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1. 发明申请

US20110175634A1 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
公开(公告)号：US20110175634A1
公开(公告)日：2011-07-21
申请号：US13075666
申请日：2011-03-30
申请人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： G01R31/3187 , G01R31/20
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

2. 发明申请

US20050093565A1 Fabrication method of semiconductor integrated circuit device 审中-公开
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20050093565A1
公开(公告)日：2005-05-05
申请号：US10968215
申请日：2004-10-20
申请人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： G01R1/06 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/66 , H01L21/822 , H01L27/04 , G01R31/26
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.
摘要翻译：为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

3. 发明授权

US07901958B2 Fabrication method of semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07901958B2
公开(公告)日：2011-03-08
申请号：US12853360
申请日：2010-08-10
申请人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.
摘要翻译：为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

4. 发明授权

US07776626B2 Manufacturing method of semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07776626B2
公开(公告)日：2010-08-17
申请号：US11816369
申请日：2005-03-11
申请人： Akio Hasebe , Hideyuki Matsumoto , Shingo Yorisaki , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka , Naoki Okamoto
发明人： Akio Hasebe , Hideyuki Matsumoto , Shingo Yorisaki , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka , Naoki Okamoto
IPC分类号： H01L21/66 , G01R31/02
CPC分类号： H01L24/10 , G01R31/2889 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05085 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05572 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/12036 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , H01L2924/00014
摘要： A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.
摘要翻译：在探针测试时，探针与测试垫接触，而不会破坏芯片中形成的电路。因此，通过用螺母和螺栓固定，将装载夹具，压制工具，弹性体，粘合环和柱塞制成一体。安装在弹簧保持夹具和负载夹具之间的弹簧的弹力用于使得用作这些弹簧的构件可以朝向垫PD压下。从弹簧传递到柱塞到薄膜片的推力仅用于薄膜片的延伸。

5. 发明授权

US08357933B2 Manufacturing method of semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US08357933B2
公开(公告)日：2013-01-22
申请号：US12839668
申请日：2010-07-20
申请人： Akio Hasebe , Hideyuki Matsumoto , Shingo Yorisaki , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka , Naoki Okamoto
发明人： Akio Hasebe , Hideyuki Matsumoto , Shingo Yorisaki , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka , Naoki Okamoto
IPC分类号： H01L21/66
CPC分类号： H01L24/10 , G01R31/2889 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05085 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05572 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/12036 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , H01L2924/00014
摘要： A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.
摘要翻译：在探针测试时，探针与测试垫接触，而不会破坏芯片中形成的电路。因此，通过用螺母和螺栓固定，将装载夹具，压制工具，弹性体，粘合环和柱塞制成一体。安装在弹簧保持夹具和负载夹具之间的弹簧的弹力用于使得用作这些弹簧的构件可以朝向垫PD压下。从弹簧传递到柱塞到薄膜片的推力仅用于薄膜片的延伸。

6. 发明授权

US07598100B2 Manufacturing method of semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07598100B2
公开(公告)日：2009-10-06
申请号：US11719112
申请日：2004-11-18
申请人： Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka
发明人： Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka
IPC分类号： H01L21/00 , H01L31/26 , H01L21/66 , H01L21/82
CPC分类号： G01R1/0735 , G01R3/00
摘要： As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and secure contact between probes 7 and test pads cannot be realized. For its prevention, the thin film sheet 2 and a bonding ring 6 are bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet 2, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ring 6 defining the height up to the probe surface of the thin film sheet 2 is increased, thereby increasing the height up to the probe surface of the thin film sheet 2.
摘要翻译：随着用于防止多层布线基板1翘曲的卡夹的厚度增加，存在薄膜片2被埋在卡夹中并且不能实现探针7和测试垫之间的牢固接触的问题。为了防止，薄膜片2和接合环6在仅向薄膜片2的中心区域IA施加张力的状态下接合，并且拉伸力不施加到外围区域 OA。然后，限定高达薄膜片2的探针表面的高度的接合环6的高度增加，从而增加高达薄膜片2的探针表面的高度。

7. 发明申请

US20090017565A1 MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20090017565A1
公开(公告)日：2009-01-15
申请号：US11816369
申请日：2005-03-11
申请人： Akio Hasebe , Hideyuki Matsumoto , Shingo Yorisaki , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka , Naoki Okamoto
发明人： Akio Hasebe , Hideyuki Matsumoto , Shingo Yorisaki , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka , Naoki Okamoto
IPC分类号： H01L21/66
CPC分类号： H01L24/10 , G01R31/2889 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05085 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05572 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/12036 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , H01L2924/00014
摘要： A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.
摘要翻译：在探针测试时，探针与测试垫接触，而不会破坏芯片中形成的电路。因此，通过用螺母和螺栓固定，将装载夹具，压制工具，弹性体，粘合环和柱塞制成一体。安装在弹簧保持夹具和负载夹具之间的弹簧的弹力用于使得用作这些弹簧的构件可以朝向垫PD压下。从弹簧传递到柱塞到薄膜片的推力仅用于薄膜片的延伸。

