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1. 发明申请

US20060006210A1 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same 有权
标题翻译：热分析的方法，装置和程序，使用其的加热控制器和加热炉
公开(公告)号：US20060006210A1
公开(公告)日：2006-01-12
申请号：US10523196
申请日：2003-07-30
申请人： Masaru Nonomura , Yoshimori Isobata , Hiroaki Onishi , Masahiro Taniguchi
发明人： Masaru Nonomura , Yoshimori Isobata , Hiroaki Onishi , Masahiro Taniguchi
IPC分类号： A47J36/02
CPC分类号： G05D23/1951 , H05K3/3494
摘要： Heating characteristic value at any measuring point of an object at any measuring location of an heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, temperature profile of the object heated under modified heating condition may be simulated in a short period of time without actually heating and measuring temperature of the object at high accuracy level. By using such simulation, appropriate heating condition for heating an object in accordance with desired heating condition may easily be determined.
摘要翻译：在加热炉的任何测量位置处的物体的任何测量点处的加热特性值通过使用在物体的测量点和加热温度（Ta）和加热时间（Ta）处测量的温度（Tint和Ts）而被确定为单一的 t）在加热炉的测量位置。可以在不使用物体的物理特性的情况下计算加热特性值（m值）。通过使用m值，可以在短时间内模拟在改进加热条件下加热的物体的温度分布，而实际上不会以高精度水平加热和测量物体的温度。通过使用这种模拟，可以容易地确定用于根据期望的加热条件加热物体的合适的加热条件。

2. 发明授权

US07549566B2 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method 有权
标题翻译：热分析方法，装置和程序，热控制器和加热炉采用该方法
公开(公告)号：US07549566B2
公开(公告)日：2009-06-23
申请号：US10523196
申请日：2003-07-30
申请人： Masaru Nonomura , Yoshinori Isobata , Hiroaki Onishi , Masahiro Taniguchi
发明人： Masaru Nonomura , Yoshinori Isobata , Hiroaki Onishi , Masahiro Taniguchi
IPC分类号： B23K31/02
CPC分类号： G05D23/1951 , H05K3/3494
摘要： A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.
摘要翻译：在加热炉的任何测量位置处的物体的任何测量点处的加热特性值通过使用在物体的测量点处测量的温度（Tint和Ts）和加热温度（Ta）和加热时间（Tint和Ts）而被确定为单一的（t）在加热炉的测量位置。可以在不使用物体的物理特性的情况下计算加热特性值（m值）。通过使用m值，可以在短时间内模拟在改进的加热条件下加热的物体的温度分布，而不实际加热并以高精度水平测量物体的温度。通过使用这样的模拟，可以容易地确定用于根据期望的加热条件加热物体的适当的加热条件。

3. 发明授权

US5693559A Method for printing solder paste 失效
标题翻译：焊膏印刷方法
公开(公告)号：US5693559A
公开(公告)日：1997-12-02
申请号：US631021
申请日：1996-04-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , H01L21/48
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的方法，所述方法包括以一个方向移动印刷电路板和屏蔽掩模板之一的步骤：在印刷焊膏之后与另一个分离，并且直到印刷电路板和屏蔽掩模板上移动的一个到达屏幕掩模板和印刷电路板之前的位置的板分离位置是完全的并且当印刷电路板和屏蔽掩模板中的移动的一个到达分隔位置时，将第一移动速度改变到高于第一移动速度的第二移动速度。

4. 发明授权

US5735203A Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board 失效
标题翻译：用于将焊膏印刷到印刷电路板并将屏蔽掩模板与印刷电路板分离的装置
公开(公告)号：US5735203A
公开(公告)日：1998-04-07
申请号：US762872
申请日：1996-12-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , B41F15/26
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的设备。该装置包括：在印刷焊膏之后，以与第一移动速度相对应的方向移动印刷电路板和屏蔽掩模板中的一个的装置，并且直到移动的印刷电路板屏幕掩模板到达位于屏幕掩模板之前的位置和印刷电路板完全分离的平板分离位置，以及控制器，用于将第一移动速度改变为高于当移动的印刷电路板和屏幕掩模板之一到达平板分离位置时的第一移动速度。

