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1. 发明申请

US20060006210A1 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same 有权
标题翻译：热分析的方法，装置和程序，使用其的加热控制器和加热炉
公开(公告)号：US20060006210A1
公开(公告)日：2006-01-12
申请号：US10523196
申请日：2003-07-30
申请人： Masaru Nonomura , Yoshimori Isobata , Hiroaki Onishi , Masahiro Taniguchi
发明人： Masaru Nonomura , Yoshimori Isobata , Hiroaki Onishi , Masahiro Taniguchi
IPC分类号： A47J36/02
CPC分类号： G05D23/1951 , H05K3/3494
摘要： Heating characteristic value at any measuring point of an object at any measuring location of an heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, temperature profile of the object heated under modified heating condition may be simulated in a short period of time without actually heating and measuring temperature of the object at high accuracy level. By using such simulation, appropriate heating condition for heating an object in accordance with desired heating condition may easily be determined.
摘要翻译：在加热炉的任何测量位置处的物体的任何测量点处的加热特性值通过使用在物体的测量点和加热温度（Ta）和加热时间（Ta）处测量的温度（Tint和Ts）而被确定为单一的 t）在加热炉的测量位置。可以在不使用物体的物理特性的情况下计算加热特性值（m值）。通过使用m值，可以在短时间内模拟在改进加热条件下加热的物体的温度分布，而实际上不会以高精度水平加热和测量物体的温度。通过使用这种模拟，可以容易地确定用于根据期望的加热条件加热物体的合适的加热条件。

2. 发明授权

US07549566B2 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method 有权
标题翻译：热分析方法，装置和程序，热控制器和加热炉采用该方法
公开(公告)号：US07549566B2
公开(公告)日：2009-06-23
申请号：US10523196
申请日：2003-07-30
申请人： Masaru Nonomura , Yoshinori Isobata , Hiroaki Onishi , Masahiro Taniguchi
发明人： Masaru Nonomura , Yoshinori Isobata , Hiroaki Onishi , Masahiro Taniguchi
IPC分类号： B23K31/02
CPC分类号： G05D23/1951 , H05K3/3494
摘要： A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.
摘要翻译：在加热炉的任何测量位置处的物体的任何测量点处的加热特性值通过使用在物体的测量点处测量的温度（Tint和Ts）和加热温度（Ta）和加热时间（Tint和Ts）而被确定为单一的（t）在加热炉的测量位置。可以在不使用物体的物理特性的情况下计算加热特性值（m值）。通过使用m值，可以在短时间内模拟在改进的加热条件下加热的物体的温度分布，而不实际加热并以高精度水平测量物体的温度。通过使用这样的模拟，可以容易地确定用于根据期望的加热条件加热物体的适当的加热条件。

3. 发明申请

US20110272098A1 PLASMA PROCESSING APPARATUS 审中-公开
标题翻译：等离子体加工设备
公开(公告)号：US20110272098A1
公开(公告)日：2011-11-10
申请号：US13145688
申请日：2010-01-25
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： C23F1/08
CPC分类号： H01J37/32082 , H01J37/32935 , Y02P90/04 , Y02P90/10 , Y02P90/22
摘要： A plasma processing apparatus includes: a discharge state detecting unit; a history information storing portion; a date-and-time data creating portion; an object specifying data output portion; a data recording portion; and a production history file creating portion. The data recording portion reads out date-and-time data, object specifying data, machine output data representing an operation state of a plasma processing execution portion, and judgment data representing a judgment result of the discharge state, and stores the data in the history information storing portion in time series, each time the plasma processing for the object to be processed is ended. The production history file creating portion that reads out the date-and-time data, the object specifying data, the machine output data, and the judgment result of the discharge state from the history information storing portion based on a designated period or date and time, and creates a production history file.
摘要翻译：一种等离子体处理装置，包括：放电状态检测单元; 历史信息存储部分; 日期和时间数据创建部分; 对象指定数据输出部分; 数据记录部分; 以及生产历史文件生成部。数据记录部分读出日期和时间数据，对象指定数据，表示等离子体处理执行部分的操作状态的机器输出数据和表示放电状态的判断结果的判断数据，并将数据存储在历史记录中每次处理对象物的等离子体处理结束时间序列的信息存储部。生产历史文件创建部，基于指定的时间或日期和时间从历史信息存储部分读出日期和时间数据，对象指定数据，机器输出数据和放电状态的判断结果，并创建一个生产历史文件。

