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1. 发明专利

JP2007110170A Method of mounting electronic components and apparatus thereof, and method of creating electronic component mounting data 有权
标题翻译：电子元件安装方法及其设备及其制造电子元器件安装数据的方法
公开(公告)号：JP2007110170A
公开(公告)日：2007-04-26
申请号：JP2007017959
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: In mounting an electronic component using cream solder printing, this method has a determining process for determining the size of the self-alignment effect based on a state of positional deviation between the positions of lands corresponding to an electronic component to be mounted and the printing position of the cream solder corresponding to the lands. In the determining process, it is determined that the self-alignment effect is large when the cream solder is printed on a position deviated from the center of a land, and it is determined that the self-alignment effect is small if the cream solder is printed so as to overflow from the land. When the self-alignment effect is large, the target mounting position of the electronic component is set using the cream solder printing positions as a reference, and if the self-alignment effect is small, the target mounting position is set using the land positions as a reference. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。解决方案：在使用膏状焊料印刷安装电子部件时，该方法具有确定步骤，用于基于与电子部件相对应的焊盘的位置之间的位置偏差的状态来确定自对准效果的大小并且奶油焊料的对应于焊盘的打印位置。在确定过程中，当将奶油焊料印刷在离开焊盘的中心的位置上时，确定自对准效果大，并且如果膏状焊料是如此，则确定自对准效果小打印，以便从土地溢出。当自对准效果大时，使用膏状焊料印刷位置作为基准来设定电子部件的目标安装位置，如果自对准效果小，则使用焊盘位置设定目标安装位置参考。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007110169A Method of mounting electronic components and apparatus thereof 有权
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110169A
公开(公告)日：2007-04-26
申请号：JP2007017958
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When a cream solder is printed on a circuit board having lands formed thereon to mount electronic components, the printing position of the cream solder on the circuit board is detected, the circuit board is divided into a plurality of blocks in mounting the electronic components using the cream solder printing position as a reference, positional deviation quantity between the positions of lands corresponding to an electronic component to be mounted in each block and the cream solder printing position for the lands is obtained in each block, and a target mounting position of each electronic component is set for each block based on each of obtained positional deviation quantities. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当在其上形成有焊盘的电路板上印刷膏状焊料以安装电子部件时，检测到焊膏在电路板上的打印位置，电路板被分成多个安装块使用膏状焊料印刷位置的电子部件作为基准，在每个块中获得在每个块中对应于要安装在每个块中的电子部件的焊盘的位置与焊盘的焊膏印刷位置之间的位置偏差量，基于获得的每个位置偏差量，为每个块设置每个电子部件的安装位置。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006261345A Part mounting head and part mounting apparatus employing the same 有权
标题翻译：部件安装头和安装部件安装设备
公开(公告)号：JP2006261345A
公开(公告)日：2006-09-28
申请号：JP2005075922
申请日：2005-03-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAENISHI YASUHIRO , YAZAWA TAKASHI , SHIMIZU NOBUE , AYUSAWA KATSUSHI , NISHIKAWA NOBORU , YAMAMOTO HIROKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a part mounting head capable of shortening a mounting time without increasing a part mounting machine in size, and a part mounting apparatus employing the same. SOLUTION: A first and second rotating head units 105a and 105b each have a plurality of suction nozzles 112 capable of rotatably moving and picking up parts 120 from a plurality of tape feeders 102 by the suction nozzles 112 and mount the parts on a substrate 104. In the head units, the suction nozzles 112 are arranged along a rotationally moving direction A of the suction nozzles 112 so as to draw a predetermined shape in a rotational surface including the rotationally moving direction A and a direction B of arrangement of the tape feeders 102, and the predetermined shape is a shape having a length in a direction parallel to the arrangement direction B shorter than a length in a direction perpendicular to the arrangement direction B. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够缩短安装时间而不增加部件安装机的尺寸的部件安装头以及使用其的部件安装装置。解决方案：第一和第二旋转头单元105a和105b各自具有多个吸嘴112，其能够通过吸嘴112可旋转地移动和从多个带式馈送器102拾取部件120并将部件安装在在头部单元中，吸嘴112沿着吸嘴112的旋转移动方向A布置，以便在包括旋转方向A和旋转方向A的布置方向B上的预定形状带式馈送器102，并且预定形状是在平行于布置方向B的方向上的长度比垂直于布置方向B的方向上的长度短的形状。（C）2006，JPO和NCIPI

