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1. 发明申请

US20050255610A1 Semiconductor wafer shape evaluating method and shape evaluating device 有权
标题翻译：半导体晶片形状评估方法和形状评估装置
公开(公告)号：US20050255610A1
公开(公告)日：2005-11-17
申请号：US10517655
申请日：2003-06-10
申请人： Masakazu Sato , Masato Onishi
发明人： Masakazu Sato , Masato Onishi
IPC分类号： G01B21/20 , G01B11/06 , G01B11/24 , G01B21/08 , G01R31/26 , H01L21/66
CPC分类号： G01B7/08 , G01B11/06 , G01B11/24
摘要： The present invention is a method of evaluating a shape of a semiconductor wafer comprising the steps of: measuring shape data of a semiconductor wafer by scanning a front surface and/or a back surface of the semiconductor wafer; calculating a differential profile through a differential process of the measured shape data; analyzing the obtained differential profile and obtaining a surface characteristic of the wafer, and; evaluating a shape of the semiconductor wafer. Thereby, there are provided a method of evaluating a shape of a semiconductor wafer and an apparatus for evaluating a shape thereof, wherein a shape of a semiconductor wafer, particularly a shape of a peripheral portion of the wafer, can be quantitatively evaluated from a viewpoint different from conventional SFQR etc., and the shape quality of the wafer can be accurately evaluated over a specification of a strict design rule.
摘要翻译：本发明是一种评估半导体晶片的形状的方法，包括以下步骤：通过扫描半导体晶片的前表面和/或背表面来测量半导体晶片的形状数据; 通过测量的形状数据的差分过程计算差分轮廓; 分析获得的差分轮廓并获得晶片的表面特性，评估半导体晶片的形状。因此，提供了一种评估半导体晶片的形状的方法及其形状评估装置，其中半导体晶片的形状，特别是晶片的周边部分的形状可以从视点进行定量评估与常规SFQR等不同，并且可以根据严格的设计规则的规格来精确地评估晶片的形状质量。

2. 发明授权

US07209857B2 Method of evaluating shape of semiconductor wafer and apparatus for evaluating shape of semiconductor wafer 有权
标题翻译：评价半导体晶片的形状的方法以及评价半导体晶片的形状的装置
公开(公告)号：US07209857B2
公开(公告)日：2007-04-24
申请号：US10517655
申请日：2003-06-10
申请人： Masakazu Sato , Masato Onishi
发明人： Masakazu Sato , Masato Onishi
IPC分类号： G01B15/00
CPC分类号： G01B7/08 , G01B11/06 , G01B11/24
摘要： The present invention is a method of evaluating a shape of a semiconductor wafer comprising the steps of: measuring shape data of a semiconductor wafer by scanning a front surface and/or a back surface of the semiconductor wafer; calculating a differential profile through a differential process of the measured shape data; analyzing the obtained differential profile and obtaining a surface characteristic of the wafer, and; evaluating a shape of the semiconductor wafer. Thereby, there are provided a method of evaluating a shape of a semiconductor wafer and an apparatus for evaluating a shape thereof, wherein a shape of a semiconductor wafer, particularly a shape of a peripheral portion of the wafer, can be quantitatively evaluated from a viewpoint different from conventional SFQR etc., and the shape quality of the wafer can be accurately evaluated over a specification of a strict design rule.
摘要翻译：本发明是一种评估半导体晶片的形状的方法，包括以下步骤：通过扫描半导体晶片的前表面和/或背表面来测量半导体晶片的形状数据; 通过测量的形状数据的差分过程计算差分轮廓; 分析获得的差分轮廓并获得晶片的表面特性，评估半导体晶片的形状。因此，提供了一种评估半导体晶片的形状的方法及其形状评估装置，其中半导体晶片的形状，特别是晶片的周边部分的形状可以从视点进行定量评估与常规SFQR等不同，并且可以根据严格的设计规则的规格来精确地评估晶片的形状质量。

