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    • 2. 发明授权
    • Metal surface treatment agent, and metal material coated with same
    • 金属表面处理剂,金属材料涂覆同样
    • US06605356B2
    • 2003-08-12
    • US10009902
    • 2001-12-10
    • Takashi OuchiKatsuyuki TsuchidaMasashi Kumagai
    • Takashi OuchiKatsuyuki TsuchidaMasashi Kumagai
    • B32B2738
    • C23C30/00Y10T428/31511Y10T428/31515Y10T428/31529Y10T428/31663
    • A metal surface treatment agent containing the following components (A) to (D), which securely adheres to a metal substrate such as aluminum, exhibits excellent corrosion preventive properties, even with a thin film thickness, and has excellent plasticity and adhesion to paints. (A) at least one organosilicon compound having three carbonyl groups and at least one alkoxysilyl group, the organosilicon compound being present in a weight ratio of 5 to 15, based on the total of the components (A) to (D) being 100; (B) at least one epoxy resin modified with an alkanolamine, the modified epoxy resin being present in a weight ratio of 10 to 30 relative to the above total; (C) at least one blocked polyisocyanate present in a weight ratio of 50 to 70 relative to the above total; and (D) at least one amino resin present in a weight ratio of ratio 5 to 15 relative to the above total.
    • 含有以下成分(A)〜(D)的金属表面处理剂即使在薄膜厚度上也能够牢固地附着于铝等金属基材,也具有优异的耐腐蚀性,且具有优异的塑性和对涂料的粘合性。 (A)至少一种具有三个羰基和至少一个烷氧基甲硅烷基的有机硅化合物,以组分(A)至(D)的总和为100,有机硅化合物以重量比5至15存在; (B)至少一种用链烷醇胺改性的环氧树脂,所述改性环氧树脂以相对于上述总量为10至30的重量比存在;(C)至少一种以重量比为50至70的封端多异氰酸酯 相对于上述总数; 和(D)至少一种氨基树脂以相对于上述总量的比例为5至15的重量比存在。
    • 7. 发明授权
    • Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
    • 含有具有特定骨架的添加剂化合物的铜电解液和由其制造的电解铜箔
    • US07824534B2
    • 2010-11-02
    • US10588686
    • 2005-12-09
    • Katsuyuki TsuchidaHironori KobayashiMasashi Kumagai
    • Katsuyuki TsuchidaHironori KobayashiMasashi Kumagai
    • C25D3/38
    • C25D1/04C25D3/38
    • The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
    • 本发明的目的是在使用阴极鼓的电解铜箔制造中,在粗糙表面侧(与光面相反的一侧)获得具有低表面粗糙度的薄型电解铜箔,特别是获得 电解铜箔具有优异的伸长率和拉伸强度,可以进行精细图案化。 另一个目的是获得一种铜电解溶液,其允许在2层柔性基板上均匀镀铜而没有针孔。 该铜电解液含有作为添加剂的具有下述通式(1)表示的特定骨架的化合物,其通过加成反应获得,其中将水加入到分子中具有一个或多个环氧基的化合物:其中 A是环氧化合物残基,n是1以上的整数。