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1. 发明授权

US5234522A Method of producing flexible printed-circuit board covered with coverlay 失效
标题翻译：生产覆盖有柔性印刷电路板的方法
公开(公告)号：US5234522A
公开(公告)日：1993-08-10
申请号：US800586
申请日：1991-11-27
申请人： Masakatsu Suzuki , Junichi Imaizumi , Hiroshi Nomura , Kouichi Nagao , Yasushi Katoh , Takato Oti , Eikichi Satou
发明人： Masakatsu Suzuki , Junichi Imaizumi , Hiroshi Nomura , Kouichi Nagao , Yasushi Katoh , Takato Oti , Eikichi Satou
IPC分类号： H05K3/20 , B32B15/08 , C08G73/10 , C08J7/04 , C09J179/08 , H01B3/30 , H05K1/00 , H05K3/28 , H05K3/38
CPC分类号： C08J7/047 , B32B15/08 , C08G73/1046 , C08G73/1071 , C09J179/08 , H01B3/306 , H05K3/281 , C08J2379/08 , C08J2479/00 , H05K1/0393 , H05K2201/0154 , H05K2203/066 , H05K2203/095 , H05K3/386 , Y10T29/49124 , Y10T428/2486 , Y10T428/31721
摘要： A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

2. 发明授权

US5171826A Heat resistant adhesive composition and bonding method using the same 失效
标题翻译：耐热粘合剂组合物和使用其的粘合方法
公开(公告)号：US5171826A
公开(公告)日：1992-12-15
申请号：US792027
申请日：1991-11-13
申请人： Junichi Imaizumi , Hiroshi Nomura , Kouichi Nagao , Masakatsu Suzuki , Koushi Sakairi , Eikichi Satou
发明人： Junichi Imaizumi , Hiroshi Nomura , Kouichi Nagao , Masakatsu Suzuki , Koushi Sakairi , Eikichi Satou
IPC分类号： B32B7/12 , C08G73/12 , C08L79/08 , H01B3/30 , H05K1/00 , H05K1/03 , H05K3/28 , H05K3/38 , H05K3/46
CPC分类号： H01B3/306 , B32B7/12 , C08G73/12 , C08L79/085 , H05K3/28 , H05K3/281 , H05K3/386 , H05K1/036 , H05K1/0393 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2203/0759 , H05K2203/095 , H05K3/4611 , H05K3/4635
摘要： A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.
摘要翻译：包含特定聚酰胺酸溶液和双马来酰亚胺化合物的耐热粘合剂组合物在粘合两种材料体之后显示出柔韧性和优异的耐热性，因此可以适用于柔性金属包覆层压板的制造，双面柔性金属覆层压板和多层印刷电路板，以及用于将覆盖膜附着到印刷电路板上。

3. 发明授权

US5089346A Heat resistant adhesive composition and bonding method using the same 失效
标题翻译：耐热粘合剂组合物和使用该粘合剂的粘合方法
公开(公告)号：US5089346A
公开(公告)日：1992-02-18
申请号：US495362
申请日：1990-03-16
申请人： Junichi Imaizumi , Hiroshi Nomura , Kouichi Nagao , Masakatsu Suzuki , Koushi Sakairi , Eikichi Satou
发明人： Junichi Imaizumi , Hiroshi Nomura , Kouichi Nagao , Masakatsu Suzuki , Koushi Sakairi , Eikichi Satou
IPC分类号： B32B7/12 , C08G73/12 , C08L79/08 , H01B3/30 , H05K1/00 , H05K1/03 , H05K3/28 , H05K3/38 , H05K3/46
CPC分类号： H05K3/28 , B32B7/12 , C08G73/12 , C08L79/085 , H01B3/306 , H05K3/281 , H05K3/386 , H05K1/036 , H05K1/0393 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2203/0759 , H05K2203/095 , H05K3/4611 , H05K3/4635 , Y10T428/31681
摘要： A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

