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1. 发明申请

US20090259890A1 Method & apparatus for hardware fault management 审中-公开
标题翻译：硬件故障管理方法与装置
公开(公告)号：US20090259890A1
公开(公告)日：2009-10-15
申请号：US12082715
申请日：2008-04-14
申请人： Mats Lund , Luu Nguyen , Heidi Pickreign , Martin Belanger , Michael R. Mayhew , Scott Pradels
发明人： Mats Lund , Luu Nguyen , Heidi Pickreign , Martin Belanger , Michael R. Mayhew , Scott Pradels
IPC分类号： G06F11/22
CPC分类号： H04L41/069 , H04L43/0817
摘要： A hardware health evaluation module is associated with a hardware module or device and employs a linked list of error records to continually evaluate the state of the hardware module to determine whether or not it is currently operating with or without errors. In the event that the health evaluation module determines that the hardware module is not operating in an error free manner, it detects and stores, for a specified period of time, an indication of the error and associates this detected error or errors with one or more of the error records. The error records are designed to provide assistance in diagnosing the cause of a hardware error.
摘要翻译：硬件健康评估模块与硬件模块或设备相关联，并使用链接的错误记录列表来连续评估硬件模块的状态，以确定当前是否正在运行或不存在错误。在健康评估模块确定硬件模块不以无错误的方式运行的情况下，它在指定的时间段内检测并存储错误的指示并将该检测到的错误或错误与一个或多个的错误记录。错误记录旨在帮助诊断硬件错误的原因。

2. 发明申请

US20060253609A1 Determining address of closest edge server 有权
标题翻译：确定最近边缘服务器的地址
公开(公告)号：US20060253609A1
公开(公告)日：2006-11-09
申请号：US11120344
申请日：2005-05-03
申请人： Dmitry Andreev , Galina Grunin , Luu Nguyen , Gregory Vilshansky
发明人： Dmitry Andreev , Galina Grunin , Luu Nguyen , Gregory Vilshansky
IPC分类号： G06F15/16
CPC分类号： H04L29/12132 , H04L29/12066 , H04L61/1511 , H04L61/1552 , H04L67/28 , H04L67/2842
摘要： A method and system is presented for bypassing a local Domain Name Server (DNS) when using edge caching servers. Domain names of frequently used business applications that are known to rely upon edge servers, together with the corresponding authoritative DNSs, are listed in both local hosts file and user defined FSFD local configuration file fsfd.conf. When the client computer's browser attempts to resolve a domain name, a File System Filtering Driver (FSFD) in the client computer intercepts the browser's request. If the domain name which is being resolved is found in a local FSFD configuration file fsfd.conf, then the FSFD initiates a DNS request directly to the appropriate authoritative DNS whose IP address gets extracted from the fsfd.conf record, thus bypassing the local DNS. The authoritative DNS returns the IP address for an edge caching server that is topographically proximate to the client computer's browser.
摘要翻译：提出了一种方法和系统，用于在使用边缘缓存服务器时绕过本地域名服务器（DNS）。在本地主机文件和用户定义的FSFD本地配置文件fsfd.conf中列出了已知依赖于边缘服务器的经常使用的业务应用程序的域名以及相应的权威DNS。当客户端计算机的浏览器尝试解析域名时，客户端计算机中的文件系统过滤驱动程序（FSFD）会拦截浏览器的请求。如果正在解析的域名在本地FSFD配置文件fsfd.conf中找到，则FSFD将直接向适当的授权DNS发起DNS请求，该域名的IP地址从fsfd.conf记录中提取出来，从而绕过本地DNS 。权威性DNS返回位于邻近客户端计算机浏览器的边缘缓存服务器的IP地址。

3. 发明申请

US20060055080A1 Semiconductor package having flash-free contacts and techniques for manufacturing the same 审中-公开
标题翻译：具有无闪光触点的半导体封装及其制造技术
公开(公告)号：US20060055080A1
公开(公告)日：2006-03-16
申请号：US11267719
申请日：2005-11-03
申请人： Ken Pham , Luu Nguyen , William Mazotti
发明人： Ken Pham , Luu Nguyen , William Mazotti
IPC分类号： B29C45/02 , B29C45/14 , B29C45/37 , B29C70/72 , B29C70/88 , H01L21/56
CPC分类号： B29C45/37 , B29C45/14639 , B29C2045/14934 , H01L24/73 , H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01088 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401
摘要： Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.
摘要翻译：描述了用于形成具有无闪光电接触表面的顶表面的封装半导体器件的技术。根据一个方面，提供了一种模制腔，其具有足够光滑的模制表面，使得当与导电触点接触时，不形成导电触头和模腔表面之间的间隙。

