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1. 发明专利

JP2008211074A Detector, attaching position determining device and attaching position determining method 有权
标题翻译：检测器，连接位置确定装置和连接位置确定方法
公开(公告)号：JP2008211074A
公开(公告)日：2008-09-11
申请号：JP2007047850
申请日：2007-02-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMURA TATSUO , KURIBAYASHI TAKESHI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a detector having an attaching position variable depending on a changeable opening region as a component feeding portion of a component mounter. SOLUTION: The detector is provided with: an attaching substrate 211 attachable/detachable with a feeder attaching portions 116 to which a feeder 114 for feeding the component to a component mounter 100 for mounting the component to a substrate is attached; sensors 210a, 210b for detecting the entering of foreign matters into an opening region 201 of a component feeding portion 115 having the plurality of feeder attaching portions 116 juxtaposed thereon where the feeder 114 is not attached; and a transmission means 223 for transmitting the information detected by the sensors 210a, 210b to the component mounter 100. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有根据作为部件安装机的部件供给部分的可变开口区域可变的安装位置的检测器。检测器设置有安装基板211，该安装基板211可与馈送器连接部分116连接/分离，馈送器114用于将部件馈送到用于将部件安装到基板的部件安装器100; 传感器210a，210b，用于检测异物进入具有多个馈送器连接部分116的部件供给部分115的开口区域201，该馈送器连接部分116并置在其上未连接馈线114的位置; 以及发送装置223，用于将由传感器210a，210b检测到的信息发送到组件安装器100.版权所有：（C）2008，JPO＆INPIT

