Konishi , Zenzo Honda , Yutaka Hori , Yukio Shimizu , Hideyuki Okada
IPC分类号： H01B5/14 , C09J7/02 , H01B5/02 , H01B7/08 , H05K3/10 , H05K3/38 , B32B3/00
CPC分类号： H05K3/103 , C09J7/026 , C09J7/0292 , H01B5/02 , H01B7/0815 , H05K2201/1028 , H05K2203/0278 , H05K3/386 , Y10S428/906 , Y10T428/24322 , Y10T428/24331 , Y10T428/24628 , Y10T428/2804
摘要： An electrically conductive adhesive tape comprising a self-supporting electrically conductive tape support and a pressure-sensitive adhesive layer provided on at least one surface of the tape support, wherein electrically conductive portions which extend through the adhesive layer and have a top end portion slightly covering the surface of the adhesive layer are provided on the side of the adhesive layer of the tape at desired intervals.
摘要翻译：一种导电胶带，其包括自支撑导电带支撑体和设置在带支撑体的至少一个表面上的压敏粘合剂层，其中导电部分延伸穿过粘合剂层并且具有稍微覆盖的顶端部分粘合剂层的表面以期望的间隔设置在带的粘合剂层的侧面上。

10. 发明授权

US09207477B2 Display module and display device 有权
标题翻译：显示模块和显示设备
公开(公告)号：US09207477B2
公开(公告)日：2015-12-08
申请号：US14113886
申请日：2012-04-23
申请人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号： G02F1/1333 , G02F1/1345 , F21V8/00
CPC分类号： G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译：本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到第一板3和第二板4.电路构件2形成在基膜5上。

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