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1. 发明授权

US08525217B2 Method and device for resin coating 有权
标题翻译：树脂涂层的方法和装置
公开(公告)号：US08525217B2
公开(公告)日：2013-09-03
申请号：US13593104
申请日：2012-08-23
申请人： Kentaro Nishiwaki , Tomonori Itoh , Masaru Nonomura
发明人： Kentaro Nishiwaki , Tomonori Itoh , Masaru Nonomura
IPC分类号： H01L33/00 , H01L27/14 , H01L31/0232 , H01L21/00
CPC分类号： H01L33/0095 , H01L24/27 , H01L24/743 , H01L24/97 , H01L2224/48091 , H01L2224/49107 , H01L2224/92247 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2924/00014
摘要： A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.
摘要翻译：用于树脂涂覆的装置用于制造包括用含有荧光体的树脂覆盖的LED元件的LED封装。在通过夹持单元63定位试验涂层材料43的状态下，用激发光照射施加到试验涂层材料43上的树脂的试验涂层，并且通过发射来测量从包含在树脂中的荧光体发射的光确定发光特性测量单元的测量结果与规定的发射特性的偏差，然后根据偏差导出适用于LED元件的适量的树脂用于实际生产。

2. 发明申请

US20050144779A1 Components placing apparatus 失效
标题翻译：零件放置装置
公开(公告)号：US20050144779A1
公开(公告)日：2005-07-07
申请号：US11073715
申请日：2005-03-08
申请人： Youichi Nakamura , Kunio Sakurai , Kazumasa Okumura , Ken Takano , Minoru Yamamoto , Hirokazu Honkawa , Kentaro Nishiwaki , Yoshihiko Misawa
发明人： Youichi Nakamura , Kunio Sakurai , Kazumasa Okumura , Ken Takano , Minoru Yamamoto , Hirokazu Honkawa , Kentaro Nishiwaki , Yoshihiko Misawa
IPC分类号： H05K13/02 , B23P19/00
CPC分类号： H05K13/02 , Y10S29/044 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/5136 , Y10T29/53083 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53196 , Y10T29/53261
摘要： A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.
摘要翻译：电子部件放置装置沿板的传送方向的实质的设备宽度是将电子部件放置在沿板传送方向具有长度L的板上的总尺寸为4L + SL。具体地，4L表示第一板退避位置，第一部件放置位置，第二板退避位置和第二部件放置位置的长度之和的长度。此外，SL表示用于定位设置在第一板退避位置，第一部件放置位置，第二板退避位置和第二部件放置位置中的每一个处的板停止机构的空间的长度之和的长度。最后，实质的装置宽度包括在450mm和1000mm之间。

3. 发明授权

US09241388B2 Method and apparatus for manufacturing a light-emitting device including correction of an application amount of a fluorescent resin based on a fluorescent particle concentration 有权
标题翻译：用于制造发光装置的方法和装置，包括基于荧光颗粒浓度校正荧光树脂的施用量
公开(公告)号：US09241388B2
公开(公告)日：2016-01-19
申请号：US13700145
申请日：2012-05-11
申请人： Hirotoshi Oikaze , Katsuyuki Nagahama , Kentaro Nishiwaki , Yasuhiro Kabetani
发明人： Hirotoshi Oikaze , Katsuyuki Nagahama , Kentaro Nishiwaki , Yasuhiro Kabetani
IPC分类号： B05C11/00 , H05B33/10 , H01L33/50 , B05C11/10 , B05D5/06 , G01N21/84 , B05B12/08
CPC分类号： H05B33/10 , B05B12/084 , B05C11/1005 , G01N2021/8427 , H01L33/50 , H01L33/502 , H01L2933/0041
摘要： A method of manufacturing a light-emitting device which includes a light-emitting source is provided by applying, onto the light-emitting source, a fluorescent resin which includes fluorescent particles and is stored in and discharged from an applicator. The method includes measuring a first concentration which is a concentration of the fluorescent particles included in the fluorescent resin discharged from the applicator; and applying, onto the light-emitting source, the fluorescent resin in an application amount determined based on the first concentration which has been measured and reference data which indicates a relationship between a concentration of the fluorescent particles and an application amount of the fluorescent resin that enables the light-emitting device to have constant chromaticity.
摘要翻译：通过在发光源上施加包含荧光粒子并被存储在涂布器中并从涂布器排出的荧光树脂来提供制造包括发光源的发光器件的方法。该方法包括测量作为从敷贴器排出的荧光树脂中包含的荧光颗粒的浓度的第一浓度; 并且以基于已测量的第一浓度确定的施用量和荧光树脂的浓度与荧光树脂的施用量之间的关系的参考数据将荧光树脂施加到发光源上，使得发光装置具有恒定的色度。