8. 发明申请

US20090130785A1 MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20090130785A1
公开(公告)日：2009-05-21
申请号：US11719112
申请日：2004-11-18
申请人： Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka
发明人： Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： G01R1/0735 , G01R3/00
摘要： As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and secure contact between probes 7 and test pads cannot be realized. For its prevention, the thin film sheet 2 and a bonding ring 6 are bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet 2, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ring 6 defining the height up to the probe surface of the thin film sheet 2 is increased, thereby increasing the height up to the probe surface of the thin film sheet 2.
摘要翻译：随着用于防止多层布线基板1翘曲的卡夹的厚度增加，存在薄膜片2被埋在卡夹中并且不能实现探针7和测试垫之间的牢固接触的问题。为了防止，薄膜片2和接合环6在仅向薄膜片2的中心区域IA施加张力的状态下接合，并且拉伸力不施加到外围区域 OA。然后，限定高达薄膜片2的探针表面的高度的接合环6的高度增加，从而增加高达薄膜片2的探针表面的高度。

9. 发明授权

US07407823B2 Manufacturing method of semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07407823B2
公开(公告)日：2008-08-05
申请号：US11471712
申请日：2006-06-21
申请人： Akio Hasebe , Masayoshi Okamoto , Yasunori Narizuka , Shingo Yorisaki , Yasuhiro Motoyama
发明人： Akio Hasebe , Masayoshi Okamoto , Yasunori Narizuka , Shingo Yorisaki , Yasuhiro Motoyama
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/07378 , G01R31/2889
摘要： During probe testing using a prober having probe needles formed by using a manufacturing technology for a semiconductor integrated circuit device, reliable contact is ensured between the probe needles and test pads. A pressing tool having at least one hole portion formed therein and extending therethrough between the main and back surface thereof is prepared. An elastomer in the form of a sheet and a polyimide sheet are successively disposed on the main surface of the pressing tool. With th elastomer and the polyimide sheet being electrostatically attracted to the pressing tool, the pressing tool is disposed on a thin-film sheet such that the main surface thereof faces the back surface (the surface opposite to the main surface thereof formed with the probe) of the thin-film sheet. Then, the thin-film sheet with the pressing tool bonded thereto is attached to a probe card.
摘要翻译：在使用具有通过使用用于半导体集成电路器件的制造技术形成的探针的探针的探针测试期间，确保探针和测试垫之间的可靠接触。制备具有形成在其中并在其主表面和后表面之间延伸穿过其中的至少一个孔部分的按压工具。在压制工具的主表面上依次设置片状和聚酰亚胺片形式的弹性体。利用弹性体，将聚酰亚胺片静电吸引到按压工具上，将压制工具设置在薄膜片上，使其主表面面向背面（与形成有探针的主表面相反的表面）的薄膜片。然后，将与其接合的按压工具的薄膜片安装在探针卡上。

10. 发明申请

US20060286715A1 Manufacturing method of semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20060286715A1
公开(公告)日：2006-12-21
申请号：US11471712
申请日：2006-06-21
申请人： Akio Hasebe , Masayoshi Okamoto , Yasunori Narizuka , Shingo Yorisaki , Yasuhiro Motoyama
发明人： Akio Hasebe , Masayoshi Okamoto , Yasunori Narizuka , Shingo Yorisaki , Yasuhiro Motoyama
IPC分类号： H01L21/00
CPC分类号： G01R3/00 , G01R1/07378 , G01R31/2889
摘要： During probe testing using a prober having probe needles formed by using a manufacturing technology for a semiconductor integrated circuit device, reliable contact is ensured between the probe needles and test pads. A pressing tool having at least one hole portion formed therein and extending therethrough between the main and back surface thereof is prepared. An elastomer in the form of a sheet and a polyimide sheet are successively disposed on the main surface of the pressing tool. With th elastomer and the polyimide sheet being electrostatically attracted to the pressing tool, the pressing tool is disposed on a thin-film sheet such that the main surface thereof faces the back surface (the surface opposite to the main surface thereof formed with the probe) of the thin-film sheet. Then, the thin-film sheet with the pressing tool bonded thereto is attached to a probe card.
摘要翻译：在使用具有通过使用用于半导体集成电路器件的制造技术形成的探针的探针的探针测试期间，确保探针和测试垫之间的可靠接触。制备具有形成在其中并在其主表面和后表面之间延伸穿过其中的至少一个孔部分的按压工具。在压制工具的主表面上依次设置片状和聚酰亚胺片形式的弹性体。利用弹性体，将聚酰亚胺片静电吸引到按压工具上，将压制工具设置在薄膜片上，使得其主表面面向背面（与形成有探针的主表面相反的表面）的薄膜片。然后，将与其接合的按压工具的薄膜片安装在探针卡上。

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