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    • 9. 发明授权
    • Curable silicone composition and cured product thereof
    • 可固化硅酮组合物及其固化产物
    • US5276087A
    • 1994-01-04
    • US824304
    • 1992-01-23
    • Hironao FujikiMasayuki Ikeno
    • Hironao FujikiMasayuki Ikeno
    • C08K3/22C08K7/18C08L83/04C08K3/20C08K3/36C08L83/07
    • C10M111/04C08K3/22C08K7/18C08L83/04C08G77/12C08G77/20C10M2201/0623C10M2201/1053C10M2229/0435C10M2229/0445C10N2210/07C10N2230/02C10N2240/20
    • A curable silicone composition which can cure using hydrosilylation, comprising an aluminum oxide powder and/or silica powder, the powders each consisting of substantially spherical particles with an average particle diameter of 50 .mu.m or below and an elongation of from 1.0 to 1.4 and being such that the respective amounts of alkali metal ions and halogen ions are extracted with 50 ml of water from 5 g of the powder at 121.degree. C. for 20 hours are not more than 10 ppm, wherein the amount of the component (D) is from 25 to 90% by weight based on the composition, and the ratio of the amount of hydrosilyl groups contained in the components (A) and (B) to the amount of alkenyl groups contained in the components (A) and (B) is in the range from 0.5/1 to 1.5/1. When the composition is used as a protective material or encapsulating material for devices such as ICs, generated heat can be dissipated efficiently and the devices are not be broken by abrasion. There are no fears of causing corrosion of the devices.
    • 一种可固化的硅氧烷组合物,其可以使用氢化硅烷化固化,其包含氧化铝粉末和/或二氧化硅粉末,所述粉末各自由平均粒径为50(my)m或更小的基本上球形的颗粒和1.0至1.4的伸长率组成 并且使得在121℃下从5g粉末中用50ml水萃取碱金属离子和卤素离子的相应量不超过10ppm,其中组分(D )为25〜90重量%,组分(A)和(B)中所含的氢化甲硅烷基的量与组分(A)和(B)中所含的烯基的量的比率为25至90重量% )在0.5 / 1至1.5 / 1的范围内。 当组合物用作诸如IC之类的装置的保护材料或封装材料时,可以有效地消散所产生的热量,并且不会由于磨损而破坏装置。 没有担心会导致器件腐蚀。
    • 10. 发明授权
    • Organopolysiloxane composition
    • 有机聚硅氧烷组合物
    • US4886865A
    • 1989-12-12
    • US169849
    • 1988-03-18
    • Masayuki IkenoHironao FujikiHiroshi Inomata
    • Masayuki IkenoHironao FujikiHiroshi Inomata
    • C08G77/50C08L83/05C08L83/07C08L83/14
    • C08G77/50C08L83/14
    • The organopolysiloxane composition is useful as a potting or encapsulating material having a gel-like consistency for protecting electronic components even at an extremely low temperature as is encountered in the space industry. The composition is basically of the type in which crosslinks are formed by the addition reaction between silicon-bonded vinyl groups in an organopolysiloxane and silicon-bonded hydrogen atoms in an organohydrogenpolysiloxane but the outstanding cold resistance of the gel-like material obtained from the composition is imparted by incorporating specific silethylene-containing units of the unit formula OSiMe--CH.sub.2 CH.sub.2 --SiMe.sub.2 O.sub.0.5 into the organopolysiloxane in a specified molar content.
    • 有机聚硅氧烷组合物可用作具有凝胶状稠度的灌封或封装材料,即使在空间工业中遇到的极低温下也能保护电子元件。 组合物基本上是通过有机聚硅氧烷中与硅键合的乙烯基与有机氢聚硅氧烷中与硅键合的氢原子之间的加成反应形成交联的类型,但由组合物获得的凝胶状材料的出色的耐寒性为 通过将单元式OSiMe-CH 2 CH 2 -SiMe 2 O 0.5的特定的含有亚乙烯基的单元以特定的摩尔含量加入有机聚硅氧烷中。