会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Cooling a chassis by moving air through a midplane between two sets of channels oriented laterally relative to one another
    • 通过将空气通过相对于彼此横向定位的两组通道之间的中间平面来移动空气来冷却底盘
    • US08064200B1
    • 2011-11-22
    • US12210211
    • 2008-09-14
    • Stephen J. WestScott PradelsStephen S. Greer
    • Stephen J. WestScott PradelsStephen S. Greer
    • H05K7/20
    • H05K7/20563H05K7/20145H05K7/20209H05K7/20572H05K7/20736
    • Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.
    • 在通信机架中的散热电子部件和电路通过至少通过中间平面在相对于彼此横向定向的两组通道之间移动空气而被冷却。 在说明性实施例中,一组的通道垂直取向,另一组的通道水平定向。 每个通道,无论是垂直还是水平,都由相邻电路板之间的机箱中的空间来定义。 中平面一侧的电路板通过中平面上的正交连接器电连接到中平面另一侧的电路板。 中平面还具有允许空气在垂直定向的通道和水平定向的通道之间移动的开口。 根据实施例,两个取向的电路板通过在垂直取向的通道中增加空气压力或者通过降低水平定向的通道中的空气压力或两者来冷却。
    • 4. 发明授权
    • Cooling a chassis by moving air through a midplane between two sets of channels oriented laterally relative to one another
    • 通过将空气通过相对于彼此横向定位的两组通道之间的中间平面来移动空气来冷却底盘
    • US08908372B1
    • 2014-12-09
    • US13292816
    • 2011-11-09
    • Stephen J. WestScott PradelsStephen S. Greer
    • Stephen J. WestScott PradelsStephen S. Greer
    • H05K7/20
    • H05K7/20563H05K7/20145H05K7/20209H05K7/20572H05K7/20736
    • Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.
    • 在通信机架中的散热电子部件和电路通过至少通过中间平面在相对于彼此横向定向的两组通道之间移动空气而被冷却。 在说明性实施例中,一组的通道垂直取向,另一组的通道水平定向。 每个通道,无论是垂直还是水平,都由相邻电路板之间的机箱中的空间来定义。 中平面一侧的电路板通过中平面上的正交连接器电连接到中平面另一侧的电路板。 中平面还具有允许空气在垂直定向的通道和水平定向的通道之间移动的开口。 根据实施例,两个取向的电路板通过在垂直取向的通道中增加空气压力或者通过降低水平定向的通道中的空气压力或两者来冷却。