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1. 发明授权

US06462148B1 Adhesive film of quinoline polymer and bismaleimide 失效
标题翻译：喹啉聚合物和双马来酰亚胺的粘合膜
公开(公告)号：US06462148B1
公开(公告)日：2002-10-08
申请号：US09297203
申请日：1999-10-07
申请人： Masahiro Suzuki , Shin Nishimura , Masao Suzuki , Akio Takahashi , Akira Kageyama , Yoshihiko Honda , Toshiyasu Kawai , Shinji Iioka , Yoshihiro Nomura
发明人： Masahiro Suzuki , Shin Nishimura , Masao Suzuki , Akio Takahashi , Akira Kageyama , Yoshihiko Honda , Toshiyasu Kawai , Shinji Iioka , Yoshihiro Nomura
IPC分类号： C08L7100
CPC分类号： C08G65/4037 , C08G65/4006 , C08G75/23 , C08L71/00
摘要： A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.
摘要翻译：可用作粘合剂膜的树脂组合物和用于多层布线基板或电子部件的绝缘材料包括（A）包含式（1）所示的喹啉环的聚合物，其结构如6,6'-双（2- （4-氟苯基）-4-苯基喹啉）和4,4' - （1,1,1,3,3,3-六氟-2,2-亚丙基）双酚，和（B）由式（2）如2,2-双（（4-马来酰亚胺基苯氧基）苯基）丙烷。

2. 发明授权

US06621170B2 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film 有权
标题翻译：半导体器件，用于安装半导体芯片的基板，其制造方法，粘合剂和双面粘合剂膜
公开(公告)号：US06621170B2
公开(公告)日：2003-09-16
申请号：US09842441
申请日：2001-04-26
申请人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
发明人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , C09J163/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15159 , H01L2924/15184 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
摘要翻译：本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产处理。

3. 发明授权

US06265782B1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film 有权
标题翻译：半导体器件，半导体芯片安装基板，制造器件和基板的方法，粘合剂和粘合剂双重涂膜
公开(公告)号：US06265782B1
公开(公告)日：2001-07-24
申请号：US09284131
申请日：1999-08-30
申请人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
发明人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , C09J163/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15159 , H01L2924/15184 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
摘要翻译：本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产处理。

4. 发明授权

US07781896B2 Semiconductor device and process for fabrication thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US07781896B2
公开(公告)日：2010-08-24
申请号：US12138637
申请日：2008-06-13
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

5. 发明申请

US20100026683A1 METHOD AND PROGRAM OF VISUALIZING STRUCTURED GRID DATA 失效
标题翻译：可视化结构化网格数据的方法和程序
公开(公告)号：US20100026683A1
公开(公告)日：2010-02-04
申请号：US11910184
申请日：2006-03-30
申请人： Fumiaki Araki , Akira Kageyama
发明人： Fumiaki Araki , Akira Kageyama
IPC分类号： G06T17/00
CPC分类号： G06T17/20 , G06T19/20 , G06T2219/2016
摘要： Grid structured data arranged for a spherical structured grid constituted by combining two component structured grids are visualized by using computer graphics technology. Coordinate conversion means 31 converts grid point coordinates of first and second component structured grids (referred to as N and E systems, respectively), represented by specific regions in spherical coordinates, into local xyz coordinates used in computer graphics. Filter means 32 obtains first and second graphic objects for the N and E systems, respectively. Using E system rotation and N and E system synthesis means 33, the second graphic object for the E system is rotated by 90 degrees with respect to an x axis of a first local xyz coordinate system, and is then rotated by 180 degrees with respect to a z axis of the first local xyz coordinate system, thereby obtaining the rotated second graphic object for the E system, and then, both of the graphic objects are synthesized.
摘要翻译：通过组合两个组件结构的网格构成的球形结构网格的网格结构化数据可以通过使用计算机图形技术进行显示。坐标转换装置31将由球面坐标中的特定区域表示的第一和第二分量结构网格（分别称为N和E系统）的网格点坐标转换为计算机图形中使用的局部xyz坐标。滤波器装置32分别获得N和E系统的第一和第二图形对象。使用E系统旋转和N和E系统合成装置33，E系统的第二图形对象相对于第一局部xyz坐标系的x轴旋转90度，然后相对于 az轴，从而获得用于E系统的旋转的第二图形对象，然后合成两个图形对象。

6. 发明授权

US07078094B2 Semiconductor device and process for fabrication thereof 失效
公开(公告)号：US07078094B2
公开(公告)日：2006-07-18
申请号：US10891090
申请日：2004-07-15
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： B32B15/04 , H01L23/495
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

