会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Micromechanical acceleration or coriolis rotation-rate sensor
    • 微机械加速度或科里奥利旋转速率传感器
    • US06062082A
    • 2000-05-16
    • US913598
    • 1997-09-18
    • Gero GuentherKarsten FunkFranz LaermerAndrea Schilp
    • Gero GuentherKarsten FunkFranz LaermerAndrea Schilp
    • G01C19/5712G01P15/14G01P15/08G01P9/04
    • G01C19/5712
    • An acceleration sensor, particularly a Coriolis rotation-rate sensor, having a swinging structure that is movably suspended on a substrate (base) and can be deflected due to an acceleration effect, the sensor further having an arrangement for generating a planar swinging movement of the swinging structure, particularly a rotational swinging movement, and an evaluating arrangement for detecting a deflection of the swinging structure that is stipulated by acceleration, particularly for detecting a Coriolis acceleration. The swinging structure (12) is rotatably suspended so as to perform a planar swinging movement, and should perform a planar, rotational swinging movement.
    • PCT No.PCT / DE96 / 00248 Sec。 371日期:1997年9月18日 102(e)1997年9月18日PCT PCT 1996年2月17日PCT公布。 出版物WO97 / 02467 日期1997年1月23日具有摆动结构的加速度传感器,特别是科里奥利旋转速率传感器,其可移动地悬挂在基板(基座)上并且可由于加速效应而偏转,该传感器还具有用于产生 摆动结构的平面摆动运动,特别是旋转摆动运动,以及用于检测由加速度规定的摆动结构的偏转的评估装置,特别是用于检测科里奥利加速度。 摆动结构(12)可旋转地悬挂以便进行平面摆动,并且应该进行平面旋转摆动。
    • 7. 发明授权
    • Plasma etching installation
    • 等离子刻蚀安装
    • US06531031B1
    • 2003-03-11
    • US09623734
    • 2000-11-22
    • Volker BeckerFranz LaermerAndrea SchilpThomas Beck
    • Volker BeckerFranz LaermerAndrea SchilpThomas Beck
    • H01L2100
    • H01J37/321
    • A plasma processing system for etching a substrate using a highly dense plasma in a reactor. An ICP coil having a first coil end and a second coil end generating a high-frequency electromagnetic alternating field in the reactor which acts on a reactive gas and, as an inductively coupled plasma source, produces the highly dense plasma from reactive particles and ions. The two coil ends each communicate via a feed point with a high-frequency infeed, which applies in each case a high-frequency a.c. voltage of the same frequency to the first coil end and to the second coil end (21, 21′). The two high-frequency a.c. voltages applied at the two coil ends are connected to a symmetrical, capacitive network via a &lgr;2 -delay line linking the first feed point and the second feed point and are, at least nearly in phase opposition to one another, and have at least nearly the same amplitudes.
    • 一种用于在反应器中使用高密度等离子体蚀刻衬底的等离子体处理系统。 具有第一线圈端和第二线圈端的ICP线圈,其在反应器中产生作用于反应气体的高频电磁交变场,并且作为电感耦合等离子体源,从反应性粒子和离子产生高密度等离子体。 两个线圈端各自通过馈电点与高频电源进行通信,每种情况都适用于高频电源。 相同频率的电压到第一线圈端和第二线圈端(21,21')。 两个高频a.c. 施加在两个线圈端处的电压通过连接第一馈电点和第二馈电点的lambd2 - 线路连接到对称的电容网络,并且至少几乎相互相反地并且具有至少接近于 相同的幅度。
    • 8. 发明授权
    • Method of anisotropically etching silicon
    • 各向异性蚀刻硅的方法
    • US5501893A
    • 1996-03-26
    • US284490
    • 1994-08-05
    • Franz LaermerAndrea Schilp
    • Franz LaermerAndrea Schilp
    • H01L21/302B81C1/00H01L21/3065H01L21/308C25F3/12B44C1/22
    • H01L21/3085B81C1/00619H01L21/3065H01L21/30655B81C2201/0112Y10T428/24521
    • A method of anisotropic plasma etching of silicon to provide laterally defined recess structures therein through an etching mask employing a plasma, the method including anisotropic plasma etching in an etching step a surface of the silicon by contact with a reactive etching gas to removed material from the surface of the silicon and provide exposed surfaces; polymerizing in a polymerizing step at least one polymer former contained in the plasma onto the surface of the silicon during which the surfaces that were exposed in a preceding etching step are covered by a polymer layer thereby forming a temporary etching stop; and alternatingly repeating the etching step and the polymerizing step. The method provides a high mask selectivity simultaneous with a very high anisotropy of the etched structures.
