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    • 1. 发明授权
    • SPM cantilever
    • SPM悬臂
    • US06918286B2
    • 2005-07-19
    • US10140117
    • 2002-05-08
    • Masashi KitazawaKoichi Shiotani
    • Masashi KitazawaKoichi Shiotani
    • G01Q60/16G01Q60/38G01Q60/56G01Q70/00G01Q70/06G01R33/02
    • G01Q70/10
    • A silicon nitride film is formed all over the surface of a cantilever prepared as including a support portion made by processing single-crystal silicon wafer, a lever portion extended from the support portion, formed with a controlled thickness from single-crystal silicon, and a probe portion made of single-crystal silicon disposed toward the free end of the lever portion with having its probe axis perpendicular to the lever portion, so as to have a greater film thickness on the side face of the probe portion toward the free end of the lever portion, thereby constructing SPM cantilever of configuration where the terminal end portion of the probe portion is tilted toward the free end by a certain angle θ with respect to the probe axis. The SPM cantilever thereby can be achieved as capable of measuring surface conditions always at high resolution correspondingly to measuring condition or sample shape.
    • 在悬臂的整个表面上形成氮化硅膜,该悬臂被制备为包括通过加工单晶硅晶片制成的支撑部分,从支撑部分延伸的杠杆部分,以单晶硅形成受控厚度, 由单晶硅制成的探针部分朝向杠杆部分的自由端设置,其探头轴线垂直于杆部分,以便在探头部分的侧面朝向自由端的较大的膜厚度 从而构成SPM悬臂结构,其中探头部分的末端部分相对于探针轴向自由端倾斜一定角度θ。 因此,SPM悬臂可以实现为能够相应于测量条件或样品形状一直以高分辨率测量表面条件。
    • 4. 发明授权
    • Cantilever for scanning probe microscopy
    • 悬臂扫描探针显微镜
    • US06694805B2
    • 2004-02-24
    • US10122205
    • 2002-04-16
    • Koichi ShiotaniMasashi KitazawaKenji SatoAkitoshi Toda
    • Koichi ShiotaniMasashi KitazawaKenji SatoAkitoshi Toda
    • G01B528
    • G01Q70/16G01Q70/10
    • A cantilever for Scanning Probe Microscopy including: a support portion; a lever portion extended from the support portion; and a probe portion provided at an free end of the lever portion, said probe portion being configured by two triangular thin plates each having one side respectively being one of the different two sides of a V-like notch formed on the free end of the lever, where the thin plates are caused to face each other while having the other side in common. The cantilever for Scanning Probe Microscopy is thereby achieved as having a probe portion which is light in weight and high in rigidity and is readily positioned in alignment and by which measurement at high resolution is steadily possible
    • 扫描探针显微镜的悬臂包括:支撑部分; 从所述支撑部延伸的杆部; 以及探针部,设置在所述杆部的自由端,所述探针部由两个三角形薄板构成,所述两个三角形薄板分别具有形成在所述杆的自由端上的V形切口的不同两侧之一 ,其中使薄板彼此面对,同时使另一侧相同。 因此,扫描探针显微镜的悬臂具有重量轻且刚性高的探针部分,并且容易定位成对准,并且可以稳定地以高分辨率进行测量
    • 8. 发明授权
    • CMOS with a fixed charge in the gate dielectric
    • CMOS在栅极电介质中具有固定电荷
    • US06525380B2
    • 2003-02-25
    • US09324805
    • 1999-06-03
    • Masayoshi ShirahataMasashi KitazawaKazunobu Oota
    • Masayoshi ShirahataMasashi KitazawaKazunobu Oota
    • H01L2994
    • H01L27/092H01L21/28176H01L21/823857
    • A semiconductor device—which includes surface-type n-channel and p-channel single gate transistors by formation of fixed charges within a gate oxide film—and a manufacturing method therefor. A voltage is applied between an electrode connected to a gate electrode and an electrode connected to an N+ region formed in an n-well, and electrons are implanted into the gate electrode at high energy from a substrate, thereby producing fixed negative electric charges in a gate oxide film within an range of 1E11 cm−2 to 1E14 cm−2. An appropriate value for Vth is obtained in the surface channel MOSFET. Therefore, there are solved problems associated with a dual gate structure; namely, a complicated process flow, etch residues or excessive etching due to a difference in etch rate between n-type polycrystalline silicon and p-type polycrystalline silicon, and the deterioration of a gate oxide film due to penetration of boron ions.
    • 一种半导体器件及其制造方法,其包括在栅极氧化膜内形成固定电荷的表面型n沟道和p沟道单栅极晶体管。 在连接到栅电极的电极和连接到形成在n阱中的N +区域的电极之间施加电压,并且电子以高能量从衬底注入到栅电极中,从而在电极中产生固定的负电荷 栅极氧化膜在1E11cm-2至1E14cm-2的范围内。 在表面沟道MOSFET中获得适当的Vth值。 因此,解决了与双栅结构相关的问题; 即由于n型多晶硅和p型多晶硅之间的蚀刻速率差异导致的复杂工艺流程,蚀刻残留物或过度蚀刻以及由于硼离子渗透导致的栅极氧化膜的劣化。