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1. 发明申请

US20090092789A1 Two-Layer Flexible Substrate 有权
标题翻译：双层柔性基材
公开(公告)号：US20090092789A1
公开(公告)日：2009-04-09
申请号：US11992209
申请日：2006-08-22
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Ryu Murakami , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Ryu Murakami , Masashi Kumagai
IPC分类号： D06N7/04
CPC分类号： H05K1/09 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/206 , H05K1/0346 , H05K1/0393 , H05K3/108 , H05K3/28 , H05K3/382 , H05K3/388 , H05K2201/0355 , H05K2201/098 , H05K2203/0723 , Y10T428/24355
摘要： The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to resist.The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 μm, and wherein the average crystal grain size [of copper] is no greater than 0.8 μm at 1 μm from the insulator film in the cross section of the copper layer. Preferably, the insulator film is a polyimide film.
摘要翻译：本发明提供一种没有表面缺陷且具有优异的蚀刻特性和抗粘附性的双层柔性基材。双层柔性基板在不使用粘合剂的情况下，在绝缘膜的一面或两面上具有铜层，其中铜层的表面粗糙度（Ra）为0.10〜0.25μm，平均结晶粒径[ 的铜]在铜层的截面中距离绝缘膜1个1um时不大于0.8μm。优选地，绝缘膜是聚酰亚胺膜。

2. 发明授权

US08568856B2 Two-layer flexible substrate 有权
标题翻译：双层柔性基板
公开(公告)号：US08568856B2
公开(公告)日：2013-10-29
申请号：US11992209
申请日：2006-08-22
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Ryu Murakami , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Ryu Murakami , Masashi Kumagai
IPC分类号： D06N7/04
CPC分类号： H05K1/09 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/206 , H05K1/0346 , H05K1/0393 , H05K3/108 , H05K3/28 , H05K3/382 , H05K3/388 , H05K2201/0355 , H05K2201/098 , H05K2203/0723 , Y10T428/24355
摘要： The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist.The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 μm, and wherein the average crystal grain size [of copper] is no greater than 0.8 μm at 1 μm from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film.
摘要翻译：本发明提供一种没有表面缺陷且具有优异的蚀刻特性和对抗蚀剂的粘附性的双层柔性基材。双层柔性基板在不使用粘合剂的情况下，在绝缘膜的一面或两面上具有铜层，其中铜层的表面粗糙度（Ra）为0.10〜0.25μm，平均结晶粒径[ 的铜]在铜层的截面中距离绝缘体膜1m时不大于0.8μm。优选地，绝缘膜是聚酰亚胺膜。

3. 发明授权

US07824534B2 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith 有权
标题翻译：含有具有特定骨架的添加剂化合物的铜电解液和由其制造的电解铜箔
公开(公告)号：US07824534B2
公开(公告)日：2010-11-02
申请号：US10588686
申请日：2005-12-09
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
IPC分类号： C25D3/38
CPC分类号： C25D1/04 , C25D3/38
摘要： The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光面相反的一侧）获得具有低表面粗糙度的薄型电解铜箔，特别是获得电解铜箔具有优异的伸长率和拉伸强度，可以进行精细图案化。另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。该铜电解液含有作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中 A是环氧化合物残基，n是1以上的整数。

4. 发明申请

US20070170069A1 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith 有权
标题翻译：含有具有特定骨架的添加剂化合物的铜电解液和由其制造的电解铜箔
公开(公告)号：US20070170069A1
公开(公告)日：2007-07-26
申请号：US10588686
申请日：2005-12-09
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
IPC分类号： C25D3/38
CPC分类号： C25D1/04 , C25D3/38
摘要： The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光泽面相反侧）获得具有低表面粗糙度的低剖面电解铜箔，特别是获得电解铜箔具有优异的伸长率和拉伸强度，允许精细图案化。另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。该铜电解液包含作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中A为环氧化合物残基，n为1以上的整数。