2. 发明专利

JP2007194674A Component mounting method and apparatus therefor, and recording medium 有权
标题翻译：组件安装方法及其设备和记录介质
公开(公告)号：JP2007194674A
公开(公告)日：2007-08-02
申请号：JP2007117086
申请日：2007-04-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMOTO HIROKI , IMAFUKU SHIGEKI , IZUMIDA KEIZO , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a component mounting method and a component mounting apparatus for avoiding slip-off of a component held in a component holder in an unusual posture such as upright suction from the component holder during carrying. SOLUTION: When a detector detects that a component is held in the component holder in a state where it cannot be mounted such as upright suction, a carrying device is controlled so that the moving speed of the component holder can be relatively decelerated compared to the moving speed in usual mounting operation to carry the component to a component recovering device, and then, the component is recovered. The deceleration of moving speed is executed by decelerating the rotating speed of an index in a rotary component mounter, and by decelerating the driving speed of an X-axis and a Y-axis of an XY robot in an XY-axis type component mounter. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种部件安装方法和部件安装装置，用于避免在携带期间从部件保持器处于诸如竖直抽吸的异常姿势中保持在部件保持器中的部件的脱落。
解决方案：当检测器检测到部件保持器处于不能安装的状态（例如立式抽吸）时，控制承载装置，使得部件保持器的移动速度可以相对减速比较在通常的安装操作中的移动速度将组件携带到组件恢复装置，然后，恢复组件。移动速度的减速通过减速旋转部件安装器中的折射率的旋转速度，并且通过使XY轴型组件安装机中的XY机器人的X轴和Y轴的驱动速度减速来执行。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007110172A Method of mounting electronic components and apparatus thereof 有权
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110172A
公开(公告)日：2007-04-26
申请号：JP2007017961
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When cream solder is printed on a circuit board having lands formed thereon to mount an electronic component, this method has a printing position detecting process of detecting printing positions of the cream solder of the circuit board, and a mounting process of mounting electronic component while using the printing positions of the cream solder as a reference. When the quantity of positional deviation between the land positions corresponding to the electronic component to be mounted and the printing position of cream solder exceeds a predetermined quantity of deviation, the quantity of deviation of a rotational direction is obtained in addition to the quantity of deviation of a horizontal direction, and the target mounting position of the electronic component and the target rotation angle thereof is obtained from the quantities of deviation of the horizontal and rotational directions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当将膏状焊料印刷在具有形成在其上的焊盘的电路板上以安装电子部件时，该方法具有检测电路板的膏状焊料的印刷位置的印刷位置检测处理和安装工艺在使用奶油焊料的打印位置作为参考的同时安装电子部件。当对应于要安装的电子部件的焊盘位置与膏状焊料的打印位置之间的位置偏移量超过预定的偏差量时，除了偏移量之外还获得旋转方向的偏差量水平方向和电子部件的目标安装位置及其目标旋转角度从水平方向和旋转方向的偏差量获得。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007110171A Method of mounting electronic components and apparatus thereof 审中-公开
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110171A
公开(公告)日：2007-04-26
申请号：JP2007017960
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When cream solder is printed on a circuit board having lands formed thereon to mount an electronic component, this method has a printing position detecting process of detecting printing positions of the cream solder of the circuit board, and a mounting process of mounting the electronic component while using the printing positions of the cream solder as a reference. In this method, if the electronic component interferes another electronic component adjacent thereto on the circuit board in mounting the electronic component, the mounting operation of this electronic component is not executed or the target mounting position of the electronic component to be mounted is changed to a position of avoiding interference from the cream solder printing positions to the land positions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当将膏状焊料印刷在具有形成在其上的焊盘的电路板上以安装电子部件时，该方法具有检测电路板的膏状焊料的印刷位置的印刷位置检测处理和安装工艺在使用奶油焊料的打印位置作为参考的情况下安装电子部件。在该方法中，如果在安装电子部件时电子部件与电路基板相邻的电子部件干涉，则不执行该电子部件的安装动作，或者将要安装的电子部件的目标安装位置变更为避免从奶油焊锡印刷位置到地面位置的干扰的位置。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006237174A Component mounting method 有权
标题翻译：组件安装方法
公开(公告)号：JP2006237174A
公开(公告)日：2006-09-07
申请号：JP2005048022
申请日：2005-02-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KURIBAYASHI TAKESHI , MAENISHI YASUHIRO
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a component mounting method which improves productivity and stability of quality of a substrate with components mounted thereon. SOLUTION: The component mounting method comprises: a suction step S102 wherein a head 112 sucks a plurality of components; imaging step S104 wherein the plurality of components sucked by the head 112 are imaged; detection step S106 wherein the states of the components sucked by the head 112 are detected from the imaging results of the imaging step S104; mounting order determining step S110 wherein the order in which the components are to be mounted based on the detected states of the components is determined; and mounting step S112 wherein the head 112 is instructed to mount the components on the substrate 20 in the determined mounting order. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提高具有安装在其上的部件的基板的质量的生产率和稳定性的部件安装方法。解决方案：部件安装方法包括：吸头步骤S102，其中头112吸入多个部件; 成像步骤S104，其中由头部112吸引的多个部件被成像; 检测步骤S106，其中从成像步骤S104的成像结果检测由头部112吸收的分量的状态; 安装顺序确定步骤S110，其中基于检测到的部件的状态来确定要安装部件的顺序; 以及安装步骤S112，其中指示头112以确定的安装顺序将部件安装在基板20上。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004128518A Method and apparatus for optimizing arrayed data 审中-公开
公开(公告)号：JP2004128518A
公开(公告)日：2004-04-22
申请号：JP2003416355
申请日：2003-12-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KURIBAYASHI TAKESHI , YOSHIDA NORIAKI , KABESHITA AKIRA , TAKUBO KAZUYUKI , HIRAHARA MAKOTO , KOYAMA NOBUYUKI , OKA NATSUKI , YOSHIDA KUNIO