4. 发明申请

US20090035892A1 Component Bonding Method, Component Laminating Method And Bonded Component Structure 有权
标题翻译：组分粘合方法，组分层压方法和粘结组分结构
公开(公告)号：US20090035892A1
公开(公告)日：2009-02-05
申请号：US12280615
申请日：2007-02-09
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L2224/29007 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： It is an object of the invention to provide a component bonding method and a component laminating method that can improve productivity in the heat pressing process.Provided is a component bonding method of bonding a semiconductor component (13) having a thermosetting adhesive layer (13a) formed on a lower surface thereof to a circuit board (5) having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface (5a) of the circuit board (5), the semiconductor component (13) is held by a component holding nozzle (12) having a heater, the adhesive layer (13c) is contacted to the surface-modified resin layer, and the adhesive layer (13c) is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer (13c) and the resin surface (5a) is improved, and thus the component holding nozzle (12) can be separated from the semiconductor component (13) without wait for completely hardening the adhesive layer (13c). Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.
摘要翻译：本发明的目的是提供一种能够提高热压工序的生产率的部件接合方法和部件层压方法。提供了一种将其下表面上具有热固性粘合剂层（13a）的半导体组件（13）接合到其表面上形成有树脂层的电路板（5）的部件接合方法。在该方法中，通过对电路板（5）的树脂表面（5a）进行等离子体处理的表面改性改善了润湿性，半导体部件（13）由具有加热器的部件保持喷嘴（12）保持，粘合层（13c）与表面改性树脂层接触，粘合剂层（13c）被加热器加热固化。由此，提高了粘合剂层（13c）与树脂表面（5a）之间的粘附性，从而能够使部件保持喷嘴（12）与半导体部件（13）分离，而不必等待粘合剂层（13c）的完全硬化，。因此，通过减少部件接合所需的时间，可以提高热压加工的生产率。

5. 发明授权

US09326385B2 LED package manufacturing system and resin coating method in LED package manufacturing system 有权
标题翻译： LED封装制造系统和LED封装制造系统中的树脂涂布方法
公开(公告)号：US09326385B2
公开(公告)日：2016-04-26
申请号：US13877746
申请日：2011-05-11
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H05K3/32 , H05K3/30 , H01L33/00 , H01L33/50
CPC分类号： H05K3/301 , H01L33/0095 , H01L33/507 , H01L2224/48091 , H01L2224/49107 , H01L2933/0041 , Y10T29/53174 , H01L2924/00014
摘要： In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent member 43 coated with a resin 8 on trial as light emitting characteristic measurement is mounted on a translucent member mounting unit 41 having a light source unit, and an excitation light emitted from the light source unit is irradiated onto the resin 8 coated on the translucent member 43, and a deviation between a measurement result obtained by measuring the light emitting characteristics of a light emitted by the resin 8 by a light emitting characteristic measurement unit 39 and light emitting characteristics specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED elements as real production is calculated on the basis of the deviation.
摘要翻译：在用于制造其中LED元件被含有荧光体的树脂覆盖的LED封装的树脂涂层中，在作为发光特性测量的试验中涂覆有树脂8的透光性部件43安装在具有发光特性测量的半透明部件安装单元41上，光源单元和从光源单元发射的激发光照射到涂覆在透光部件43上的树脂8上，并且通过测量由树脂8发射的光的发光特性而得到的测量结果之间的偏差获得发光特性测量单元39和预先规定的发光特性，并且基于偏差计算作为实际生产的要涂覆在LED元件上的树脂的合适的树脂涂布量。