    • PCT No.PCT / DE93 / 01129 Sec。 371日期:1994年8月5日 102(e)日期1994年8月5日PCT提交1993年11月27日PCT公布。 出版物WO94 / 14187 日期:1994年6月23日。一种通过使用等离子体的蚀刻掩模在其中提供横向限定的凹陷结构的硅的各向异性等离子体蚀刻的方法,所述方法包括在蚀刻步骤中的各向异性等离子体蚀刻,所述硅的表面通过与反应性 蚀刻气体以从硅表面去除材料并提供暴露的表面; 在聚合步骤中将包含在等离子体中的至少一种聚合物前体聚合到硅的表面上,在该表面处,在前面的蚀刻步骤中暴露的表面被聚合物层覆盖,从而形成临时蚀刻停止; 并交替重复蚀刻步骤和聚合步骤。 该方法与蚀刻结构的非常高的各向异性同时提供高掩模选择性。
    • 9. 发明授权
    • Methods for plasma etching of silicon
    • 硅等离子体蚀刻方法
    • US07166536B1
    • 2007-01-23
    • US09720761
    • 2000-03-16
    • Franz LaermerAndrea SchilpBernhard Elsner
    • Franz LaermerAndrea SchilpBernhard Elsner
    • H01L21/302
    • H01L21/3065Y02C20/30Y02P70/605
    • A method of plasma etching, in particular of anisotropic plasma etching, of laterally defined structures in a silicon substrate, using a process gas, includes having at least one passivating material precipitated on the side walls of the laterally defined structures at least from time to time prior to and/or during etching. In an exemplary method, at least one of the compounds selected from the group ClF3, BrF3, or IF5 is added to the process gas as a fluorine-delivering etching gas. In another exemplary method, NF3 is added to the process gas, at least from time to time, as an additive consuming the passivating material. Finally, in another exemplary method, a light and easily ionizable gas, in particular H2, He, or Ne, is added, at least from time to time, to the process gas. The three exemplary methods may be combined.
    • 使用工艺气体的硅衬底中的横向限定结构的等离子体蚀刻(特别是各向异性等离子体蚀刻)的方法至少包括至少一次在横向限定的结构的侧壁上析出的钝化材料 在蚀刻之前和/或期间。 在示例性方法中,将至少一种选自ClF 3 3,BrF 3或IF 5的化合物加入到该方法 气体作为输送氧气的蚀刻气体。 在另一示例性方法中,至少不时地将NF 3 N作为消耗钝化材料的添加剂加入到工艺气体中。 最后,在另一示例性方法中,至少不时地向工艺气体添加轻质且易于电离的气体,特别是H 2,He或Ne。 可以组合三种示例性方法。
    • 10. 发明授权
    • DEVICE AND METHOD FOR THE HIGH-FREQUENCY ETCHING OF A SUBSTRATE USING A PLASMA ETCHING INSTALLATION AND DEVICE AND METHOD FOR IGNITING A PLASMA AND FOR PULSING THE PLASMA OUT PUT OR ADJUSTING THE SAME UPWARDS
    • 使用等离子体蚀刻安装的基板的高频蚀刻的装置和方法以及用于点燃等离子体并用于脉冲等离子体输出或调整相同UPWARDS的方法
    • US06720273B1
    • 2004-04-13
    • US09763138
    • 2001-04-20
    • Volker BeckerFranz LaermerAndrea SchilpThomas Beck
    • Volker BeckerFranz LaermerAndrea SchilpThomas Beck
    • H01L213065
    • H01J37/32174C30B33/12H01J37/32082H01L21/3065H01L21/30655H01L21/3085H01L21/3086
    • A device and a method capable of being carried out therewith for, preferably, anisotropically etching a substrate (10), in particular, a patterned silicon body, with the assistance of a plasma (14), is proposed. In the process, the plasma (14) is produced by a plasma source (13) to which a high-frequency generator (17) is connected for applying a high-frequency power. Moreover, this high-frequency generator is in communication with a first means which periodically changes the high-frequency power applied to the plasma source (13). Besides, provision is preferably made for a second means which adapts the output impedance of the high-frequency generator (17) to the prevailing impedance of the plasma source (13) which changes as a function of the high-frequency power. The proposed anisotropic etching method is carried out in separate and alternating etching and polymerization steps, a higher high-frequency power of up to 5000 watts being, at least temporarily, applied to the plasma source (13) during the etching steps than during the deposition steps. The proposed device is also suitable for igniting a plasma (14) and for adjusting upward or pulsing a plasma power from a starting value to up to 5000 watts.
    • 提出了一种借助于等离子体(14)能够进行优选地各向异性地蚀刻衬底(10)特别是图案化硅体的装置和方法。 在该过程中,等离子体(14)由连接有高频发生器(17)的等离子体源(13)产生,以施加高频电力。 此外,该高频发生器与周期性地改变施加到等离子体源(13)的高频功率的第一装置通信。 此外,优选地对于将高频发生器(17)的输出阻抗适配为等离子体源(13)的主要阻抗(其随高频功率变化而变化)的第二装置进行设置。 所提出的各向异性蚀刻方法在分离和交替的蚀刻和聚合步骤中进行,在蚀刻步骤期间至少暂时施加高达5000瓦特的高频功率至等离子体源(13)比在沉积期间更高 脚步。 所提出的装置还适用于点燃等离子体(14)并且用于将等离子体功率从起始值向上调节或脉冲至高达5000瓦特。