5. 发明申请

US20070123681A1 Resin composition 审中-公开
标题翻译：树脂组成
公开(公告)号：US20070123681A1
公开(公告)日：2007-05-31
申请号：US10575336
申请日：2004-09-30
申请人： Hironori Kobayashi , Katsuyuki Tsuchida , Masashi Kumagai
发明人： Hironori Kobayashi , Katsuyuki Tsuchida , Masashi Kumagai
IPC分类号： C08G18/40 , C08G18/48
CPC分类号： C08G18/7831 , C08G18/289 , C08G18/6225 , C08K5/5442 , C08L75/04 , C09D175/04
摘要： As a resin composition that solves the problems such as unpleasant odor encountered when a tertiary amine compound is used as a catalyst in a reaction of a polyol and a polyisocyanate, and that promotes the curing of these resins and improves adhesion to metals, inorganic materials, and organic materials, the present invention provides a resin composition containing the following components as essential components, (A) a polyol (B) a polyisocyanate (C) a silane coupling agent containing an imidazole group (here, the ratio NCO/OH of the number of isocyanate groups in the polyisocyanate (B) to the number of hydroxyl groups in the polyol (A) in the above composition is from 0.6 to 4.0, and the weight ratio of {(A)+(B)}:(C) is from 100:0.01 to 100:10).
摘要翻译：作为解决在多元醇与多异氰酸酯的反应中使用叔胺化合物作为催化剂时遇到的令人不愉快的气味，促进这些树脂的固化，提高与金属，无机材料的粘合性等问题的树脂组合物，和有机材料，本发明提供了含有以下成分作为必要成分的树脂组合物，（A）多元醇（B），多异氰酸酯（C），含有咪唑基的硅烷偶联剂（这里，NCO / 多异氰酸酯（B）中的异氰酸酯基数与上述组成中的多元醇（A）中的羟基数为0.6〜4.0，{（A）+（B：（C））的重量比为 100：0.01〜100：10）。

6. 发明申请

US20100224496A1 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith 审中-公开
标题翻译：含有具有特定骨架的添加剂化合物的铜电解液和由其制造的电解铜箔
公开(公告)号：US20100224496A1
公开(公告)日：2010-09-09
申请号：US12660199
申请日：2010-02-23
申请人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
发明人： Katsuyuki Tsuchida , Hironori Kobayashi , Masashi Kumagai
IPC分类号： B32B1/00 , B32B15/04
CPC分类号： C25D1/04 , C25D3/38
摘要： The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
摘要翻译：本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光泽面相反侧）获得具有低表面粗糙度的低剖面电解铜箔，特别是获得电解铜箔具有优异的伸长率和拉伸强度，允许精细图案化。另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。该铜电解液包含作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中A为环氧化合物残基，n为1以上的整数。

7. 发明授权

US08268546B2 Structure for pattern formation, method for pattern formation, and application thereof 失效
标题翻译：图案形成结构，图案形成方法及其应用
公开(公告)号：US08268546B2
公开(公告)日：2012-09-18
申请号：US12122833
申请日：2008-05-19
申请人： Hironori Kobayashi , Manabu Yamamoto , Daigo Aoki , Hironori Kamiyama , Shinichi Hikosaka , Mitsuhiro Kashiwabara
发明人： Hironori Kobayashi , Manabu Yamamoto , Daigo Aoki , Hironori Kamiyama , Shinichi Hikosaka , Mitsuhiro Kashiwabara
IPC分类号： G03F7/26
CPC分类号： B41N1/006 , B29D11/00365 , B41C1/1041 , G02B3/0012 , G02B3/0056 , G02B5/201 , G03F7/0005 , G03F7/0007 , G03F7/001 , G03F7/0043 , G03F7/0757 , G03F7/095 , G03F7/11
摘要： A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
摘要翻译：一种用于图案形成的结构，用于光学地形成图案，其特征在于包括：设置在基底上的含光催化剂的层，所述含光催化剂的层含有通过在图案曝光时的光催化作用可润湿性的材料。

8. 发明授权

US07965446B2 Structure for pattern formation, method for pattern formation, and application thereof 有权
标题翻译：图案形成结构，图案形成方法及其应用
公开(公告)号：US07965446B2
公开(公告)日：2011-06-21
申请号：US11867842
申请日：2007-10-05
申请人： Hironori Kobayashi , Manabu Yamamoto , Daigo Aoki , Hironori Kamiyama , Shinichi Hikosaka , Mitsuhiro Kashiwabara
发明人： Hironori Kobayashi , Manabu Yamamoto , Daigo Aoki , Hironori Kamiyama , Shinichi Hikosaka , Mitsuhiro Kashiwabara
IPC分类号： G02B27/10
CPC分类号： B41N1/006 , B29D11/00365 , B41C1/1041 , G02B3/0012 , G02B3/0056 , G02B5/201 , G03F7/0005 , G03F7/0007 , G03F7/001 , G03F7/0043 , G03F7/0757 , G03F7/095 , G03F7/11
摘要： A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
摘要翻译：一种用于图案形成的结构，用于光学地形成图案，其特征在于包括：设置在基底上的含光催化剂的层，所述含光催化剂的层含有通过在图案曝光时的光催化作用可润湿性的材料。