4. 发明专利

JP2006088709A The screen printing method and screen printing apparatus 有权
标题翻译：屏幕打印方法和屏幕打印设备
公开(公告)号：JP2006088709A
公开(公告)日：2006-04-06
申请号：JP2005350079
申请日：2005-12-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANAKA TETSUYA , TAKAHASHI MASARU , INUKAI TSUTOMU , NISHIKAWA NOBORU
IPC分类号： B41F15/42 , B41F15/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To offer the method of screen printing and the screen printing apparatus which prevent printing paste stuck on the squeegee nozzle tips from creeping around to the back-side of the nozzle and from the poor printing performance by which the printing screen being dragged and torn at the opening of the screen thus causing poor printing on the printing base plate.
SOLUTION: When the printing process begins where the apparatus drops the squeegee 7 and the squeegee 8 from the predetermined stand-by position above the screen plate 4 down to the position to contact the screen plate 4, the squeegee 7 and the squeegee 8 are to move diagonally downward and contact the screen plate 4 in the direction opposite to the printing direction after the squeegees contact the screen plate 4. By this printing method, the apparatus diminishes the poor printing performances on the printing base plate 1 caused by the excessive printing paste 6 which creeps around to the backside of the squeegee 7 and squeegee 8.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供丝网印刷方法和丝网印刷设备，其防止粘贴在刮刀喷嘴尖端上的印刷浆料沿着喷嘴的背面爬行，并且由于印刷性能差，打印屏幕在屏幕的开口处被拖曳并撕裂，从而导致打印基板上的打印不良。解决方案：当打印过程开始时，设备将刮板7和刮板8从筛板4上方的预定待机位置下降到与筛板4接触的位置，刮板7和刮板 8是在刮板接触筛板4之后，沿着与打印方向相反的方向向斜下方移动并与屏板4接触。通过这种印刷方法，该设备减少了由印刷基板1引起的差的印刷性能过多的印刷浆料6会爬到刮板7和刮板8的背面。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004025644A Cream solder printing process and device 审中-公开
公开(公告)号：JP2004025644A
公开(公告)日：2004-01-29
申请号：JP2002185851
申请日：2002-06-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HATTORI YOSHIYUKI , NAKAHIRA HITOSHI , NISHIKAWA NOBORU
IPC分类号： B41F15/40 , B41F15/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a cream solder printing process which keeps the viscosity of a cream solder at a specified level despite the long waiting period of a cream solder printing device, and a device used for this process.
SOLUTION: This cream solder printing process undergoes the following steps: A circuit substrate is carried to a table part for retaining the circuit substrate horizontally and carried out, then the table part is pressed to a spot under a screen with an opening part which matches a pattern of the electrode part of the circuit substrate so that the opening part coincides with the pattern, and the cream solder is printed on the electrode part of the circuit substrate after filling the opening part with the cream solder by moving a printing head over a screen. When the cream solder is not printed for a specified period, the printing head is automatically actuated in a dummy filling fashion under the same conditions as when the circuit substrate is filled with the cream solder. After that, the viscosity of the cream solder is kept at the same level by stirring the cream solder.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2007173855A Method of mounting electronic component, and device 审中-公开
标题翻译：安装电子元件的方法和装置
公开(公告)号：JP2007173855A
公开(公告)日：2007-07-05
申请号：JP2007017957
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting electronic components and a device which allow a self-alignment effect to be effectively utilized, even when the spacing for mounting the electronic components is narrow. SOLUTION: When cream solders 16a, 16b are printed on a circuit board 12 formed with lands 14a, 14b and an electronic component 18 is mounted, the printing positions of the cream solders 16a, 16b of the circuit board 12 are detected with respect to the printing positions of the cream solders 16a, 16b, based on an amount of position shift length ΔL between land positions corresponding to the electronic component 18 to be mounted and the printing positions of the cream solder 16a, 16b to the lands 14a, 14b, the target mounting positions of the respective electronic components 18 are individually set up, respectively, and the electronic components 18 are mounted. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使当安装电子部件的间隔窄时，提供一种用于安装电子部件的方法和允许有效利用自对准效果的装置。
解决方案：当奶油焊料16a，16b印刷在形成有焊盘14a，14b和电子部件18的电路板12上时，电路板12的奶油焊膏16a，16b的打印位置被检测到相对于奶油焊料16a，16b的打印位置，基于与要安装的电子部件18相对应的焊盘位置与焊膏16a，16b到焊盘14a，16b的打印位置之间的位置移动长度ΔL的量，如图14b所示，分别设置各个电子部件18的目标安装位置，安装电子部件18。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006120890A Component mounting apparatus, component mounting method, and component suction method 有权
标题翻译：组件安装设备，组件安装方法和组件连接方法
公开(公告)号：JP2006120890A
公开(公告)日：2006-05-11
申请号：JP2004307800
申请日：2004-10-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHIDA HIDEKI , ENDO SHINICHIRO , KAKITA NOBUYUKI , ARAI RISA , NISHIKAWA NOBORU
IPC分类号： H05K13/02 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component suction method for dispensing with miniaturization in the component suction surface of a nozzle for sucking a component accordingly even if the size of the component to be mounted is compact and for sucking the component reliably. SOLUTION: The component suction nozzle 1, having the component suction surface 6 with a dimension that is longer than the width of the opening at least in one direction of the opening of a component storage section 23, is used. When sucking the component, the component suction surface 6 is pushed into the region of the component storage section 23. In this case, the component suction surface 6 presses the periphery of the component storage section 23, deforms it, and brings it into contact with a component 10, or brings it closer so that it almost comes into contact with the component 10. When negative pressure operates on the component suction nozzle 1 in this state, atmospheric air is introduced from the periphery of the deformed component storage section 23, and a component 1 can be sucked reliably along with suction effect by the component suction surface 6 at a position close to the component 1. An enlargement section 24 is provided at the upper portion of the component storage section 23 and may be open to a base tape 21. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使要安装的部件的尺寸紧凑并且可靠地吸入部件，也提供用于分配用于吸入部件的喷嘴的部件吸附表面中的小型化的部件抽吸方法。解决方案：使用具有至少在部件存放部23的开口的一个方向上具有比开口宽度大的尺寸的部件吸附面6的部件吸嘴1。当吸入部件时，部件吸附面6被推入部件收纳部23的区域。在这种情况下，部件吸附面6按压部件收容部23的周围，使其变形，使其与部件10，或使其更接近，使其几乎与部件10接触。当在该状态下对部件吸嘴1施加负压时，大气从变形部件收容部23的周边引入，在靠近部件1的位置处，部件1能够通过部件吸附面6的吸引效果可靠地吸入。在部件收纳部23的上部设置有放大部24，并且可以向基带 21.版权所有（C）2006年，JPO＆NCIPI

