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1. 发明申请

US20120292775A1 MOUNTING METHOD AND MOUNTING DEVICE 失效
标题翻译：安装方法和安装设备
公开(公告)号：US20120292775A1
公开(公告)日：2012-11-22
申请号：US13519243
申请日：2010-12-24
申请人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
发明人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83002 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
摘要翻译：将元件依次安装在基板上的安装方法包括安装过程，该安装方法将一个元件安装在一个元件的表面的第一接触区域上，该元件由取出部分从容纳元件被容纳的容纳部分中取出，衬底，其中涂布液体。该方法还包括一种涂覆方法，该涂覆方法通过可移动地与取出部分一起设置的涂层部分涂覆在与该第一接触区域不同的第一接触区域的基板的表面的接触区域上，第一区。

2. 发明授权

US08749068B2 Mounting method and mounting device 失效
标题翻译：安装方法和安装装置
公开(公告)号：US08749068B2
公开(公告)日：2014-06-10
申请号：US13519243
申请日：2010-12-24
申请人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
发明人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83002 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
摘要翻译：将元件依次安装在基板上的安装方法包括安装过程，该安装方法将一个元件安装在一个元件的表面的第一接触区域上，该元件由取出部分从容纳元件被容纳的容纳部分中取出，衬底，其中涂布液体。该方法还包括一种涂覆方法，该涂覆方法通过可移动地与取出部分一起设置的涂层部分涂覆在与该第一接触区域不同的第一接触区域的基板的表面的接触区域上，第一区。

3. 发明申请

US20120291950A1 MOUNTING METHOD AND MOUNTING DEVICE 审中-公开
标题翻译：安装方法和安装设备
公开(公告)号：US20120291950A1
公开(公告)日：2012-11-22
申请号：US13519237
申请日：2010-12-24
申请人： Masahiko Sugiyama , Michikazu Nakamura , Dai Shinozaki , Naoki Akiyama
发明人： Masahiko Sugiyama , Michikazu Nakamura , Dai Shinozaki , Naoki Akiyama
IPC分类号： B32B38/00 , B32B38/18
CPC分类号： H01L21/6835 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2221/68354 , H01L2221/68359 , H01L2221/68368 , H01L2221/68381 , H01L2224/32225 , H01L2224/75102 , H01L2224/75272 , H01L2224/75745 , H01L2224/75753 , H01L2224/7598 , H01L2224/81005 , H01L2224/81201 , H01L2224/83 , H01L2224/83907 , H01L2224/95001 , H01L2224/95146 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2924/3512 , Y10T156/10 , Y10T156/1744 , H01L2924/00014 , H01L2924/00011 , H01L2924/00
摘要： A mounting method of mounting an element on a substrate, includes a first hydrophilization process of hydrophilizing a region on a surface of the substrate where the element is to be joined; a second hydrophilization process of hydrophilizing the surface of the element; a mounting process of mounting the element on a mounting part such that the hydrophilized surface of the element faces upwards; a coating process of coating a liquid on the hydrophilized surface of the element; and an arrangement process of arranging the substrate above the mounting part such that the region on the surface of the substrate where the element is to be joined faces downwards. The method further includes a contact process of bringing the substrate arranged above the mounting part close to the mounting part on which the element is mounted to bring the liquid into contact with the surface of the substrate.
摘要翻译：将元件安装在基板上的安装方法包括使基板的要被接合的基板的表面上的区域亲水化的第一亲水化工序; 使元件的表面亲水化的第二亲水化工序; 将元件安装在安装部分上使得元件的亲水化表面面向上的安装过程; 在所述元件的亲水化表面上涂布液体的涂布方法; 以及将基板布置在安装部分上方以使得要被接合的基板的表面上的区域面向下的布置过程。该方法还包括将安装在安装部分上方的基板靠近安装有元件的安装部分以使液体与基板的表面接触的接触过程。

4. 发明授权

US09263312B2 Joining device and joining position adjustment method using joining device 有权
标题翻译：使用接合装置的接合装置和接合位置调整方法
公开(公告)号：US09263312B2
公开(公告)日：2016-02-16
申请号：US14351425
申请日：2012-09-13
申请人： Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
发明人： Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
IPC分类号： B32B41/00 , H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , Y10T156/1744
摘要： A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
摘要翻译：接合装置包括：第一保持单元，其构造成在其顶表面上加载和保持第一构件; 第二保持单元，其设置在所述第一保持单元的上方，同时面向所述第一保持单元并且构造成保持所述第二构件; 以及位置调整机构，其构造成调整由所述第一保持单元保持的所述第一构件与由所述第二保持单元保持的所述第二构件之间的接合位置。第二保持单元是圆板形状，并且位置调节机构包括沿着第二保持单元的外周表面等间隔设置的四个位置调节凸轮构件，并且使第二保持单元沿水平方向移动。