4. 发明申请

US20060001183A1 Technique for protecting photonic devices in optoelectronic packages with clear overmolding 有权
公开(公告)号：US20060001183A1
公开(公告)日：2006-01-05
申请号：US11217518
申请日：2005-08-31
申请人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts
发明人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts
IPC分类号： B29D11/00
CPC分类号： B29C70/72 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/4809 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/181 , H01L2924/1815 , Y10T29/49146 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.

5. 发明申请

US20050100294A1 Techniques for joining an opto-electronic module to a semiconductor package 有权
公开(公告)号：US20050100294A1
公开(公告)日：2005-05-12
申请号：US11015247
申请日：2004-12-15
申请人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts , Jia Liu
发明人： Luu Nguyen , Ken Pham , Peter Deane , William Mazotti , Bruce Roberts , Jia Liu
IPC分类号： G02B6/38 , G02B6/42 , H01L23/02 , H01L23/498 , H01L25/10 , H05K1/02 , H05K1/18 , H05K3/40 , G02B6/36
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

6. 发明授权

US06245595B1 Techniques for wafer level molding of underfill encapsulant 有权
标题翻译：底层填料密封剂晶圆级成型技术
公开(公告)号：US06245595B1
公开(公告)日：2001-06-12
申请号：US09359074
申请日：1999-07-22
申请人： Luu Nguyen , Hem P. Takiar , Ethan Warner , Shahram Mostafazadeh , Joseph O. Smith
发明人： Luu Nguyen , Hem P. Takiar , Ethan Warner , Shahram Mostafazadeh , Joseph O. Smith
IPC分类号： H01L2144
CPC分类号： H01L21/67126 , H01L21/563 , H01L24/11 , H01L24/29 , H01L24/94 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/73104 , H01L2224/73203 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/351 , H01L2924/01031 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A method and apparatus for forming a layer of underfill encapsulant on an integrated circuit located on a wafer are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. Most of the solder balls have been flattened in order to provide an enlarged solder wetting area. A layer of underfill encapsulant is injected onto the integrated circuit under pressure to form a layer of underfill encapsulant that is then pre-cured. The integrated circuit is mounted to a substrate and the substrate and the integrated circuit are electrically coupled by a solder reflow operation which also finally cures the underfill encapsulant.
摘要翻译：描述了在位于晶片上的集成电路上形成底层密封剂层的方法和装置。作为倒装芯片，集成电路具有导电焊盘，其中大部分具有附着于其上的焊球。大多数焊球已经被平坦化，以便提供扩大的焊料润湿区域。将一层底层填料密封剂在压力下注入到集成电路上，以形成一层底层填料密封剂，然后将其预固化。集成电路安装到基板上，并且基板和集成电路通过回流焊接操作电耦合，焊接回流操作也最终固化底部填充密封剂。

7. 发明授权

US06238949B1 Method and apparatus for forming a plastic chip on chip package module 有权
标题翻译：用于形成芯片封装模块上的塑料芯片的方法和装置
公开(公告)号：US06238949B1
公开(公告)日：2001-05-29
申请号：US09336037
申请日：1999-06-18
申请人： Luu Nguyen , Ashok Prabhu , Nikhil Kelkar , Hem P. Takiar
发明人： Luu Nguyen , Ashok Prabhu , Nikhil Kelkar , Hem P. Takiar
IPC分类号： H01L2144
CPC分类号： H01L24/17 , H01L21/565 , H01L23/3121 , H01L23/49575 , H01L24/48 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/13099 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81815 , H01L2224/92127 , H01L2224/92225 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06582 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/00012 , H01L2224/81 , H01L2224/45015 , H01L2924/207
摘要： A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.
摘要翻译：公开了一种用于形成芯片上的塑料芯片模块的方法和装置。通过将堆叠的芯片组放置在适当地布置成接收密封剂的模制室中来形成芯片上的塑料芯片模块。堆叠的芯片组包括电子和机械耦合到母芯片的子芯片，其中子芯片通过间隙与母芯片直接对准并与母芯片分离。然后将封装剂填充到填充间隙的模制室中，同时围绕芯片组以形成芯片上的塑料芯片模块。