9. 发明授权

US07858274B2 Method for manufacturing color filter 有权
标题翻译：彩色滤光片制造方法
公开(公告)号：US07858274B2
公开(公告)日：2010-12-28
申请号：US11800489
申请日：2007-05-04
申请人： Hironori Kobayashi
发明人： Hironori Kobayashi
IPC分类号： G02B5/20 , G02F1/1335
CPC分类号： B82Y30/00 , G02F1/133516
摘要： In the present invention, a provision of a method for manufacturing a color filter capable of forming a highly sophisticated pattern, to be formed easily at a low cost is desired. The present invention achieves the above mentioned object by providing a method for manufacturing a color filter comprising: (1) forming a light shielding part on a transparent base material; (2) forming a wettability changeable layer which the wettability changes by the function of a photocatalyst, on the surface of the transparent base material on the side with the light shielding part formed; (3) placing the photocatalyst containing layer of the photocatalyst containing layer side substrate which is the photocatalyst containing layer containing a photocatalyst formed on the base member, and the wettability changeable layer with a gap of 200 μm or less, and irradiating an energy from a predetermined direction to form a pixel part forming part comprising a lyophilic area where the contact angle to a liquid is lowered compared with the state before the energy irradiation to the wettability changeable layer, in a pattern; and (4) coloring the pixel part forming part by the ink jet method so as to form a pixel part.
摘要翻译：在本发明中，期望提供一种能够以低成本容易地形成能够形成高度复杂图案的滤色器的方法。本发明通过提供一种制造滤色器的方法来实现上述目的，包括：（1）在透明基材上形成遮光部分; （2）在形成有遮光部的一侧的透明基材的表面上形成润湿性由光催化剂的功能而变化的润湿性变化层; （3）将含有形成在基材上的含有光催化剂的光催化剂含有层的光催化剂含有层侧基材的含光催化剂层和间隙为200μm以下的润湿性变化层进行放置，形成像素部分形成部分，其形成部分包括亲液性区域，其中液体的接触角与向可润湿性变化层的能量照射之前的状态相比降低; 和（4）通过喷墨法着色像素部分形成部分以形成像素部分。

10. 发明授权

US07846647B2 Method of producing pattern-formed structure and photomask used in the same 有权
标题翻译：产生图案形成结构的方法和使用的光掩模
公开(公告)号：US07846647B2
公开(公告)日：2010-12-07
申请号：US10922217
申请日：2004-08-18
申请人： Hironori Kobayashi
发明人： Hironori Kobayashi
IPC分类号： G03F7/26 , G03F7/20
CPC分类号： B82Y30/00 , G03F7/0007 , G03F7/001 , G03F7/11 , G03F7/2014 , Y10S430/148
摘要： The present invention discloses a method of producing a pattern-formed structure, comprising the processes of: preparing a substrate for a pattern-formed structure having a characteristic-modifiable layer whose characteristic at a surface thereof can be modified by the action of photocatalyst; preparing a photocatalyst-containing-layer side substrate having a photocatalyst-containing layer formed on a base material, the photocatalyst-containing layer containing photocatalyst; arranging the substrate for a pattern-formed structure and the photocatalyst-containing-layer side substrate such that the characteristic-modifiable layer faces the photocatalyst-containing layer with a clearance of no larger than 200 μm therebetween; and irradiating energy to the characteristic-modifiable layer from a predetermined direction, and modifying characteristic of a surface of the characteristic-modifiable layer, thereby forming a pattern at the characteristic-modifiable layer. According to this method, a highly precise pattern can be formed without necessity to carry out any post-treatment after exposure. Further, there is no concern that the pattern-formed structure itself deteriorates because the produced pattern-formed structure is free of the photocatalyst.
摘要翻译：本发明公开了一种图案形成结构的制造方法，其特征在于，包括以下工序：制备具有特征可修改层的图案形成结构的基板，其表面的特性可以通过光催化剂的作用进行改性; 制备含有形成在基材上的含光催化剂层的含光催化剂的层侧基材，含有光催化剂的层含有光催化剂; 将图案形成结构的基板和含有光催化剂的层侧基板排列成使得特征可修改层面对含有光催化剂的层，间隙不大于200μm; 以及从预定方向向特征可修改层照射能量，并修改特征可修饰层的表面的特性，从而在特征可修饰层形成图案。根据该方法，可以形成高精度图案，而不需要在曝光后进行任何后处理。此外，由于所生成的图案形成结构体不含光催化剂，因此不会担心图案形成结构本身会劣化。

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