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for optimizing mounted data wherein optimization is carried out faster than conventional. SOLUTION: Mounted data candidates for reducing the size of mounted data are created from knowledge for candidate creation obtained by dividing the mounted data for performing the operation to be optimized into a plurality of pieces. Post-optimization data which meets optimizing conditions is selected from the mounted data candidates. Based on the post-optimization data, the mounted data is reduced in size, and thereby optimization is carried out. Therefore, the processes from the creation of mounted data candidates to the optimization are automatically implemented, and complicated optimization problems can be fast solved. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2008210981A Component mounter 审中-公开
标题翻译：组件安装
公开(公告)号：JP2008210981A
公开(公告)日：2008-09-11
申请号：JP2007045914
申请日：2007-02-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMURA TATSUO , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component mounter equipped with a detecting means having an attaching position variable depending on an opening region changing in accordance with production conditions. SOLUTION: The component mounter 100 for mounting a component to a substrate 20 is provided with: the opening regions 201a, 201b changing depending on the production conditions; and the detecting means 210 for detecting the entering of foreign matters into the opening regions 201a, 201b, and having an attaching position variable depending on the movement of the opening regions 201a, 201b. The opening region 201a is a free region where a feeder 114 for feeding components is not attached on a component feeding portion 115 in which a plurality of feeder attaching portions each having the feeder 114 are juxtaposed thereon. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种配备有检测装置的部件安装机，该检测装置具有根据根据生产条件改变的开口区域可变的安装位置。解决方案：用于将部件安装到基板20的部件安装器100设置有：根据生产条件而改变的开口区域201a，201b; 以及用于检测异物进入开口区域201a，201b并具有根据开口区域201a，201b的移动而变化的安装位置的检测装置210。开口区域201a是一个自由区域，其中用于供给部件的供料器114未附着在其上并入有多个供料器安装部分的部件供给部分115上。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2006100595A Component supply method 有权
标题翻译：组件供应方法
公开(公告)号：JP2006100595A
公开(公告)日：2006-04-13
申请号：JP2004285318
申请日：2004-09-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KURIBAYASHI TAKESHI , MAENISHI YASUHIRO
IPC分类号： H05K13/02 , G06K17/00
摘要： PROBLEM TO BE SOLVED: To provide a component supply method for improving usability by saving trouble required for setting components to a component mounting machine. SOLUTION: The component supply method for improving usability by saving trouble required for setting components to a component mounting machine includes a position-locating step S400 for locating the Z number of each component cassette 114; a reading step S402 for reading component information from an IC tag 426b attached to a reel 426 for supplying each component tape; retrieval steps S406-S412 for retrieving the Z number, where the component cassette 114 for holding master components or alternative components is set, based on each component information and each Z number; and a supply step S414 for taking out components from the component cassette 114 indicated by the Z number for supplying. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过节省将部件设置到部件安装机所需的麻烦来提高可用性的部件供给方法。解决方案：通过节省将部件设置到部件安装机所需的麻烦来提高可用性的部件供给方法包括：定位步骤S400，用于定位每个部件盒114的Z号; 读取步骤S402，用于从附接到用于提供每个部件带的卷轴426的IC标签426b读取部件信息; 用于检索Z号的检索步骤S406-S412，其中设置用于保持主组件或备用组件的组件盒114，其中每个组件信息和每个Z编号; 以及用于从用于供给的Z号表示的部件盒114中取出部件的供给步骤S414。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005142586A Parts mounting method and device 有权
标题翻译：零件安装方法和装置
公开(公告)号：JP2005142586A
公开(公告)日：2005-06-02
申请号：JP2005006990
申请日：2005-01-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAENISHI YASUHIRO , KURIBAYASHI TAKESHI , KAJIYAMA MASAYUKI , MAENISHI YASUTOMO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a parts mounting method which enables the feedforward control of each circuit board can be performed. SOLUTION: The parts mounting method employs a parts mounting device with respective units 21, 22 and 23 disposed from an upper stream of a flow of the circuit board 18 to downstream in order, which process the circuit board 18 in order to mount electronic parts on the circuit board. Information about makers, lots or manufacturing time of the parts which are mounted on each circuit board 18 in the respective units 21, 22 and 23 is memorized while being associated with each circuit board 18. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够执行每个电路板的前馈控制的部件安装方法。部件安装方法采用从电路板18的流的上游排列到下游的各单元21,22和23的部件安装装置，其处理电路板18以便安装电路板上的电子部件。关于安装在各个单元21,22和23中的每个电路板18上的部件的制造者，批量或制造时间的信息被存储在与每个电路板18相关联的同时。（C）2005年，JPO和NCIPI

10. 发明专利

JP2004070967A Component electronic catalog 有权
公开(公告)号：JP2004070967A
公开(公告)日：2004-03-04
申请号：JP2003294407
申请日：2003-08-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAENISHI YASUHIRO , KURIBAYASHI TAKESHI , NISHIDA YUKICHI , NAKAMURA NOBUYUKI , MASUDA SEI , TANAKA JUNJI
IPC分类号： G06F17/30 , G06Q30/02 , G06Q30/06 , G06Q50/00 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To provide a component electronic catalog which is used to retrieve component images as a component electronic catalog similar to the conventional one and is also used to automatically prepare mounting data about a component selected in this retrieval. SOLUTION: Image data IM and component text data B about various components are stored in a storage medium 12 so that the image data IM and the component text data B can be read out. A computer displays the both data IM and B on the same image for each of the same components so as to retrieve and select component images, which enables to prepare mounting data on the basis of component text data of a selected component. COPYRIGHT: (C)2004,JPO

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