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    • 4. 发明授权
    • Organopolysiloxane composition
    • 有机聚硅氧烷组合物
    • US4886865A
    • 1989-12-12
    • US169849
    • 1988-03-18
    • Masayuki IkenoHironao FujikiHiroshi Inomata
    • Masayuki IkenoHironao FujikiHiroshi Inomata
    • C08G77/50C08L83/05C08L83/07C08L83/14
    • C08G77/50C08L83/14
    • The organopolysiloxane composition is useful as a potting or encapsulating material having a gel-like consistency for protecting electronic components even at an extremely low temperature as is encountered in the space industry. The composition is basically of the type in which crosslinks are formed by the addition reaction between silicon-bonded vinyl groups in an organopolysiloxane and silicon-bonded hydrogen atoms in an organohydrogenpolysiloxane but the outstanding cold resistance of the gel-like material obtained from the composition is imparted by incorporating specific silethylene-containing units of the unit formula OSiMe--CH.sub.2 CH.sub.2 --SiMe.sub.2 O.sub.0.5 into the organopolysiloxane in a specified molar content.
    • 有机聚硅氧烷组合物可用作具有凝胶状稠度的灌封或封装材料,即使在空间工业中遇到的极低温下也能保护电子元件。 组合物基本上是通过有机聚硅氧烷中与硅键合的乙烯基与有机氢聚硅氧烷中与硅键合的氢原子之间的加成反应形成交联的类型,但由组合物获得的凝胶状材料的出色的耐寒性为 通过将单元式OSiMe-CH 2 CH 2 -SiMe 2 O 0.5的特定的含有亚乙烯基的单元以特定的摩尔含量加入有机聚硅氧烷中。