8. 发明申请

US20120217610A1 Bonded Semiconductor Structure With Pyramid-Shaped Alignment Openings and Projections 审中-公开
标题翻译：具有金字塔形对准开口和投影的保护半导体结构
公开(公告)号：US20120217610A1
公开(公告)日：2012-08-30
申请号：US13037281
申请日：2011-02-28
申请人： Peter J. Hopper , Peter Johnson , Luu Nguyen , Peter Smeys
发明人： Peter J. Hopper , Peter Johnson , Luu Nguyen , Peter Smeys
IPC分类号： H01L29/02 , H01L21/762
CPC分类号： H01L23/481 , H01L21/76898 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/05571 , H01L2224/05647 , H01L2224/06181 , H01L2224/13005 , H01L2224/13017 , H01L2224/131 , H01L2224/13105 , H01L2224/13562 , H01L2224/13582 , H01L2224/13647 , H01L2224/13686 , H01L2224/16145 , H01L2224/73207 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2224/81801 , H01L2224/81805 , H01L2224/94 , H01L2225/06513 , H01L2225/06565 , H01L2225/06568 , H01L2225/06593 , H01L2924/00014 , H01L2924/01322 , H01L2924/10329 , H01L2924/1033 , H01L2924/1461 , H01L2224/81 , H01L2224/11 , H01L2924/00012 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
摘要： A bonded semiconductor structure is formed in a method that first forms a female semiconductor structure with pyramid-shaped openings and a male semiconductor structure with pyramid-shaped projections, and then inserts the projections into the openings to align the male semiconductor structure to the female semiconductor structure for bonding.
摘要翻译：键合半导体结构体是以首先形成金字塔状的开口的阴半导体结构体和具有金字塔形突起的阳半导体结构体的方式形成的，然后将凸部插入到开口中，以使阳半导体结构与阴半导体结合结构。

9. 发明申请

US20070282627A1 FACILITATING MANAGEMENT OF SERVICE ELEMENTS USABLE IN PROVIDING INFORMATION TECHNOLOGY SERVICE OFFERINGS 失效
标题翻译：促进提供信息技术服务提供的服务元素的管理
公开(公告)号：US20070282627A1
公开(公告)日：2007-12-06
申请号：US11841153
申请日：2007-08-20
申请人： Paul Greenstein , Galina Grunin , Luu Nguyen
发明人： Paul Greenstein , Galina Grunin , Luu Nguyen
IPC分类号： G06Q50/00
CPC分类号： G06Q30/02
摘要： A service element is defined and represented by a data structure. It includes one or more components and/or one or more other service elements. A service element providing a complete function is a service offering. Management of service elements and/or service offerings is facilitated by a Service Development Tool. In different aspects, the management includes various tasks associated with creating, modifying and deleting service elements, establishing relationships, error checking and optimization. In a further aspect, service elements are packaged and distributed to enable customers to deliver the service elements. Additionally, the hosting of software packages is facilitated.
摘要翻译：服务元素由数据结构定义和表示。它包括一个或多个组件和/或一个或多个其他服务元素。提供完整功能的服务元素是服务提供。服务开发工具便于管理服务元素和/或服务。在不同方面，管理包括与创建，修改和删除服务元素，建立关系，错误检查和优化相关的各种任务。在另一方面，服务元件被打包和分发以使客户能够传递服务元素。此外，还促进了软件包的托管。

10. 发明申请

US20070071391A1 Optical sub-assembly packaging techniques that incorporate optical lenses 有权
标题翻译：包含光学透镜的光学子组件封装技术
公开(公告)号：US20070071391A1
公开(公告)日：2007-03-29
申请号：US11473820
申请日：2006-06-23
申请人： William Mazotti , Jia Liu , Luu Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
发明人： William Mazotti , Jia Liu , Luu Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4231 , G02B6/4239 , G02B6/4249 , G02B6/4251
摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the envirorunent and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.
摘要翻译：描述了以光子器件被保护免受暴露于环境和物理处理可能引起的损害的方式制造光传输装置的技术。本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。光传输设备可以被配置为用作光接收器，检测器或收发器设备。

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