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    • 2. 发明专利
    • Method of setting reference for height of substrate
    • 设置基板高度的参考方法
    • JP2005268256A
    • 2005-09-29
    • JP2004074073
    • 2004-03-16
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • TAKENAKA KENICHIFUJII TAKAHISAKANEMATSU KOICHIYOKOMORI TADASHI
    • H05K13/08H05K3/00
    • PROBLEM TO BE SOLVED: To solve the problem that, as a method of setting a reference point for measuring height in testing a printed board, there is a method wherein image recognition of the printed board is carried out to extract a conductor pattern, however, this method requires a board which is actually mounted with components and necessary data is prepared just before starting mass-production. SOLUTION: The method of setting the reference point for measuring height includes a means 6 of setting a region within a conductor foil pattern 3 as a candidate for the height measuring reference point from CAD data including information 1 on the component shape, information 2 on the component arrangements, conductor foil pattern 3, silk characters 4, information 5 on the land arrangements; a means 7 of setting the components determined from the information 1 and 2 and shadow regions of these components and the regions where the silk characters 4, and the lands 5 are arranged as a non-candidate for the height measuring reference point; and a means 8 of automatically setting the necessary number of height measuring reference points for each component from the regions selected by the means 6 and 7. Consequently, board height reference point data can be automatically prepared. Since the board height reference point is prepared in the designing stage of the printed board, very precise data can be prepared in a earlier stage. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题为了解决作为设置用于测试印刷电路板的高度的基准点的方法的方法,存在执行印刷电路板的图像识别以提取导体图案的方法 然而,该方法需要一个实际安装有组件的板,并且在开始批量生产之前准备必要的数据。 < P>解决方案:设置测量高度的参考点的方法包括:设置导体箔片3内的区域作为高度测量参考点的候选的装置6,该CAD数据包括关于部件形状的信息1,信息 2组件布置,导体箔图案3,丝字4,信息5上的土地安排; 设置从信息1和2确定的部件和这些部件的阴影区域以及丝绸字符4和焊盘5被布置为用于高度测量参考点的非候选区域的装置7; 以及用于从由装置6和7选择的区域自动设置每个部件所需数量的高度测量参考点的装置8.因此,可以自动准备板高度参考点数据。 由于在印刷电路板的设计阶段准备了电路板高度参考点,因此可以在较早的阶段准备非常精确的数据。 版权所有(C)2005,JPO&NCIPI
    • 3. 发明专利
    • Production information system
    • 生产信息系统
    • JP2002366613A
    • 2002-12-20
    • JP2001171299
    • 2001-06-06
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • MORITA KEITAKANEMATSU KOICHIFUJIWARA HIROAKIYOKOMORI TADASHINAKADA MIKIYA
    • G05B19/418G06Q50/00G06Q50/04H05K13/04G06F17/60
    • Y02P90/30
    • PROBLEM TO BE SOLVED: To provide a production information system starting production in an early stage in the case of newly starting the production of a circuit board.
      SOLUTION: The control part of each production device acquires an information table from a central management device 151 and rearranges information included in the information table in the descending order of a rate. Then, one piece of the information is read from the information table, whether or not it is the information matching with or similar to a condition to perform the production processing of each circuit board is judged and the read information is set inside as the condition. Then, the production device performs the production processing according to the set condition. The control part compares a result obtained by changing the condition in such a manner and the result before changing the condition, and when the result declines, reads and sets the next information.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:在新开始生产电路板的情况下,提供在早期开始生产的生产信息系统。 解决方案:每个生产设备的控制部分从中央管理设备151获取信息表,并按比例的降序重新排列信息表中包含的信息。 然后,从信息表中读取一条信息,判断是否与执行每个电路板的生产处理的条件匹配或类似的信息,并将读取的信息设置在内部作为条件。 然后,生产装置根据设定条件进行生产处理。 控制部分比较在改变条件之前以这种方式改变条件和结果获得的结果,并且当结果下降时,读取和设置下一个信息。
    • 7. 发明专利
    • Operation analyzer, operation analyzing system, operation analyzing program and method for analyzing operation
    • 操作分析仪,操作分析系统,操作分析程序和分析操作方法
    • JP2005167220A
    • 2005-06-23
    • JP2004323385
    • 2004-11-08
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • YOKOMORI TADASHIKANEMATSU KOICHIOKAMURA HIROSHIHANADA KEIJI
    • H05K13/04
