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    • 3. 发明申请
    • IMPEDANCE MATCHING DEVICE AND CONTROL METHOD
    • 阻抗匹配装置和控制方法
    • US20140191819A1
    • 2014-07-10
    • US14124359
    • 2011-06-07
    • Masami Suzuki
    • Masami Suzuki
    • H03H7/40
    • H03H7/40H01F38/14H02J5/005H02J7/025H02J17/00H02J50/10H02J50/12H02J50/20H02J50/80H02J50/90H04B5/0037
    • In an impedance matching device, a storage unit stores a control value representing a load value and a value equivalent to input impedance in advance. The control value identifies inductance and capacitance values matching a predetermined impedance value by use of either a first or second matching circuit. An impedance estimation unit estimates input impedance of the power transmission antenna. The load value estimation unit estimates load value of a circuit connected to a power reception antenna and consuming transmitted electric power. A circuit selection unit electrically connects the first matching circuit, the second matching circuit, or a through circuit per the load value and the input impedance equivalent value. A control value output unit reads out the control value stored in the storage unit based on the load value and the input impedance equivalent value, and outputs the control value to the circuit selected by the circuit selection unit.
    • 在阻抗匹配装置中,存储单元预先存储表示负载值和等于输入阻抗的值的控制值。 控制值通过使用第一或第二匹配电路来识别与预定阻抗值匹配的电感和电容值。 阻抗估计单元估计输电天线的输入阻抗。 负载值估计单元估计连接到受电天线的电路的负载值并消耗发送电力。 电路选择单元根据负载值和输入阻抗等效值将第一匹配电路,第二匹配电路或贯通电路电连接。 控制值输出单元基于负载值和输入阻抗等效值读出存储在存储单元中的控制值,并将控制值输出到由电路选择单元选择的电路。
    • 6. 发明授权
    • Boat propulsion unit
    • 船推进单位
    • US08047885B2
    • 2011-11-01
    • US12468121
    • 2009-05-19
    • Daisuke NakamuraYoshihiko OkabeYoshihito FukuokaMasami Suzuki
    • Daisuke NakamuraYoshihiko OkabeYoshihito FukuokaMasami Suzuki
    • B63H20/14
    • B63H20/20
    • A boat propulsion unit has a construction that prevents a structure near a drive shaft from becoming complicated and increased in size. The boat propulsion unit preferably in the form of an outboard motor includes a front propeller that is rotated together with a front propeller drive shaft during both forward travel and reverse travel of the boat, a rear propeller that is rotated together with a rear propeller drive shaft in an opposite direction of the front propeller during both of the forward travel and the reverse travel of the boat, and a forward-reverse drive that is arranged on an axis of the front propeller drive shaft and the rear propeller drive shaft, and that can be switched between a direction in which the front propeller drive shaft and the rear propeller drive shaft are rotated during the forward travel of the boat and a direction in which the front propeller drive shaft and the rear propeller drive shaft are rotated during the reverse travel of the boat.
    • 船推进单元具有防止驱动轴附近的结构变得复杂和尺寸增加的结构。 优选为舷外马达形式的船推进单元包括在船的向前行进和反向行进期间与前螺旋桨驱动轴一起旋转的前螺旋桨,与螺旋桨传动轴一起旋转的后推进器 在船的前进行驶和反向行驶期间在前螺旋桨的相反方向上,以及布置在前螺旋桨传动轴和后螺旋桨驱动轴的轴线上的前后倒档驱动器,并且可以 在前轮驱动轴和后推进器驱动轴在船的向前行进期间旋转的方向与前推进器驱动轴和后螺旋桨驱动轴在逆向行驶期间旋转的方向之间切换 小舟。
    • 9. 发明申请
    • Semiconductor device having a chip-size package
    • 具有芯片尺寸封装的半导体器件
    • US20090146287A1
    • 2009-06-11
    • US12000745
    • 2007-12-17
    • Yoshikazu TakahashiMasami SuzukiMasaru Kimura
    • Yoshikazu TakahashiMasami SuzukiMasaru Kimura
    • H01L23/48
    • H01L23/49572H01L23/13H01L23/49816H01L23/4985H01L25/105H01L2224/16H01L2224/73204H01L2225/1023H01L2225/1041H01L2225/1058H01L2924/01078H01L2924/01079H01L2924/15311
    • Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided into a device-mounting film portion having a device hole forming therein, an external-connection film portion, and a bent portion located between the device-mounting film portion and the external-connection film portion, an external electrode pad being formed on the external-connection film portion on a first surface side of the package film, an inner lead being formed in such a manner as to lead from the device hole to the external electrode pad via the bending portion; mounting a semiconductor chip on the device-mounting film portion on the first surface side by bonding the inner lead to an electrode pad of the semiconductor chip in a region where the device hole is formed; and bending the external-connection film portion at the bending portion 180° toward a second surface side of the package film and fixing the same. The method for mounting a semiconductor device on a mother board in close contact therewith includes the steps of: depositing solder balls on electrode pads of the mother board; and placing the semiconductor device on the mother board and melting the solder balls so as to electrically connect the electrode pads of the mother board and the external electrode pads of the semiconductor device.
    • 公开了一种半导体器件及其制造方法及其安装方法。 制造半导体器件的方法包括以下步骤:制备具有平面形状的封装膜,其区域被分成具有形成器件孔的器件安装膜部分,外部连接膜部分和位于 在所述装置安装膜部分和所述外部连接膜部分之间,在所述封装膜的第一表面侧的所述外部连接膜部分上形成外部电极焊盘,所述内部引线形成为引导 从所述装置孔经由所述弯曲部到所述外部电极焊盘; 通过在形成器件孔的区域中将内部引线接合到半导体芯片的电极焊盘,将半导体芯片安装在第一表面侧的器件安装膜部分上; 并且将弯曲部分处的外部连接膜部分朝向封装膜的第二表面侧弯曲180°并将其固定。 将半导体器件与母板紧密接触的方法包括以下步骤:在母板的电极焊盘上沉积焊球; 并将半导体器件放置在母板上并熔化焊球,以将母板的电极焊盘和半导体器件的外部电极焊盘电连接。