4. 发明申请

US20050122417A1 Solid-state image sensor and manufacturing method thereof 审中-公开
标题翻译：固态图像传感器及其制造方法
公开(公告)号：US20050122417A1
公开(公告)日：2005-06-09
申请号：US10983598
申请日：2004-11-09
申请人： Masakatsu Suzuki
发明人： Masakatsu Suzuki
IPC分类号： H01L27/14 , H01L27/146 , H01L31/02 , H01L31/10 , H04N5/225 , H04N5/335 , H04N5/369
CPC分类号： H01L27/1462 , H01L27/14623 , H01L27/14627
摘要： A solid-state image sensor of the present invention has optical units separating incident light into a plurality of color lights, each of which separates the incident light into one of the color lights; light receptors corresponding to the color lights, each of which is formed in a semiconductor substrate and converts one of the color lights separated by the optical units; and antireflection films, each of which reduces light reflection on a surface of the light receptor.
摘要翻译：本发明的固态图像传感器具有将入射光分离为多个彩色光的光学单元，每个颜色的光将入射光分离成一个颜色的光; 对应于彩色光的光接收器，其各自形成在半导体衬底中并转换由光学单元分离的一个色光; 和抗反射膜，每一种都减轻了光接收体表面的光反射。

5. 发明授权

US06326638B1 Semiconductor light emitting element and method for fabricating the same 失效
标题翻译：半导体发光元件及其制造方法
公开(公告)号：US06326638B1
公开(公告)日：2001-12-04
申请号：US09080121
申请日：1998-05-15
申请人： Satoshi Kamiyama , Masakatsu Suzuki , Takeshi Uenoyama , Kiyoshi Ohnaka , Akira Takamori , Masaya Mannoh , Isao Kidoguchi , Hideto Adachi , Akihiko Ishibashi , Toshiya Fukuhisa , Yasuhito Kumabuchi
发明人： Satoshi Kamiyama , Masakatsu Suzuki , Takeshi Uenoyama , Kiyoshi Ohnaka , Akira Takamori , Masaya Mannoh , Isao Kidoguchi , Hideto Adachi , Akihiko Ishibashi , Toshiya Fukuhisa , Yasuhito Kumabuchi
IPC分类号： H01L2715
CPC分类号： B82Y20/00 , H01L33/16 , H01L33/32 , H01S5/0207 , H01S5/0213 , H01S5/02272 , H01S5/2068 , H01S5/2201 , H01S5/2232 , H01S5/2237 , H01S5/24 , H01S5/3201 , H01S5/3202 , H01S5/3203 , H01S5/32308 , H01S5/32341 , H01S5/3403 , H01S5/34333 , H01S2301/173 , H01S2304/04 , H01S2304/12 , Y10S257/918 , Y10T428/12528
摘要： The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.
摘要翻译：本发明的半导体激光器包括在c轴方向上形成的有源层，其中有源层由六方晶系化合物半导体制成，并且在有源层的c平面内产生各向异性应变。

6. 发明授权

US06290245B1 Apparatus for controlling pivoting of axles in industrial vehicles 有权
标题翻译：用于控制工业车辆中轴的枢转的装置
公开(公告)号：US06290245B1
公开(公告)日：2001-09-18
申请号：US09162224
申请日：1998-09-28
申请人： Kazuo Ishikawa , Takaki Ogawa , Masakatsu Suzuki , Takashi Yamada
发明人： Kazuo Ishikawa , Takaki Ogawa , Masakatsu Suzuki , Takashi Yamada
IPC分类号： B60G1156
CPC分类号： B60G17/005 , B60G2200/322 , B60G2204/46 , B60G2300/022 , B60G2500/106
摘要： An apparatus for controlling pivoting of a forklift rear axle. A hydraulic damper is arranged between a rear axle and a forklift body. The damper includes two oil chambers. The oil chambers are connected to a first passage and a second passage. A two-way switch valve is arranged between the oil chambers. The valve permits the flow of oil between the oil chambers and allows pivoting of the rear axle when opened. The valve restricts the flow of oil between the oil chambers and prohibits pivoting of the rear axle, thereby locking the rear axle when closed. When the rear axle is released from a locked state, the valve repeats a valve cycle, which includes opening and closing the valve, to regulate the amount of fluid that flows between the chambers. The valve is then kept in an opened state. This prevents shock that may be produced by sudden tilting of the body when the rear axle is released from a locked state.
摘要翻译：一种用于控制叉车后桥的枢转的装置。液压阻尼器设置在后桥和叉车主体之间。阻尼器包括两个油室。油室连接到第一通道和第二通道。在油室之间设有双向切换阀。阀门允许油室之间的油流动，并允许后轴在打开时枢转。阀限制油室之间的油流，并禁止后轴的枢转，从而在关闭时锁定后轴。当后轴从锁定状态释放时，阀重复阀循环，其包括打开和关闭阀，以调节在室之间流动的流体的量。阀然后保持打开状态。这防止当后轴从锁定状态释放时身体的突然倾斜可能产生的冲击。