3. 发明授权

US09237091B2 System and method of load balancing for ethernet link aggregation 有权
标题翻译：以太网链路聚合的负载均衡的系统和方法
公开(公告)号：US09237091B2
公开(公告)日：2016-01-12
申请号：US13529371
申请日：2012-06-21
申请人： Masakazu Sato , Satoshi Nakajima , Kazunari Suzuki
发明人： Masakazu Sato , Satoshi Nakajima , Kazunari Suzuki
IPC分类号： H04L12/931 , H04L12/709 , H04L29/12 , H04W84/18 , H04L12/413 , H04L12/741 , H04L29/06
CPC分类号： H04L45/245 , H04L12/413 , H04L45/745 , H04L49/351 , H04L61/2092 , H04L69/22 , H04W84/18 , Y02D50/30
摘要： A system and method of transmitting data across a first link aggregation formed by an intermediate switch and a downstream switch, the intermediate switch adopting a Media-Access Card (MAC)-address-based load sharing algorithm for distributing traffic among links to the downstream switch interfaced with a final destination device. The method comprises: receiving a packet having a MAC header and an IP header at an input port of an upstream switch for transmission from the upstream switch to the intermediate switch, the upstream switch and intermediate switch forming a second link aggregation; re-writing, at the upstream switch, the source MAC address of the received packet to a different source address; sending the packet through the second link aggregation to the intermediate switch, the intermediate switch implementing the load sharing algorithm for sending the packet to the downstream switch along a link through the first link aggregation to the destination device.
摘要翻译：一种通过中间交换机和下游交换机形成的第一链路聚合发送数据的系统和方法，所述中间交换机采用基于媒体接入卡（MAC）地址的负载分担算法，用于在下游交换机的链路之间分配业务与最终目的地设备连接。该方法包括：在上游交换机的输入端口接收具有MAC报头和IP报头的分组，从上游交换机向中间交换机发送，上游交换机和中间交换机形成第二链路聚合; 在上游交换机上重新写入接收到的数据包的源MAC地址到不同的源地址; 将所述分组通过所述第二链路聚合发送到所述中间交换机，所述中间交换机实现负载分担算法，用于通过所述第一链路聚合向所述目的设备沿着链路向所述下游交换机发送所述分组。

4. 发明授权

US08756421B2 Authentication device using true random number generating element or pseudo-random number generating element, authentication apparatus, and authentication method 有权
标题翻译：使用真实随机数生成元素或伪随机数生成元素，认证装置和认证方法的认证装置
公开(公告)号：US08756421B2
公开(公告)日：2014-06-17
申请号：US12301168
申请日：2007-05-16
申请人： Osamu Kameda , Masakazu Sato
发明人： Osamu Kameda , Masakazu Sato
IPC分类号： G06F21/00 , H04L29/06 , H04L9/08
CPC分类号： H04L9/0822 , G06F21/31 , G06F21/34 , H04L9/0819 , H04L9/0863 , H04L9/0869 , H04L9/0877 , H04L9/0891 , H04L9/3228 , H04L63/068
摘要： Provided are an authentication device using a true random number generating element or a pseudo-random number generating element, for example, a USB token, an authentication apparatus using the same, an authentication method, an authentication system and the like. In the authentication system, the authentication device is prepared on a user side, and one code generated in the authentication device is used to encrypt another code. The authentication apparatus registers the codes and decrypts the encrypted code sent from the authentication device by using the registered codes to perform an authentication.
摘要翻译：提供了使用真随机数生成元素或伪随机数生成元素的认证装置，例如USB令牌，使用该令牌的认证装置，认证方法，认证系统等。在认证系统中，认证装置在用户侧准备，并且在认证装置中生成的一个代码用于加密另一个代码。验证装置通过使用注册代码对代码进行登记并解密从认证装置发送的加密代码来进行认证。

5. 发明授权

US08274980B2 Ethernet link aggregation 失效
标题翻译：以太网链路聚合
公开(公告)号：US08274980B2
公开(公告)日：2012-09-25
申请号：US12393727
申请日：2009-02-26
申请人： Masakazu Sato , Satoshi Nakajima , Kazunari Suzuki
发明人： Masakazu Sato , Satoshi Nakajima , Kazunari Suzuki
IPC分类号： H04L12/56
CPC分类号： H04L45/245 , H04L12/413 , H04L45/745 , H04L49/351 , H04L61/2092 , H04L69/22 , H04W84/18 , Y02D50/30
摘要： A system and method of transmitting data across a link aggregation group, the method comprises: receiving a packet sourced from a client having a MAC header and an IP header at an input port of a first upstream switch for transmission from the first upstream switch along a link aggregation and at least two down stream switches to a server, said MAC header having a Destination MAC address and a Source MAC address, and the IP header having a Source IP address and a Destination IP address; changing the destination MAC address from a down stream destination to another down stream destination; sending the packet through a first link aggregation to a first down stream switch; using a hash calculation for changing the Source MAC address of the packet in the first down stream switch to a new address; sending the packet through a second link aggregation to a second down stream switch having an address; and sending the packet from the second down stream switch to a server having a server address.
摘要翻译：一种通过链路聚合组发送数据的系统和方法，所述方法包括：从第一上游交换机的输入端口接收来自具有MAC报头和IP报头的客户端的分组，以从第一上游交换机沿着链路聚合和至少两个下行切换到服务器，所述MAC报头具有目的地MAC地址和源MAC地址，所述IP报头具有源IP地址和目的地IP地址; 将目的MAC地址从下行目的地改变到另一下行目的地; 通过第一链路聚合将分组发送到第一下行链路交换机; 使用哈希计算来将第一下行切换中的分组的源MAC地址改变为新的地址; 通过第二链路聚合将分组发送到具有地址的第二下行交换机; 并将分组从第二下行交换机发送到具有服务器地址的服务器。