4. 发明申请

US20130164865A1 METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE AND APPARATUS FOR MANUFACTURING LIGHT-EMITTING DEVICE 有权
标题翻译：制造发光装置的方法和制造发光装置的装置
公开(公告)号：US20130164865A1
公开(公告)日：2013-06-27
申请号：US13700145
申请日：2012-05-11
申请人： Hirotoshi Oikaze , Katsuyuki Nagahama , Kentaro Nishiwaki , Yasuhiro Kabetani
发明人： Hirotoshi Oikaze , Katsuyuki Nagahama , Kentaro Nishiwaki , Yasuhiro Kabetani
IPC分类号： H01L33/50
CPC分类号： H05B33/10 , B05B12/084 , B05C11/1005 , G01N2021/8427 , H01L33/50 , H01L33/502 , H01L2933/0041
摘要： A method of manufacturing a light-emitting device which includes a light-emitting source by applying, onto the light-emitting source, a fluorescent resin which includes fluorescent particles and is stored in and discharged from an applicator, the method includes: measuring a first concentration which is a concentration of the fluorescent particles included in the fluorescent resin discharged from the applicator; and applying, onto the light-emitting source, the fluorescent resin in an application amount determined based on the first concentration which has been measured and reference data which indicates a relationship between a concentration of the fluorescent particles and an application amount of the fluorescent resin that enables the light-emitting device to have constant chromaticity.
摘要翻译：一种制造发光器件的方法，该发光器件包括通过在发光源上施加包含荧光颗粒并存储在涂布器中并从涂布器排出的荧光树脂的发光源，该方法包括：测量第一浓度，其是从涂布器排出的荧光树脂中包含的荧光颗粒的浓度; 并且以基于已测量的第一浓度确定的施用量和荧光树脂的浓度与荧光树脂的施用量之间的关系的参考数据将荧光树脂施加到发光源上，使得发光装置具有恒定的色度。

5. 发明授权

US07165318B2 Components placing apparatus 失效
标题翻译：零件放置装置
公开(公告)号：US07165318B2
公开(公告)日：2007-01-23
申请号：US11073715
申请日：2005-03-08
申请人： Youichi Nakamura , Kunio Sakurai , Kazumasa Okumura , Ken Takano , Minoru Yamamoto , Hirokazu Honkawa , Kentaro Nishiwaki , Yoshihiko Misawa
发明人： Youichi Nakamura , Kunio Sakurai , Kazumasa Okumura , Ken Takano , Minoru Yamamoto , Hirokazu Honkawa , Kentaro Nishiwaki , Yoshihiko Misawa
IPC分类号： H05K3/32
CPC分类号： H05K13/02 , Y10S29/044 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/5136 , Y10T29/53083 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53196 , Y10T29/53261
摘要： A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.
摘要翻译：电子部件放置装置沿板的传送方向的实质的设备宽度是将电子部件放置在沿板传送方向具有长度L的板上的总尺寸为4L + SL。具体地，4L表示第一板退避位置，第一部件放置位置，第二板退避位置和第二部件放置位置的长度之和的长度。此外，SL表示用于定位设置在第一板退避位置，第一部件放置位置，第二板退避位置和第二部件放置位置中的每一个处的板停止机构的空间的长度之和的长度。最后，实质的装置宽度包括在450mm和1000mm之间。