5. 发明授权

US08286853B2 Bonding apparatus and bonding method 失效
标题翻译：接合装置和接合方法
公开(公告)号：US08286853B2
公开(公告)日：2012-10-16
申请号：US13275843
申请日：2011-10-18
申请人： Naoki Akiyama , Masahiko Sugiyama , Michikazu Nakamura
发明人： Naoki Akiyama , Masahiko Sugiyama , Michikazu Nakamura
IPC分类号： B23K31/02 , B23K37/04
CPC分类号： H01L24/81 , H01L21/67092 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/13117 , H01L2224/16145 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/7526 , H01L2224/75283 , H01L2224/75303 , H01L2224/75312 , H01L2224/75314 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75901 , H01L2224/75985 , H01L2224/81001 , H01L2224/81204 , H01L2224/8122 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/00014 , H01L2924/01032
摘要： A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.
摘要翻译：接合装置包括一体地结合在一起的热处理单元和接合单元。热处理单元包括用于支撑和热处理叠加的基板的第一热处理板。接合单元包括用于支撑和热处理在热处理单元中处理的叠加基板的第二热处理板，以及用于将叠置的基板压靠在第二热处理板上的按压机构。第一热处理板包括用于冷却放置在第一加热板上的重叠基板的冷却机构。每个单元可以将内部气氛减压到一定的真空度。热处理单元具有用于在两个单元之间输送晶片的多个承载机构。

6. 发明授权

US08210417B2 Bonding apparatus 失效
标题翻译：接合装置
公开(公告)号：US08210417B2
公开(公告)日：2012-07-03
申请号：US13275866
申请日：2011-10-18
申请人： Naoki Akiyama , Masahiko Sugiyama , Hajime Furuya
发明人： Naoki Akiyama , Masahiko Sugiyama , Hajime Furuya
IPC分类号： B23K37/04
CPC分类号： H01L24/81 , H01L21/67092 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/13117 , H01L2224/16145 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/7526 , H01L2224/75283 , H01L2224/753 , H01L2224/75303 , H01L2224/75312 , H01L2224/75314 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75901 , H01L2224/75985 , H01L2224/81001 , H01L2224/81204 , H01L2224/8122 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/00014 , H01L2924/01032
摘要： A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.
摘要翻译：一种用于接合具有金属接合部分的基底的接合装置，包括：处理容器，其具有形成在处理容器的底部上的开口; 设置在处理容器内的热处理板，所述热处理板允许将基板安装在其上并允许对基板进行热处理; 加压机构，设置在与热处理板相对的处理容器内，并将基板压入热处理板; 沿处理容器的开口设置在处理容器的内侧的环形支撑件，环形支撑件，在处理容器和热处理板之间提供气密密封，并支撑热处理板; 以及冷却机构，其设置在所述支撑体的位于所述热处理板的下方的内侧，所述冷却机构冷却所述热处理板。

7. 发明授权

US08434538B2 Bonding apparatus and bonding method 失效
标题翻译：接合装置和接合方法
公开(公告)号：US08434538B2
公开(公告)日：2013-05-07
申请号：US13284434
申请日：2011-10-28
申请人： Naoki Akiyama , Masahiko Sugiyama , Yosuke Omori
发明人： Naoki Akiyama , Masahiko Sugiyama , Yosuke Omori
IPC分类号： B32B37/00
CPC分类号： H01L21/67092
摘要： A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.
摘要翻译：接合装置具有用于保持晶片的上卡盘和下卡盘。上卡盘构造成使得当以预定压力加压时，中心部分弯曲成凸起。在下卡盘的底表面上，存在由多个绝缘构件的组合形成的绝缘环，以支撑下卡盘的周边。绝缘环的底表面由多个支撑构件的组合形成的支撑环支撑。支撑构件和下卡盘通过为每个支撑构件设置的螺栓来固定。螺栓穿过分别形成在绝缘构件和支撑构件中的通孔和通孔，直径大于螺栓直径的通孔。