6. 发明申请

US20110269960A1 TRIAZOLE DERIVATIVE 审中-公开
标题翻译：三唑衍生物
公开(公告)号：US20110269960A1
公开(公告)日：2011-11-03
申请号：US13180011
申请日：2011-07-11
申请人： Naoya ONO , Tetsuo Takayama , Fumiyasu Shiozawa , Hironori Katakai , Tetsuya Yabuuchi , Tomomi Ota , Makoto Yagi , Masakazu Sato
发明人： Naoya ONO , Tetsuo Takayama , Fumiyasu Shiozawa , Hironori Katakai , Tetsuya Yabuuchi , Tomomi Ota , Makoto Yagi , Masakazu Sato
IPC分类号： C07D249/12 , C07D413/12 , C07D487/04 , C07D491/113 , C07D401/12 , C07D417/14 , C07D249/08 , C07D403/12 , C07D409/12 , C07D405/12 , C07D409/14 , C07D403/14 , C07D401/14 , C07D405/14 , C07D413/14
CPC分类号： C07D249/08
摘要： An object of the present invention is to provide a compound having an action of inhibiting binding between S1P and its receptor, Edg-1 (S1P1), and is useful as a pharmaceutical compound. A compound or a pharmaceutically acceptable salt thereof, which compound is represented by the formula below (where A represents an oxygen atom, a sulfur atom, a group represented by Formula —SO—, a group represented by Formula —SO2—, or the like, R1 represents a hydrogen atom, an alkyl group having 1-6 carbon atoms, or the like, R1A represents a hydrogen atom or the like, R2 represents an alkyl group having 1-6 carbon atoms, a cycloalkyl group having 3-6 carbon atoms, or the like, R3 represents an aryl group, R4 represents a hydrogen atom or an alkyl group having 1-6 carbon atoms and optionally substituted with a carboxyl group, and R5 represents an alkyl group having 1-10 carbon atoms, a cycloalkyl group having 3-8 carbon atoms, an aryl group which is optionally substituted, or the like).
摘要翻译：本发明的目的是提供具有抑制S1P与其受体Edg-1（S1P1）结合的作用的化合物，可用作药物化合物。化合物或其药学上可接受的盐，其化合物由下式表示（其中A表示氧原子，硫原子，由式-SO-表示的基团，由式-SO2-表示的基团等） R1表示氢原子，具有1-6个碳原子的烷基等，R1A表示氢原子等，R2表示具有1-6个碳原子的烷基，具有3-6个碳原子的环烷基原子等，R 3表示芳基，R 4表示氢原子或具有1-6个碳原子并且任选被羧基取代的烷基，R 5表示具有1-10个碳原子的烷基，环烷基具有3-8个碳原子的基团，任选取代的芳基等）。