5. 发明授权

US07907743B2 Electro-acoustic transducer 有权
标题翻译：电声换能器
公开(公告)号：US07907743B2
公开(公告)日：2011-03-15
申请号：US11449908
申请日：2006-06-08
申请人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi , Ryuji Awamura
发明人： Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Hiroaki Onishi , Ryuji Awamura
IPC分类号： H04R25/00
CPC分类号： H04R19/00 , H04R19/016
摘要： An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.
摘要翻译：本发明的目的是提供一种具有吸收振动和高频噪声，减少部件数量以及同时防止热传导的效果的电声换能器。根据本发明的电声换能器包括：导电胶囊，具有用于将内部电路电连接到外部物体的开口; 从开口向外突出的端子; 以及作为开口侧上的胶囊的一部分并且与胶囊的内部结构间隔开的凸起部分。凸起部分和端子被布置成使得凸起部分和所有端子能够直接焊接到布线板。凸起部分可以以开口变窄的方式朝向端子延伸。此外，凸起部分可以具有延伸到胶囊的凸起部分和另一部分之间的边界的狭缝。

6. 发明申请

US20090080213A1 Light guide and image sensor module 审中-公开
标题翻译：光导和图像传感器模块
公开(公告)号：US20090080213A1
公开(公告)日：2009-03-26
申请号：US12283235
申请日：2008-09-10
申请人： Hiroaki Onishi , Hideki Sawada
发明人： Hiroaki Onishi , Hideki Sawada
IPC分类号： G02B6/00 , F21V33/00
CPC分类号： G02B6/001 , H04N1/02815 , H04N1/0282 , H04N1/02835
摘要： An elongated and generally columnar light guide includes a light receiving surface provided at an longitudinal end portion of the light guide, a reflecting surface elongated in the longitudinal direction of the light guide for reflecting light entering through the light receiving surface in a light emitting direction, a ridge elongated in the longitudinal direction of the light guide, and a light emitting surface for emitting reflected light from the reflecting surface as linear light extending in the longitudinal direction of the light guide. The reflecting surface is provided on a distal end portion of the ridge.
摘要翻译：细长且大致为柱状的导光体包括设在光导的纵向端部处的光接收表面，沿着光导的纵向方向延伸的反射表面，用于反射沿光发射方向进入光接收表面的光，在导光体的纵向方向上延伸的脊，以及用于发射来自反射面的反射光的发光面，作为在导光体的长度方向上延伸的直线光。反射表面设置在脊的远端部分上。

7. 发明申请

US20070285740A1 Image sensor module 审中-公开
标题翻译：图像传感器模块
公开(公告)号：US20070285740A1
公开(公告)日：2007-12-13
申请号：US11799106
申请日：2007-04-30
申请人： Hiroaki Onishi , Hideki Sawada , Hiromi Ogata
发明人： Hiroaki Onishi , Hideki Sawada , Hiromi Ogata
IPC分类号： H04N1/04
CPC分类号： H05K1/148 , H04N1/02815 , H04N1/02835 , H04N1/0312 , H04N1/0315 , H04N1/0318 , H04N2201/03112 , H04N2201/03133 , H04N2201/03141 , H04N2201/03145 , H04N2201/03179 , H05K1/0306 , H05K3/0052 , H05K3/3405 , H05K3/3447 , H05K3/366 , H05K2201/09063 , H05K2201/0909 , H05K2201/09181 , H05K2201/0969 , H05K2201/10106 , H05K2201/1034 , H05K2201/10386 , H05K2201/10446
摘要： An image sensor module includes a first substrate, a second substrate, a plurality of light receiving elements mounted on the first substrate, a light source mounted on the second substrate, and a light guide for emitting light from the light source as linear light extending in the primary scanning direction. The light receiving elements are aligned in the primary scanning direction. The second substrate is arranged perpendicularly to the primary scanning direction. The light source includes an LED chip mounted on the second substrate.
摘要翻译：图像传感器模块包括第一基板，第二基板，安装在第一基板上的多个光接收元件，安装在第二基板上的光源，以及用于从光源发射光的光导，主扫描方向。光接收元件在主扫描方向上对齐。第二基板垂直于主扫描方向布置。光源包括安装在第二基板上的LED芯片。