8. 发明申请

US20110214809A1 BONDING APPARATUS AND BONDING METHOD 审中-公开
标题翻译：粘接装置和粘接方法
公开(公告)号：US20110214809A1
公开(公告)日：2011-09-08
申请号：US12922288
申请日：2009-09-11
申请人： Masahiko Sugiyama
发明人： Masahiko Sugiyama
IPC分类号： B32B37/10 , B32B37/02 , B32B37/06 , B32B37/14 , B32B37/16
CPC分类号： H01L21/67092 , B32B37/003 , B32B37/10 , B32B2457/00 , Y10T156/17
摘要： A bonding apparatus includes a first holding section which places and holds a first member on an upper surface, and a second holding section which adsorbs and holds a second member on a lower surface. The second holding section is configured such that a center section bends due to a predetermined pressure. The second holding section includes an intake mechanism which sucks atmosphere of a bonding space between the first holding section and the second holding section. A protrusion which protrudes downward along an outer circumferential lower surface of the second holding section is formed on the outer circumferential lower surface. A sealing member which holds an air-tightness of the bonding space and has elasticity is formed in a lower surface of the protrusion. A height adjusting mechanism which abuts on the protrusion and can adjust the vertical distance between the first member and the second member is formed on a side surface of the first holding section.
摘要翻译：接合装置包括：第一保持部，其将第一部件放置在上表面上;第二保持部，其将第二部件吸附并保持在下表面。第二保持部构造成使得中心部由于预定压力而弯曲。第二保持部包括吸入第一保持部和第二保持部之间的结合空间的气氛的吸入机构。在外周下表面上形成有沿着第二保持部的外周下表面向下方突出的突起。在突出部的下表面形成有保持接合空间的气密性且具有弹性的密封构件。在第一保持部的侧面形成有与突起抵接并能够调整第一部件与第二部件的垂直距离的高度调节机构。

9. 发明授权

US07864450B2 Microlens array sheet and method of producing the same 有权
标题翻译：微透镜阵列片及其制造方法
公开(公告)号：US07864450B2
公开(公告)日：2011-01-04
申请号：US12378962
申请日：2009-02-23
申请人： Masaru Segawa , Masahiko Sugiyama , Yoichiro Nakatani
发明人： Masaru Segawa , Masahiko Sugiyama , Yoichiro Nakatani
IPC分类号： G02B9/08
CPC分类号： B29D11/00278 , B29D11/00365 , G02B3/0031 , G02B3/0056
摘要： A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the third surface side is larger than another size of each aperture on the fourth surface side.
摘要翻译：微透镜阵列片包括具有第一表面和与第一表面相对的第二表面的遮光基底和附着到遮光基底的第一表面的微透镜阵列，该阵列具有多个微透镜。遮光底座具有对应于微透镜的多个孔。每个孔具有锥形梯形形状，其中第一表面侧上的每个孔的尺寸大于第二表面侧上的每个孔的另一尺寸。微透镜阵列片代替遮光底座，可以包括具有第一表面和与第一表面相对的第二表面的透明基底和遮光层，其具有与第三表面相对的第三表面和第四表面，设置在透明基底的第二表面上。微透镜阵列附着到透明基底的第一表面。遮光层具有对应于微透镜的多个孔。每个孔具有锥形梯形形状，其中第三表面侧上的每个孔的尺寸大于第四表面侧上的每个孔的另一尺寸。

10. 发明授权

US07101411B2 Apparatus for generating hydrogen gas 失效
公开(公告)号：US07101411B2
公开(公告)日：2006-09-05
申请号：US10082250
申请日：2002-02-26
申请人： Takahiro Hayashi , Mamoru Ishikiriyama , Masahiko Sugiyama , Yasukazu Saito
发明人： Takahiro Hayashi , Mamoru Ishikiriyama , Masahiko Sugiyama , Yasukazu Saito
IPC分类号： B01J7/00
CPC分类号： C10G2/32 , B01J7/02 , B01J16/005 , B01J19/247 , B01J19/249 , B01J19/26 , B01J19/285 , B01J2219/00083 , B01J2219/00135 , B01J2219/00162 , B01J2219/1941 , B01J2219/2453 , B01J2219/2458 , B01J2219/2479 , C01B3/26 , C01B2203/0277 , C01B2203/04 , C01B2203/0405 , C01B2203/0415 , C01B2203/048 , C01B2203/065 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/0827 , C01B2203/085 , C01B2203/0866 , C01B2203/0883 , C01B2203/1041 , C01B2203/1052 , C01B2203/1064 , C01B2203/107 , C01B2203/1082 , C01B2203/1247 , C01B2203/148 , C01B2203/1609 , C01B2203/1619 , C01B2203/1633 , C01B2203/1647 , C01B2203/1657 , C01B2203/1685 , C01B2203/169 , C01B2203/1695 , H01M8/0606 , Y02P20/128
摘要： An apparatus for generating hydrogen gas in which hydrogen gas of a high purity is supplied to a hydrogen-utilizing device by using a decahydronaphthalene/naphthalene reaction. The apparatus includes a storage tank in which decahydronaphthalene is stored as a crude fuel, a reaction tank which has a catalyst and a heater for heating the catalyst and which causes dehydrogenation of decahydronaphthalene supplied from the storage tank to the heated catalyst, and a separation tank in which hydrogen-rich gas is separated out from naphthalene and hydrogen gas supplied from the reaction tank by using a hydrogen separation film and from which the separated hydrogen gas is discharged.

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