6. 发明授权

US09324906B2 LED package manufacturing system 有权
标题翻译： LED封装制造系统
公开(公告)号：US09324906B2
公开(公告)日：2016-04-26
申请号：US13578082
申请日：2011-05-09
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： G05B19/18 , H01L33/00 , H01L33/50
CPC分类号： H01L33/0095 , H01L33/50 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2933/0041 , H01L2924/00014
摘要： There are prepared element characteristic information 12 obtained by previously, individually measuring light emission characteristics of a plurality of LED elements and resin coating information 14 that correlates an appropriate amount of resin to be applied for acquiring an LED package exhibiting a specified light emission characteristic and the element characteristic information 12. A map preparation processing section 74 prepares, for each board, map data 18 correlating mounting position information 71a showing position of the LED element mounted on the board by a component mounting device M1 and the element characteristic information 12. There is updated the resin coating information 14 on the basis of an inspection result fed back to a resin coating device M4 as a result of a completed product coated with a resin being inspected by a light emission characteristic inspection device M7.
摘要翻译：准备了通过预先分别测定多个LED元件的发光特性和树脂涂层信息14的元件特性信息12，该树脂涂层信息14将用于获取具有特定发光特性的LED封装的适当树脂量与元件特征信息12.地图准备处理部分74为每个板准备地图数据18，其将表示安装在板上的LED元件的位置的安装位置信息71a与元件安装装置M1和元件特征信息12相关联。基于由被发光特性检查装置M7检查的树脂涂覆成品的结果，基于反馈到树脂涂布装置M4的检查结果来更新树脂涂布信息14。

7. 发明授权

US08525217B2 Method and device for resin coating 有权
标题翻译：树脂涂层的方法和装置
公开(公告)号：US08525217B2
公开(公告)日：2013-09-03
申请号：US13593104
申请日：2012-08-23
申请人： Kentaro Nishiwaki , Tomonori Itoh , Masaru Nonomura
发明人： Kentaro Nishiwaki , Tomonori Itoh , Masaru Nonomura
IPC分类号： H01L33/00 , H01L27/14 , H01L31/0232 , H01L21/00
CPC分类号： H01L33/0095 , H01L24/27 , H01L24/743 , H01L24/97 , H01L2224/48091 , H01L2224/49107 , H01L2224/92247 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2924/00014
摘要： A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.
摘要翻译：用于树脂涂覆的装置用于制造包括用含有荧光体的树脂覆盖的LED元件的LED封装。在通过夹持单元63定位试验涂层材料43的状态下，用激发光照射施加到试验涂层材料43上的树脂的试验涂层，并且通过发射来测量从包含在树脂中的荧光体发射的光确定发光特性测量单元的测量结果与规定的发射特性的偏差，然后根据偏差导出适用于LED元件的适量的树脂用于实际生产。

8. 发明授权

US09147617B2 Resin coating device and a resin coating method 有权
标题翻译：树脂涂布装置和树脂涂布方法
公开(公告)号：US09147617B2
公开(公告)日：2015-09-29
申请号：US13885510
申请日：2012-05-30
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H01L21/66 , H01L33/50 , H01L23/00
CPC分类号： H01L22/12 , H01L24/97 , H01L33/50 , H01L2224/49107 , H01L2224/92247 , H01L2924/12041 , H01L2924/12042 , H01L2933/0041 , H01L2924/00
摘要： In a resin coating which is used in the manufacture of an LED package which is made by covering an LED element with resin that includes fluorescent substance, a light-passing member (43) on which the resin (8) is test coated for light emission characteristic measurement is carried on a light-passing member carrying unit (41), a deviation between a measurement result obtained after the light emission characteristic of the light that the resin (8) emits, when an light source unit (45), which is placed above, emits excitation light which excites the fluorescent substance, and irradiates the excitation light from above to the resin (8) which is coated on the light-passing member (43), is measured and the light emission characteristic prescribed beforehand is obtained, and an appropriate resin coating quantity with which the resin should be coated on the LED element is derived for practical production based on the deviation.
摘要翻译：在用于制造LED封装的树脂涂层中，所述LED封装通过用包含荧光物质的树脂覆盖LED元件而制成，其上涂有树脂（8）的发光元件（43）用于发光在光通过部件承载单元（41）上进行特性测量，即当光源单元（45）（即，树脂（8））发出时，在树脂（8）发射的光的发光特性之后获得的测量结果之间的偏差发射激发荧光物质的激发光，并将来自上面的激发光照射到涂覆在光通过部件（43）上的树脂（8）上，并获得预先规定的发光特性，基于偏差实现生产，得出在LED元件上涂布树脂的合适的树脂涂布量。

