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    • 2. 发明授权
    • Floor structure for indoor artificial skiing ground
    • 室内人造滑雪场地板结构
    • US5199815A
    • 1993-04-06
    • US722330
    • 1991-07-02
    • Masanori InoueSusumu Kishi
    • Masanori InoueSusumu Kishi
    • E01C13/12
    • E01C13/12
    • A floor structure for indoor artificial skiing ground comprises, a concrete base plate constructed on foundations, a first waterproof covering disposed on the base plate, a heat insulation layer located on the first waterproof covering, a second waterproof covering disposed on the heat insulation layer, a concrete pressing plate location on the second waterproof covering, and a plurality of drainage grooves formed on top of the pressing plate.Another floor structure for indoor artificial skiing ground comprises, a concrete base plate constructed on foundations, a first waterproof covering disposed on the base plate, a heat insulation layer located on the first waterproof covering, a second waterproof covering disposed on the heat insulation layer, and a slip preventive layer located on the second waterproof covering.
    • 室内人造滑雪地板的地板结构包括:基座构成的混凝土基板,设置在基板上的第一防水罩,位于第一防水罩上的隔热层,设置在隔热层上的第二防水罩, 在第二防水覆盖物上的混凝土压板位置,以及形成在压板顶部的多个排水槽。 室内人造滑雪场的另一楼层结构包括:基座构成的混凝土基板,设置在基板上的第一防水罩,位于第一防水罩上的绝热层,设置在隔热层上的第二防水罩, 以及位于第二防水罩上的防滑层。
    • 3. 发明授权
    • Method for producing snow and apparatus therefor
    • 生产雪花及其装置的方法
    • US5102044A
    • 1992-04-07
    • US655219
    • 1991-02-12
    • Masanori InoueSusumu KishiKatsutoshi Harima
    • Masanori InoueSusumu KishiKatsutoshi Harima
    • F25C3/04
    • F25C3/04F25C2303/0481
    • A method for artificially producing snow, which is used for an indoor skiing facility. The method comprises maintaining an inside temperature of the indoor skiing facility of 0.degree. C. or less and blowing air and water with an air-water ratio of 300 to 3000 Nm.sup.3 /m.sup.3 in volume from a plurality of two-fluid spraying nozzles to generate and spread waterdrops of a particle size of 5 to 200 .mu.m, into the indoor skiing facility. The spray nozzles are disposed adjacent an upper portion of a cover enclosure of the indoor skiing facility. An apparatus for artificially producing snow. The apparatus comprising an indoor skiing facility having a floor and a cover enclosure comprising a ceiling and side walls. The cover enclosure and the floor are made from an insulating material. Holes are provided for blowing cold air into the indoor skiing facilities. The holes for blowing air are disposed adjacent an upper portion of the cover enclosure. Holes are provided for exhausting air from the indoor skiing facilities. The holes for exhausting air are disposed adjacent a comparatively lower portion of the side walls of the cover enclosure. A plurality of two-fluid spray nozzles are provided for blowing air and water into the indoor skiing facilities. The spray nozzles are disposed adjacent the upper portion of the cover enclosure.