7. 外观设计

USD303718S Portable electric lantern 失效
公开(公告)号：USD303718S
公开(公告)日：1989-09-26
申请号：US005528
申请日：1987-01-20
申请人： Toshiharu Fujita , Masakatsu Suzuki , Yorimitsu Nagai
设计人： Toshiharu Fujita , Masakatsu Suzuki , Yorimitsu Nagai

8. 外观设计

USD287288S Fluorescent lamp 失效
公开(公告)号：USD287288S
公开(公告)日：1986-12-16
申请号：US661159
申请日：1984-10-15
申请人： Toshiharu Fujita , Yoshihiro Domon , Masakatsu Suzuki
设计人： Toshiharu Fujita , Yoshihiro Domon , Masakatsu Suzuki

9. 发明授权

US07426227B2 Semiconductor laser device, optical disk apparatus and optical integrated unit 有权
标题翻译：半导体激光器件，光盘设备和光学集成单元
公开(公告)号：US07426227B2
公开(公告)日：2008-09-16
申请号：US11447951
申请日：2006-06-07
申请人： Masahiro Kume , Isao Kidoguchi , Yuzaburo Ban , Ryoko Miyanaga , Masakatsu Suzuki
发明人： Masahiro Kume , Isao Kidoguchi , Yuzaburo Ban , Ryoko Miyanaga , Masakatsu Suzuki
IPC分类号： H01S5/00
CPC分类号： H01S5/32341 , B82Y20/00 , G11B7/123 , G11B7/127 , H01L2224/16225 , H01S5/005 , H01S5/0213 , H01S5/02208 , H01S5/02212 , H01S5/0224 , H01S5/02272 , H01S5/02292 , H01S5/0286 , H01S5/0683 , H01S5/1078 , H01S5/2022 , H01S5/2027 , H01S5/22 , H01S5/34333 , H01S2301/02 , H01S2301/173 , H01S2301/176 , H01S2304/04
摘要： A semiconductor laser device includes: a first cladding layer, which is made of a nitride semiconductor of a first conductivity type and is formed over a substrate; an active layer, which is made of another nitride semiconductor and is formed over the first cladding layer; and a second cladding layer, which is made of still another nitride semiconductor of a second conductivity type and is formed over the active layer. A spontaneous-emission-absorbing layer, which is made of yet another nitride semiconductor of the first conductivity type and has such an energy gap as absorbing spontaneous emission that has been radiated from the active layer, is formed between the substrate and the first cladding layer.
摘要翻译：半导体激光器件包括：第一覆层，其由第一导电类型的氮化物半导体制成并形成在衬底上; 活性层，其由另一个氮化物半导体制成并形成在第一包层上; 以及第二覆层，其由另一种第二导电类型的氮化物半导体制成并形成在有源层上。由第一导电类型的又一个氮化物半导体制成并具有从有源层辐射的吸收自发发射的能隙的自发发射吸收层形成在衬底和第一覆层之间。

10. 发明授权

US07368766B2 Semiconductor light emitting element and method for fabricating the same 有权
标题翻译：半导体发光元件及其制造方法
公开(公告)号：US07368766B2
公开(公告)日：2008-05-06
申请号：US10891968
申请日：2004-07-15
申请人： Satoshi Kamiyama , Masakatsu Suzuki , Takeshi Uenoyama , Kiyoshi Ohnaka , Akira Takamori , Masaya Mannoh , Isao Kidoguchi , Hideto Adachi , Akihiko Ishibashi , Toshiya Fukuhisa , Yasuhito Kumabuchi
发明人： Satoshi Kamiyama , Masakatsu Suzuki , Takeshi Uenoyama , Kiyoshi Ohnaka , Akira Takamori , Masaya Mannoh , Isao Kidoguchi , Hideto Adachi , Akihiko Ishibashi , Toshiya Fukuhisa , Yasuhito Kumabuchi
IPC分类号： H01L31/072
CPC分类号： B82Y20/00 , H01L33/16 , H01L33/32 , H01S5/0207 , H01S5/0213 , H01S5/02272 , H01S5/2068 , H01S5/2201 , H01S5/2232 , H01S5/2237 , H01S5/24 , H01S5/3201 , H01S5/3202 , H01S5/3203 , H01S5/32308 , H01S5/32341 , H01S5/3403 , H01S5/34333 , H01S2301/173 , H01S2304/04 , H01S2304/12 , Y10S257/918 , Y10T428/12528
摘要： The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.
摘要翻译：本发明的半导体激光器包括在c轴方向上形成的有源层，其中有源层由六方晶系化合物半导体制成，并且在有源层的c平面内产生各向异性应变。

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