8. 发明专利

JP2007110172A Method of mounting electronic components and apparatus thereof 有权
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110172A
公开(公告)日：2007-04-26
申请号：JP2007017961
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When cream solder is printed on a circuit board having lands formed thereon to mount an electronic component, this method has a printing position detecting process of detecting printing positions of the cream solder of the circuit board, and a mounting process of mounting electronic component while using the printing positions of the cream solder as a reference. When the quantity of positional deviation between the land positions corresponding to the electronic component to be mounted and the printing position of cream solder exceeds a predetermined quantity of deviation, the quantity of deviation of a rotational direction is obtained in addition to the quantity of deviation of a horizontal direction, and the target mounting position of the electronic component and the target rotation angle thereof is obtained from the quantities of deviation of the horizontal and rotational directions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当将膏状焊料印刷在具有形成在其上的焊盘的电路板上以安装电子部件时，该方法具有检测电路板的膏状焊料的印刷位置的印刷位置检测处理和安装工艺在使用奶油焊料的打印位置作为参考的同时安装电子部件。当对应于要安装的电子部件的焊盘位置与膏状焊料的打印位置之间的位置偏移量超过预定的偏差量时，除了偏移量之外还获得旋转方向的偏差量水平方向和电子部件的目标安装位置及其目标旋转角度从水平方向和旋转方向的偏差量获得。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007110171A Method of mounting electronic components and apparatus thereof 审中-公开
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110171A
公开(公告)日：2007-04-26
申请号：JP2007017960
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When cream solder is printed on a circuit board having lands formed thereon to mount an electronic component, this method has a printing position detecting process of detecting printing positions of the cream solder of the circuit board, and a mounting process of mounting the electronic component while using the printing positions of the cream solder as a reference. In this method, if the electronic component interferes another electronic component adjacent thereto on the circuit board in mounting the electronic component, the mounting operation of this electronic component is not executed or the target mounting position of the electronic component to be mounted is changed to a position of avoiding interference from the cream solder printing positions to the land positions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当将膏状焊料印刷在具有形成在其上的焊盘的电路板上以安装电子部件时，该方法具有检测电路板的膏状焊料的印刷位置的印刷位置检测处理和安装工艺在使用奶油焊料的打印位置作为参考的情况下安装电子部件。在该方法中，如果在安装电子部件时电子部件与电路基板相邻的电子部件干涉，则不执行该电子部件的安装动作，或者将要安装的电子部件的目标安装位置变更为避免从奶油焊锡印刷位置到地面位置的干扰的位置。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2004136180A Method and apparatus for applying viscous material 有权
公开(公告)号：JP2004136180A
公开(公告)日：2004-05-13
申请号：JP2002301833
申请日：2002-10-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KINOU TOSHIYUKI , OGATA HIROSHI , KAKISHIMA NOBUYUKI , NISHIKAWA NOBORU , HAMA TOMOAKI
IPC分类号： B05D1/26 , B05C5/00 , B05C11/10 , B05D3/00 , B05D7/24
摘要： PROBLEM TO BE SOLVED: To provide a method for applying a viscous material for applying the viscous material with high-quality, and an apparatus therefor.
SOLUTION: This apparatus is provided with a discharge unit 101 and a control unit 180. When a first application action (S103) to apply the viscous material 109 linearly onto a circuit board 121 while discharging the material 109 continuously from a nozzle 106 is completed nearly, the amount of the material 109 to be applied is adjusted (S105). Since the applied amount of the material 109 is not increased when the action (S103) is completed nearly, the material 109 can be applied uniformly and the coating film of the quality higher than usual can be obtained.
COPYRIGHT: (C)2004,JPO

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