    • 一种人造雪的方法,用于室内滑雪设备。 该方法包括将室内滑雪设备的内部温度保持在0℃以下,并且从多个二流体喷嘴喷射空气和水,空气和水的体积比为300〜3000Nm 3 / m 3,以产生 并将粒径为5〜200μm的水滴散布到室内滑雪设备中。 这些喷嘴设置在室内滑雪设备的盖罩的上部附近。 一种用于人造雪的装置。 该装置包括具有地板的室内滑雪设备和包括天花板和侧壁的盖罩。 盖罩和地板由绝缘材料制成。 提供用于将冷空气吹入室内滑雪设施的孔。 用于吹送空气的孔邻近盖罩的上部设置。 提供孔用于从室内滑雪设备排出空气。 用于排出空气的孔邻近盖罩的侧壁的相对较低的部分设置。 提供多个双流体喷嘴,用于将空气和水吹入室内滑雪设备。 喷嘴靠近盖罩的上部设置。
    • 4. 发明授权
    • Short-circuit protective circuit and power darlington transistor module
    • 短路保护电路和功率达林顿晶体管模块
    • US5526214A
    • 1996-06-11
    • US127609
    • 1993-09-28
    • Ikunori TakataMasanori Inoue
    • Ikunori TakataMasanori Inoue
    • H01L29/73H01L21/331H03K17/08H03K17/082H03K17/615H02H7/20H02H9/04
    • H03K17/0826H03K17/615
    • The present invention is directed to effectively prevent "load short-circuit breakdown" of a power Darlington transistor. When a potential different between a base BX and emitter E at a final stage of a power Darlington transistor (20) is at a specified level of voltage determined by base-emitter forward voltage of a protective bipolar transistor (32), the protective bipolar transistor (32) turns on, and accordingly, base current I.sub.B at an initial stage of the power Darlington transistor (20) is bypassed to the emitter E at the final stage. Hence, excessive rising of collector current I.sub.C of the Darlington transistor (20) is suppressed, and "load short-circuit breakdown" is prevented. The potential difference does not depend upon the number of stages of the Darlington transistor nor temperature, and therefore, it is facilitated for Darlington transistors of various numbers of stages to design a short-circuit protective circuit to ensure a specified bypass operation in the whole range of working temperature.
    • 本发明旨在有效地防止功率达林顿晶体管的“负载短路故障”。 当功率达林顿晶体管(20)的最后级的基极BX和发射极E之间的电位处于由保护双极晶体管(32)的基极 - 发射极正向电压确定的电压的指定电平时,保护双极晶体管 (32)导通,因此,在最终阶段,在功率达林顿晶体管(20)的初始阶段的基极电流IB被旁路到发射极E. 因此,抑制了达林顿晶体管(20)的集电极电流IC的过度上升,并且防止了“负载短路击穿”。 电位差不取决于达林顿晶体管的级数和温度,因此,为各种级数的达林顿晶体管设计短路保护电路,以便在整个范围内确保指定的旁路工作, 的工作温度。
    • 8. 发明授权
    • Semiconductor device having breakdown voltage maintaining structure and its manufacturing method
    • 具有击穿电压保持结构的半导体器件及其制造方法
    • US07911020B2
    • 2011-03-22
    • US12171193
    • 2008-07-10
    • Yasushi NiimuraTakashi KobayashiMasanori InoueYasuhiko Onishi
    • Yasushi NiimuraTakashi KobayashiMasanori InoueYasuhiko Onishi
    • H01L29/02
    • H01L29/7811H01L29/0615H01L29/0619H01L29/0638H01L29/1095H01L29/404H01L29/41741H01L2924/0002H01L2924/00
    • A semiconductor device has an active portion having at least one well region in a semiconductor layer, and a breakdown voltage maintaining structure surrounding the active portion. The maintaining structure includes a conductor layer over each of a plurality of guard rings with an insulating film interposed in between and connected to the respective guard ring. An inner side end portion of each conductor layer projects over the immediate adjacent inner side guard ring. The impurity concentration of the guard rings is set between the impurity concentrations of the semiconductor layer and the well regions. A field plate can extend over the innermost conductor layer with the insulating film interposed in between. The field plate is in contact with the outermost well region and is in contact with the first conductor layer. The outer side end of the field plate extends outwardly beyond an outer side end of the innermost conductor layer. With these arrangements, the guard rings can be shortened and the chip size can be reduced. Furthermore, the device can be made less susceptible to external charge.
    • 半导体器件具有在半导体层中具有至少一个阱区的有源部分和围绕有源部分的击穿电压保持结构。 保持结构包括在多个保护环中的每一个上的导体层,绝缘膜介于其间并连接到相应的保护环。 每个导体层的内侧端部突出在紧邻的内侧保护环上。 保护环的杂质浓度设定在半导体层和阱区的杂质浓度之间。 场板可以在绝缘膜介于其间的最内侧的导体层上延伸。 场板与最外层区域接触并与第一导体层接触。 场板的外侧端部向外延伸超出最内侧导体层的外侧端部。 通过这些布置,可以缩短保护环,并且可以减小芯片尺寸。 此外,可以使该装置不易受到外部充电的影响。