7. 发明授权

US06404068B1 Paste composition, and protective film and semiconductor device both obtained with the same 失效
标题翻译：糊剂组合物，以及保护膜和半导体器件均获得相同
公开(公告)号：US06404068B1
公开(公告)日：2002-06-11
申请号：US09763192
申请日：2001-02-20
申请人： Toshiaki Tanaka , Takafumi Dohdoh , Tsutomu Kitakatsu , Aizou Kaneda , Masaaki Yasuda , Takashi Kousaka , Akira Kageyama
发明人： Toshiaki Tanaka , Takafumi Dohdoh , Tsutomu Kitakatsu , Aizou Kaneda , Masaaki Yasuda , Takashi Kousaka , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/3128 , C08L63/00 , C08L71/00 , C08L71/126 , C08L77/00 , C08L77/06 , C08L83/10 , C09D177/00 , C09D177/06 , C09D179/08 , H01L23/24 , H01L23/293 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , C08L2666/02 , C08L2666/08 , C08L2666/04 , C08L2666/14 , C08L2666/28 , H01L2924/00012 , H01L2924/00 , H01L2924/20753
摘要： A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.
摘要翻译：作为必要成分（A）热塑性树脂，（B）环氧树脂，（C）偶联剂，（D）粉末状无机填料，（E）具有橡胶弹性的粉末和（F）有机溶剂，当涂布并干燥时，得到空隙率为3体积％以上的涂膜，在40℃，90％RH下测定的水蒸气透过率为500g / m 2·24h，减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜，其空隙率为3体积％以上，水分透过率为40℃，90％RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。

8. 发明授权

US5873344A Direct fuel injection ignition engine 失效
公开(公告)号：US5873344A
公开(公告)日：1999-02-23
申请号：US67286
申请日：1998-04-27
申请人： Hidetoshi Kudou , Hiroyuki Yamashita , Noriyuki Ota , Masashi Marubara , Akira Kageyama
发明人： Hidetoshi Kudou , Hiroyuki Yamashita , Noriyuki Ota , Masashi Marubara , Akira Kageyama
IPC分类号： F02B23/08 , F02B17/00 , F02B23/10 , F02B31/00 , F02B31/08 , F02B75/12 , F02D41/02 , F02D45/00 , F02F1/24 , F02F1/42 , F02F3/26 , F02B31/06
CPC分类号： F02F3/26 , F02B17/005 , F02B23/104 , F02B31/08 , F02B31/085 , F02B2023/106 , F02B2023/108 , F02B2031/006 , F02B2075/125 , F02B2275/18 , F02B2275/48 , F02F1/4214 , F02F2001/241 , F02F2001/245 , Y02T10/12 , Y02T10/123 , Y02T10/125 , Y02T10/146
摘要： A direct injection ignition engine includes a piston with a cavity on a top surface thereof, an injector arranged at a peripheral portion of a combustion chamber to be faced to the combustion chamber for injecting a fuel directly into the combustion chamber, an ignition plug arranged to be projected to the combustion chamber for igniting the fuel introduced into the combustion chamber, an intake passage connected to the combustion chamber for introducing an intake air to the combustion chamber, intake air flow control valve arranged in the intake passage for controlling an intake air flow of an inclined vortex including a tumble component and swirl component produced in the combustion chamber, an actuator for driving the control valve, engine load detecting sensor for detecting an engine load, engine speed detecting sensor for detecting an engine speed, fuel supply controller, based on the output signals from the engine load detecting sensor and the engine speed detecting sensor, for producing control signals for the injector which include a fuel injection amount and fuel injection timing in a compression stroke for accomplishing a stratified combustion condition in which an air fuel mixture with an air fuel ratio greater than a theoretical one is concentrated around the ignition plug when an operating condition is in at least a low engine load and low engine speed condition, and, the fuel injection amount and fuel injection timing in an intake stroke for accomplishing a uniform combustion condition in which an air fuel mixture with an air fuel ratio greater than a theoretical one is uniformly and entirely dispersed in the combustion chamber when the operating condition is at least in a condition beyond said low engine load and engine speed condition with regard to the engine load and engine speed, and, producing control signals for the actuator to produce the inclined vortex of the air fuel mixture in the operating condition from the stratified combustion condition to the uniform combustion condition.

9. 发明申请

US20080290529A1 SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080290529A1
公开(公告)日：2008-11-27
申请号：US12138637
申请日：2008-06-13
申请人： Shinji TAKEDA , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji TAKEDA , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/18 , H01L21/58
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

10. 发明授权

US07012320B2 Semiconductor device and process for fabrication thereof 失效
公开(公告)号：US07012320B2
公开(公告)日：2006-03-14
申请号：US09785486
申请日：2001-02-20
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/05599 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/01014 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

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