6. 发明授权

US07657997B2 Reference position determining method 失效
标题翻译：参考位置确定方法
公开(公告)号：US07657997B2
公开(公告)日：2010-02-09
申请号：US11201134
申请日：2005-08-11
申请人： Kentaro Nishiwaki , Yoichiro Ueda , Takayuki Fukae
发明人： Kentaro Nishiwaki , Yoichiro Ueda , Takayuki Fukae
IPC分类号： H05K3/00 , H05K3/32 , H05K13/00 , H05K13/04
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/1216 , H05K13/0015 , H05K13/0413 , H05K13/0818 , H05K2201/09918 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53174
摘要： In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.
摘要翻译：在打印装置中，基于由图像获取单元获取的图像由标记位置获取部分获取用于保持在传送托盘上的多个FPC上设置的四个物体标记的位置的各个位置数据。在位移标记指定部中，确定四个对象标记的相对位置关系，并与参考位置关系进行比较，通过该参考位置关系指定移位的对象标记。然后，在基准位置确定部分中，基于从四个对象标记中排除移位的对象标记得到的多个对象标记来确定传送托盘上的多个FPC的基准位置。因此，可以高精度地确定在打印单元中执行打印的参考位置。

7. 发明申请

US20060048383A1 Reference position determining method and apparatus for electronic component mounting 失效
标题翻译：用于电子元件安装的参考位置确定方法和装置
公开(公告)号：US20060048383A1
公开(公告)日：2006-03-09
申请号：US11201134
申请日：2005-08-11
申请人： Kentaro Nishiwaki , Yoichiro Ueda , Takayuki Fukae
发明人： Kentaro Nishiwaki , Yoichiro Ueda , Takayuki Fukae
IPC分类号： G05D1/02
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/1216 , H05K13/0015 , H05K13/0413 , H05K13/0818 , H05K2201/09918 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53174
摘要： In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.
摘要翻译：在打印装置中，基于由图像获取单元获取的图像由标记位置获取部分获取用于保持在传送托盘上的多个FPC上设置的四个物体标记的位置的各个位置数据。在位移标记指定部中，确定四个对象标记的相对位置关系，并与参考位置关系进行比较，通过该参考位置关系指定移位的对象标记。然后，在基准位置确定部分中，基于从四个对象标记中排除移位的对象标记得到的多个对象标记来确定传送托盘上的多个FPC的基准位置。因此，可以高精度地确定在打印单元中执行打印的参考位置。

8. 发明授权

US5787825A Seeding machine with sensor controlled planting at predetermined depth 失效
标题翻译：播种机具有预定深度的传感器控制种植
公开(公告)号：US5787825A
公开(公告)日：1998-08-04
申请号：US831870
申请日：1997-04-02
申请人： Yukio Yaji , Nobuo Ito , Kota Motobayashi , Kentaro Nishiwaki , Shinichi Mujinazawa , Kazuhiro Kudo , Hisaya Tanaka
发明人： Yukio Yaji , Nobuo Ito , Kota Motobayashi , Kentaro Nishiwaki , Shinichi Mujinazawa , Kazuhiro Kudo , Hisaya Tanaka
IPC分类号： A01C7/04 , A01C7/08 , A01C7/20 , A01C7/00
CPC分类号： A01C7/203 , A01C7/081
摘要： A seeding machine comprises: an air compressor for generating a positive air pressure; a soil hardness sensor for measuring soil hardness so as to produce a control signal to adjust the positive air pressure generated by the compressor; an air pressure adjuster for adjusting the positive air pressure generated by the air compressor in accordance with the control signal produced by the soil hardness sensor; a negative air pressure generator for generating a negative air pressure by making use of air under the positive air pressure; a change-over valve for effecting a change-over operation between the positive air pressure and the negative air pressure, so as to selectively supply the positive air pressure or the negative air pressure; a seed adsorber for catching a seed by virtue of the negative air pressure; a first air cylinder adapted to extend or contract by the positive air pressure, to cause a certain reciprocating movement of the seed adsorber; a second air cylinder adapted to extend or contract by the positive air pressure, to cause a reciprocating movement of the seed adsorber between a seed catching position and a seed ejecting position.
摘要翻译：播种机包括：空气压缩机，用于产生正气压; 用于测量土壤硬度的土壤硬度传感器，以产生控制信号，以调节由压缩机产生的正气压; 空气压力调节器，用于根据由土壤硬度传感器产生的控制信号调节由空气压缩机产生的正空气压力; 负气压发生器，用于通过在正气压下利用空气产生负气压; 用于实现正空气压力和负气压之间的转换操作的换向阀，以便选择性地供应正气压或负气压; 用于通过负空气压力捕获种子的种子吸附器; 适于通过正气压延伸或收缩的第一气缸，以引起种子吸附器的一定的往复运动; 适于通过正空气压力延伸或收缩的第二气缸，以使种子吸附器在种子捕捉位置和种子喷射位置之间往复运动。