8. 发明申请

US20070145575A1 Circuit board and method for mounting chip component 失效
标题翻译：电路板和安装芯片组件的方法
公开(公告)号：US20070145575A1
公开(公告)日：2007-06-28
申请号：US10587280
申请日：2005-01-25
申请人： Masato Mori , Masato Hirao , Hiroaki Onishi , Kiyoshi Nakanishi , Akihiko Odani
发明人： Masato Mori , Masato Hirao , Hiroaki Onishi , Kiyoshi Nakanishi , Akihiko Odani
IPC分类号： H01L23/34
CPC分类号： H05K1/023 , H01L2224/16225 , H01L2924/19105 , H05K1/181 , H05K3/3442 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , Y02P70/611
摘要： A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.
摘要翻译：电路板包括其上形成有电极图案的基板，安装在基板上的第一芯片部件和安装在与基板相对的第一芯片部件的电极侧的第二芯片部件。第二芯片部件在一个电极处接合到第一芯片部件的电极，并且还在另一个电极处接合到第一芯片部件的电极。通过以多级堆叠芯片部件，可以在基板上安装高密度的芯片部件，从而能够减小电路板的尺寸。

9. 发明授权

US07215448B2 Image reading apparatus 有权
标题翻译：图像读取装置
公开(公告)号：US07215448B2
公开(公告)日：2007-05-08
申请号：US11104464
申请日：2005-04-13
申请人： Hiroaki Onishi
发明人： Hiroaki Onishi
IPC分类号： H04N1/04
CPC分类号： H04N1/031
摘要： An image reading apparatus (A) includes a plurality of light sources (6) arranged in a row, and a hollow portion (14) for guiding light emitted from the light sources toward an image read line (S). The hollow portion (14) is divided by a plurality of partitions (15) into a plurality of individual sections (14a). As a result, it is possible to illuminate the longitudinally opposite ends and longitudinally central portion of the image read line (S) uniformly.
摘要翻译：图像读取装置（A）包括排列成行的多个光源（6）和用于将从光源发射的光朝向图像读取线（S）引导的中空部（14）。中空部分（14）被多个隔板（15）分成多个单独部分（14a）。结果，可以均匀地照射图像读取线（S）的纵向相对端部和纵向中央部分。

10. 发明授权

US07166907B2 Image sensor module with substrate and frame and method of making the same 有权
标题翻译：具有基板和框架的图像传感器模块及其制作方法
公开(公告)号：US07166907B2
公开(公告)日：2007-01-23
申请号：US10439268
申请日：2003-05-13
申请人： Hiroaki Onishi , Hisayoshi Fujimoto
发明人： Hiroaki Onishi , Hisayoshi Fujimoto
IPC分类号： H01L23/02
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2924/3025 , H04N5/2254 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module (S) includes a substrate (4) having a projecting portion (41) projecting sideways from a frame (3). The projecting portion (41) has an end (4b) provided with a plurality of terminals (81) electrically connected to an image sensor chip (5). The image sensor module (X) can be easily connected to another apparatus by inserting the end (4b) of the projecting portion (41) into a socket type connector.
摘要翻译：图像传感器模块（S）包括具有从框架（3）侧向突出的突出部分（41）的基板（4）。突出部分（41）具有设置有电连接到图像传感器芯片（5）的多个端子（81）的端部（4b）。通过将突出部分（41）的端部（4b）插入插座型连接器中，图像传感器模块（X）可以容易地连接到另一装置。

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