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    • 2. 发明授权
    • Spectroscopic sensor
    • 光谱传感器
    • US09587980B2
    • 2017-03-07
    • US14349080
    • 2012-09-10
    • Katsumi ShibayamaTakashi Kasahara
    • Katsumi ShibayamaTakashi Kasahara
    • G01B9/02G01J3/45G01J3/02G01J3/26G01J3/36G01J3/51G01J3/28G01J3/12
    • G01J3/0229G01J3/26G01J3/2803G01J3/36G01J3/513G01J2003/1234G01J2003/2806
    • A spectroscopic sensor 1 comprises an interference filter unit 20, having a cavity layer 21 and mirror layers 22, 23 opposing each other through the layer 21, for selectively transmitting therethrough light in a predetermined wavelength range according to an incident position thereof; a light-transmitting substrate 3, arranged on the layer 22 side, for transmitting therethrough light incident on the unit 20; and a light-detecting substrate 4, arranged on the layer 23 side, for detecting the light transmitted through the unit 20. The layer 21 has a filter region 24 held between the layers 22, 23; an annular surrounding region 25 surrounding the region 24 with a predetermined distance therefrom; and an annular connecting region 26 connecting an end part 24e on the substrate 4 side of the region 24 and an end part 25e on the substrate 4 side of the region 25 to each other.
    • 光谱传感器1包括干涉滤光器单元20,其具有通过层21相对的空腔层21和反射镜层22,23,用于根据其入射位置选择性地透射预定波长范围的光; 布置在层22侧的用于透射入射在单元20上的光的透光基板3; 以及布置在层23侧的用于检测透过单元20的光的光检测基板4.层21具有保持在层22,23之间的过滤器区域24。 围绕区域24的环形周围区域25与预定距离; 以及将区域24的基板4侧的端部24e和区域25的基板4侧的端部25e彼此连接的环状连接区域26。
    • 5. 发明申请
    • SPECTROSCOPIC SENSOR
    • 光谱传感器
    • US20140253923A1
    • 2014-09-11
    • US14349101
    • 2012-09-10
    • Katsumi ShibayamaTakashi Kasahara
    • Katsumi ShibayamaTakashi Kasahara
    • G01J3/45
    • G01J3/45G01J3/0259G01J3/26G01J3/2803G01J3/36G01J3/513G01J2003/1234G01J2003/2806G01J2003/2816
    • A spectroscopic sensor 1 comprises an interference filter unit 20, having a cavity layer 21 and first and second mirror layers 22, 23 opposing each other through the cavity layer 21, for selectively transmitting therethrough light in a predetermined wavelength range according to an incident position thereof; a light-transmitting substrate 3, arranged on the first mirror layer 22 side, for transmitting therethrough light incident on the interference filter unit 20; a light-detecting substrate 4, arranged on the second mirror layer 23 side, for detecting the light transmitted through the interference filter unit 20; and a first coupling layer 11 arranged between the interference filter unit 20 and the light-transmitting substrate 3. The cavity layer 21 and the first coupling layer 11 are silicon oxide films.
    • 光谱传感器1包括干涉滤光器单元20,其具有空腔层21和通过空腔层21彼此相对的第一和第二反射镜层22,23,用于根据其入射位置选择性地透过预定波长范围的光 ; 布置在第一镜层22侧的用于透射入射在干涉滤光器单元20上的光的透光基板3; 布置在第二镜面23侧的光检测基板4,用于检测透过干涉滤光器单元20的光; 以及布置在干涉滤光器单元20和透光衬底3之间的第一耦合层11.空腔层21和第一耦合层11是氧化硅膜。
    • 6. 发明授权
    • Method for producing spectroscopic sensor
    • 光谱传感器的制造方法
    • US08715443B2
    • 2014-05-06
    • US13817876
    • 2011-09-21
    • Katsumi ShibayamaMasaomi Takasaka
    • Katsumi ShibayamaMasaomi Takasaka
    • G01J3/28
    • G01J3/28G01J3/26G02B5/201G02B5/288Y10T156/1111Y10T156/1195
    • A method of manufacturing a spectroscopic sensor 1 comprises a first step of forming a cavity layer 21 by nanoimprinting on a handle substrate; a second step of forming a first mirror layer 22 on the cavity layer 21 after the first step; a third step of joining a light-transmitting substrate 3 onto the first mirror layer 22 after the second step; a fourth step of removing the handle substrate from the cavity layer 21 after the third step; a fifth step of forming a second mirror layer 23 on the cavity layer 21 without the handle substrate after the fourth step; and a sixth step of joining the light detection substrate 4 onto the second mirror layer 23 after the fifth step.
    • 制造分光传感器1的方法包括:通过在手柄基板上纳米压印形成空腔层21的第一步骤; 在第一步骤之后在空腔层21上形成第一镜面层22的第二步骤; 在第二步骤之后将透光性基板3接合到第一镜面层22上的第三工序; 在第三步骤之后从腔层21去除手柄基板的第四步骤; 第五步骤,在第四步骤之后,在没有手柄基板的空腔层21上形成第二镜面层23; 以及在第五步骤之后将光检测基板4接合到第二镜面层23上的第六步骤。
    • 8. 发明授权
    • Spectroscopy module
    • 光谱模块
    • US08564773B2
    • 2013-10-22
    • US13208774
    • 2011-08-12
    • Katsumi ShibayamaTomofumi SuzukiMasaki Hirose
    • Katsumi ShibayamaTomofumi SuzukiMasaki Hirose
    • G01J3/28
    • G01J3/2803G01J3/02G01J3/0202G01J3/0208G01J3/0243G01J3/0259G01J3/0262G01J3/0286G01J3/18
    • In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, on the light detecting element 5, a first convex portion 101 is formed so as to be located at least between the light detecting portion 5a and the light passing hole 50 when viewed from a direction substantially perpendicular to the front plane 2a. Thus, when the light detecting element 5 is attached to the substrate 2 via the optical resin adhesive 63, the optical resin adhesive 63 is dammed at the first convex portion 101. Thus, the optical resin adhesive 63 is prevented from penetrating into the light passing hole 50.
    • 在光谱模块1中,在光检测元件5中形成有通过向分光部4前进的光L1通过的光通过孔50.因此,能够防止光通过孔50与 光检测元件5的光检测部分5a偏离。 此外,光检测元件5利用光学树脂粘合剂63接合到基板2的前面2a。因此,可以减少由于光的热膨胀差而在光检测元件5上产生的应力 检测元件5和基板2.此外,在光检测元件5上,当从基本上垂直的方向观察时,形成至少位于光检测部分5a和光通过孔50之间的第一凸部101 到前平面2a。 因此,当光检测元件5通过光学树脂粘合剂63附着到基板2上时,光学树脂粘合剂63被阻挡在第一凸部101处。因此,防止光学树脂粘合剂63渗透到光通过 孔50。