    • PROBLEM TO BE SOLVED: To provide an operation analyzer for maintaining a high production efficiency of an overall line by monitoring an operating rate of a line mounting cycle or a line such that they does not reduce at a part mounting line and analyzing a cause of the reduction to remove the cause. SOLUTION: A part mounting line of each mounting factory is connected to the operation analyzer 1 via an internet 3. Cycle information and facility information are collected from the line in each factory, stored in facility operation information. As a result of analyzing the cycle information, when a cycle loss is discovered in the mounting operation of the part mounting mechanism, NC data for operating the mechanism is optimized to reduce the cycle loss. As a result of analyzing the facility information 211, when a cause for reducing the operating state is discovered, a service for eliminating the cause is fed back to the part mounting line. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种操作分析器,通过监视线路安装周期的操作速率或线,使得它们在零件安装线上不减少并且分析一个线路,从而保持整个线路的高生产效率 减少原因的原因。

      解决方案:每个安装工厂的零件安装线通过互联网连接到操作分析器1.循环信息和设施信息从每个工厂的线路收集,存储在设施操作信息中。 作为分析循环信息的结果,当在部件安装机构的安装操作中发现循环损失时,优化用于操作机构的NC数据以减少循环损失。 作为分析设施信息211的结果,当发现减少操作状态的原因时,将用于消除原因的服务反馈到部件安装线。 版权所有(C)2005,JPO&NCIPI

    • 9. 发明专利
    • Packaging quality factor analysis method
    • 包装质量因子分析方法
    • JP2005286015A
    • 2005-10-13
    • JP2004096295
    • 2004-03-29
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • HISATAKE YOICHIKANEMATSU KOICHISHIMODA RIICHIYOKOMORI TADASHI
    • H05K3/34H05K13/08
    • PROBLEM TO BE SOLVED: To analyze various failure factors by performing comparative analysis for the result of a preceding process in a packaging process and to stabilize quality by restraining quality defect. SOLUTION: The method has a function 2 for narrowing down a process which is considered as a factor based on repair result which is quality final information in the packaging process, a function 3 for narrowing down a process and a failure factor by comparing to the inspection result of the preceding process based on a component name and a lead number and a function 4 for narrowing down the failure factor the process based on inspection measurement result. Since quality defect can be restrained by investigating the true factor of generated failures, quality is stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:通过对包装过程中的前述处理的结果进行比较分析并通过抑制质量缺陷来稳定质量来分析各种故障因素。 解决方案:该方法具有功能2,用于缩小被认为是基于作为包装过程中的质量最终信息的修复结果的因子的过程,用于缩小处理的功能3和通过比较的故障因子 基于组件名称和引线号的前述处理的检查结果以及基于检查测量结果来缩小故障因子的功能4。 由于通过调查产生故障的真实因素可以抑制质量缺陷,质量稳定。 版权所有(C)2006,JPO&NCIPI
    • 10. 发明专利
    • Circuit board, circuit board manufacturing method, electronic component packaging system
    • 电路板电路板制造方法,电子元器件包装系统
    • JP2005243796A
    • 2005-09-08
    • JP2004049670
    • 2004-02-25
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KANEMATSU KOICHIYOKOMORI TADASHI
    • H05K13/04H05K3/34H05K3/46H05K13/08
    • PROBLEM TO BE SOLVED: To obtain information stored in a storage element with no contact, and to enlarge the area of a region on a base body available for packaging electronic components.
      SOLUTION: The circuit board 1 comprises a base body 11 formed with a multilayer wiring pattern, a storage element 13 and a plurality of electronic components 12 packaged on the base body 11, and a antenna 14 electrically connected to the storage element 13 and used for reading the information stored in the storage element 13. On the circuit board 1, information stored in the storage element 13 can be obtained via the antenna 14 without contact. The storage element 13 used in the base body 11 is smaller than a bar code, or the like, and the antenna 14 is provided internally, thus making it possible to enlarge the area of the region on the base body 11 available for packaging electronic components 12. In the process of manufacturing the circuit board 1, the storage element 13 is packaged together with the electronic components 12, thus making it possible to simplify the process for packaging.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:获得存储在不接触的存储元件中的信息,并且扩大可用于包装电子部件的基体上的区域的面积。 解决方案:电路板1包括形成有多层布线图案的基体11,封装在基体11上的存储元件13和多个电子部件12以及与存储元件13电连接的天线14 并且用于读取存储在存储元件13中的信息。在电路板1上,可以经由天线14获得存储在存储元件13中的信息而不接触。 在基体11中使用的存储元件13小于条形码等,并且天线14设置在内部,从而可以扩大可用于包装电子部件的基体11上的区域的面积 在制造电路板1的过程中,存储元件13与电子部件12一起封装,从而可以简化封装工艺。 版权所有(C)2005,JPO&NCIPI