9. 发明授权

US09048177B2 Resin coating device, and resin coating method 有权
公开(公告)号：US09048177B2
公开(公告)日：2015-06-02
申请号：US14232670
申请日：2012-09-11
申请人： Seikou Abe , Masaru Nonomura
发明人： Seikou Abe , Masaru Nonomura
IPC分类号： H01L21/66 , H01L23/00 , H01L33/00 , G01N21/84
CPC分类号： H01L22/26 , G01N21/8422 , H01L22/10 , H01L24/27 , H01L24/83 , H01L24/97 , H01L33/005 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A translucent member 41 that has been trial-coated with a resin 8 for measurement of a light emission characteristic is placed on a translucent member placement portion 53, an excitation light that excites a phosphor is emitted from a light source unit 42 disposed above, the resin 8 coated on the translucent member 41 is irradiated with the excitation light from above, a deviation between a measurement result obtained by measuring the light emission characteristic of the light emitted from the resin 8, and a light emission characteristic specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED element for actual production is derived on the basis of the deviation.

10. 发明授权

US08956499B2 Plasma processing device 有权
标题翻译：等离子处理装置
公开(公告)号：US08956499B2
公开(公告)日：2015-02-17
申请号：US12671358
申请日：2008-08-21
申请人： Tatsuhiro Mizukami , Kiyoshi Arita , Masaru Nonomura
发明人： Tatsuhiro Mizukami , Kiyoshi Arita , Masaru Nonomura
IPC分类号： C23F1/08 , H01J37/32
CPC分类号： H01J37/32091 , H01J37/32935
摘要： An object is to provide a plasma processing device capable of accurately judging whether or not the proper maintenance time has come which is necessary for maintaining an operation state of a device in the best condition.A discharge detection sensor 23, in which a dielectric member 21 and a probe electrode unit 22 are combined with each other, is attached to an opening portion 2a provided in a lid portion 2 composing a vacuum chamber. A change in the electric potential induced in the probe electrode 22b according to a change in plasma discharge is received and whether or not the maintenance work is necessary is judged by comparing a counted value, which is obtained when a leak discharge wave-form counter 39 counts the number of times of the detection of detecting a V-type wave form of a V-shaped specific pattern, which is caused by leak discharge correlated with the attachment of foreign object in the vacuum chamber, by a V-type wave-form detecting portion 35, with an allowable value which has been previously set by a maintenance judging portion 44.
摘要翻译：本发明的目的是提供一种等离子体处理装置，其能够准确地判断维持设备的运行状态为最佳状态所需的适当的维护时间。将其中电介质构件21和探针电极单元22彼此组合的放电检测传感器23附接到设置在构成真空室的盖部分2中的开口部分2a。接收根据等离子体放电的变化而在探针电极22b中感应的电位的变化，并且通过比较当泄漏放电波形计数器39所获得的计数值来判断是否需要维护工作计数检测V型波形的V型波形的检测的次数，该V型波形由V型波形形成的泄漏放电引起，该泄漏放电与真空室中的异物的附着相关检测部分35具有由维护判断部分44预先设置的允许值。

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