9. 发明授权

US09246073B2 Mounting structure, and method of manufacturing mounting structure 有权
标题翻译：安装结构和安装结构的制造方法
公开(公告)号：US09246073B2
公开(公告)日：2016-01-26
申请号：US13000784
申请日：2009-06-18
申请人： Tatsuo Sasaoka , Kaori Toyoda , Kentaro Nishiwaki , Hiroki Ikeuchi , Hiroshi Nasu
发明人： Tatsuo Sasaoka , Kaori Toyoda , Kentaro Nishiwaki , Hiroki Ikeuchi , Hiroshi Nasu
IPC分类号： B23K31/02 , H01L33/62 , B23K35/02 , B23K1/00 , H01L23/00 , H01L33/64 , H05K3/32 , H01L21/56 , H01L31/024 , H05K3/40
CPC分类号： H01L33/62 , B23K1/0016 , B23K35/0244 , B23K35/025 , H01L21/563 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L31/024 , H01L33/641 , H01L33/647 , H01L2224/0401 , H01L2224/06102 , H01L2224/16225 , H01L2224/29076 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83192 , H01L2224/83207 , H01L2224/83385 , H01L2224/838 , H01L2224/8384 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0665 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H05K3/321 , H05K3/4007 , H05K2201/0367 , H05K2201/10106 , H05K2201/10166 , H05K2201/2036 , H05K2203/1131 , H05K2203/1178 , H01L2924/00 , H01L2924/00012 , H01L2924/01014 , H01L2224/29298 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00014
摘要： A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.
摘要翻译：提供一种安装结构，其可以允许当执行热处理时产生的气体有效地逸出到外部。安装结构10包括具有电极2a和2b的基板1，具有电极21a和21b的电子部件3，将基板1的电极2a和2b与电子部件的电极21a和21b电连接的接头15a和15b 并且还将电子部件3固定到基板1的表面，以及与基板1的电极2a和电子部件3的电极21a抵接并用作间隔件的凸部4。

10. 发明申请

US20110114706A1 MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE 有权
标题翻译：安装结构和制造安装结构的方法
公开(公告)号：US20110114706A1
公开(公告)日：2011-05-19
申请号：US13000784
申请日：2009-06-18
申请人： Tatsuo Sasaoka , Kaori Toyoda , Kentaro Nishiwaki , Hiroki Ikeuchi , Hiroshi Nasu
发明人： Tatsuo Sasaoka , Kaori Toyoda , Kentaro Nishiwaki , Hiroki Ikeuchi , Hiroshi Nasu
IPC分类号： B23K31/02 , H05K3/32
CPC分类号： H01L33/62 , B23K1/0016 , B23K35/0244 , B23K35/025 , H01L21/563 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L31/024 , H01L33/641 , H01L33/647 , H01L2224/0401 , H01L2224/06102 , H01L2224/16225 , H01L2224/29076 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83192 , H01L2224/83207 , H01L2224/83385 , H01L2224/838 , H01L2224/8384 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0665 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H05K3/321 , H05K3/4007 , H05K2201/0367 , H05K2201/10106 , H05K2201/10166 , H05K2201/2036 , H05K2203/1131 , H05K2203/1178 , H01L2924/00 , H01L2924/00012 , H01L2924/01014 , H01L2224/29298 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00014
摘要： A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.
摘要翻译：提供一种安装结构，其可以允许当执行热处理时产生的气体有效地逸出到外部。安装结构10包括具有电极2a和2b的基板1，具有电极21a和21b的电子部件3，将基板1的电极2a和2b与电子部件的电极21a和21b电连接的接头15a和15b 并且还将电子部件3固定到基板1的表面，以及与基板1的电极2a和电子部件3的电极21a抵接并用作间隔件的凸部4。

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