7. 发明申请

US20110138579A1 SLIDING ASSIST MECHANISM 审中-公开
标题翻译：滑动辅助机构
公开(公告)号：US20110138579A1
公开(公告)日：2011-06-16
申请号：US12737014
申请日：2009-06-05
申请人： Masakazu Sato
发明人： Masakazu Sato
IPC分类号： E05F1/16 , E05C1/08
CPC分类号： E05F1/16 , E05F5/003 , E05Y2201/412 , E05Y2201/488 , E05Y2800/00 , E05Y2800/174 , E05Y2800/73 , Y10T16/37 , Y10T292/097
摘要： A sliding assist mechanism includes a case (1) attached to one of a main body (7) and a mobile body (A); a latch (4) movably disposed in the case and switched between a standby state in which the latch is locked in the case and a retracted state in which the locking is released; a biasing device (3) for biasing the latches in one direction; and an operation member (8) attached to the other of the main body (7) and the mobile body. When the latch (4) is switched.from the standby state to the retracted state, the sliding assist mechanism allows the mobile body to move from a first position to a second position on a main body side through the operation member (8) by biasing force accumulated in the biasing means (3). Essential parts of the mechanism include an engagement portion (42) at a normal time when the latches (4) engage the operation members (8) by interlocking the switching from the standby state to the retracted state, and an auxiliary engagement device (47) releasably engages the operation members (8) when the latch comes to the retracted state in a non-engaged state of the operation member relative to the engagement portion. A repairing structure can be further simplified by such sliding assist mechanism.
摘要翻译：滑动辅助机构包括安装在主体（7）和移动体（A）之一上的壳体（1）。可移动地设置在壳体中并且在闩锁被锁定在壳体中的待机状态和其中释放锁定的缩回状态之间切换的闩锁（4）偏置装置（3），用于沿一个方向偏置闩锁; 以及安装在主体（7）和移动体的另一个上的操作构件（8）。当闩锁（4）从待机状态切换到缩回状态时，滑动辅助机构允许移动体通过操作构件（8）从主体侧的第一位置移动到第二位置累积在偏压装置（3）中的力。该机构的主要部件包括：当闩锁（4）通过将从待机状态的切换联动到缩回状态而啮合操作构件（8）时的正常时间处的接合部分（42）和辅助接合装置（47）当闩锁在操作构件相对于接合部分的非接合状态中到达缩回状态时，可释放地接合操作构件（8）。这种滑动辅助机构可以进一步简化修理结构。

8. 外观设计

USD592503S1 Packaging bag 有权
公开(公告)号：USD592503S1
公开(公告)日：2009-05-19
申请号：US29328873
申请日：2008-12-03
申请人： Tadashi Nomura , Masakazu Sato
设计人： Tadashi Nomura , Masakazu Sato

9. 外观设计

USD591150S1 Packaging bag 有权
公开(公告)号：USD591150S1
公开(公告)日：2009-04-28
申请号：US29328872
申请日：2008-12-03
申请人： Tadashi Nomura , Masakazu Sato
设计人： Tadashi Nomura , Masakazu Sato

10. 发明申请

US20080203527A1 Semiconductor device having gate electrode connection to wiring layer 审中-公开
标题翻译：具有栅电极连接到布线层的半导体器件
公开(公告)号：US20080203527A1
公开(公告)日：2008-08-28
申请号：US12081960
申请日：2008-04-24
申请人： Kazuhisa Itoi , Masakazu Sato , Tatsuya Ito
发明人： Kazuhisa Itoi , Masakazu Sato , Tatsuya Ito
IPC分类号： H01L29/00
CPC分类号： H01L28/10 , Y10T29/49117
摘要： A semiconductor device includes a semiconductor substrate having an electrode formed above a surface thereof; a first insulating resin layer that is provided over the semiconductor substrate and has a first opening defined at a position corresponding to the electrode; a first wiring layer that is provided on the first insulating resin layer and is connected to the electrode through the first opening; a second insulating resin layer provided over the first insulating resin layer and the first wiring layer, the second insulating resin layer having a second opening that is defined at a position different from the position of the first opening in a direction of the surface of the semiconductor substrate; and a second wiring layer that is provided on the second insulating resin layer and is connected to the first wiring layer through the second opening, wherein the second wiring layer includes an induction element, and a sum of a thickness of the first insulating resin layer and a thickness of the second insulating resin layer is not less than 5 μm and not more than 60 μm.
摘要翻译：半导体器件包括其表面上形成有电极的半导体衬底; 第一绝缘树脂层，设置在所述半导体衬底上并且具有限定在对应于所述电极的位置的第一开口; 第一布线层，设置在第一绝缘树脂层上，并通过第一开口连接到电极; 设置在所述第一绝缘树脂层和所述第一布线层上的第二绝缘树脂层，所述第二绝缘树脂层具有限定在与所述第一开口的位置不同的位置的第二开口，所述第二开口沿所述半导体的表面的方向基质; 以及第二布线层，其设置在所述第二绝缘树脂层上并且通过所述第二开口连接到所述第一布线层，其中所述第二布线层包括感应元件，并且所述第一绝缘树脂层和第二绝缘树脂层的厚度为5μm以上且60μm以下。

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