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    • 1. 发明授权
    • Spectrometer module
    • 光谱仪模块
    • US09285270B2
    • 2016-03-15
    • US13637410
    • 2011-03-16
    • Katsumi ShibayamaTakafumi Yokino
    • Katsumi ShibayamaTakafumi Yokino
    • G01J3/28G01J3/02G01J3/18G01J3/36
    • G01J3/021G01J3/02G01J3/0202G01J3/0256G01J3/0262G01J3/0291G01J3/18G01J3/36
    • A spectroscopic module 1 is provided with a spectroscopic unit 8 and a photodetector 9 in addition to a spectroscopic unit 7 and a photodetector 4 and thus can enhance its detection sensitivity for light in a wide wavelength range or different wavelength regions of light. A light-transmitting hole 4b is disposed between light detecting portions 4a, 9a, while a reflection unit 6 is provided so as to oppose a region R in a light-absorbing substrate 2, whereby the size can be kept from becoming larger. Ambient light La is absorbed by the region R in the substrate 2. Any part of the light La transmitted through the region R in the substrate 2 is reflected to the region R by the unit 6 formed so as to oppose the region R, whereby stray light can be inhibited from being caused by the incidence of the light La.
    • 分光模块1除了分光单元7和光电检测器4之外还设置有分光单元8和光电检测器9,因此可以提高其在宽波长范围或不同波长区域中的光的检测灵敏度。 在光检测部分4a,9a之间设置透光孔4b,同时设置反射单元6以与光吸收基板2中的区域R相对,从而可以防止尺寸变大。 环境光La被衬底2中的区域R吸收。通过衬底2中的区域R透射的光La的任何部分被形成为与区域R相对的单元6反射到区域R,由此杂散 可以防止光被光La的发生引起。
    • 6. 发明申请
    • Optical Waveguide Chip And Method Of Manufacturing The Same
    • 光波导芯片及其制造方法
    • US20080212919A1
    • 2008-09-04
    • US11587143
    • 2005-04-21
    • Takafumi YokinoKatsumi Shibayama
    • Takafumi YokinoKatsumi Shibayama
    • G02B6/12B26D1/00
    • G02B6/30G02B6/13G02B2006/12147Y10T83/04
    • The present invention relates to an optical waveguide chip, etc., having a structure for effectively avoiding or suppressing peeling of an optical waveguide layer in a process of cutting a wafer. The optical waveguide chip comprises a substrate having a main surface, and an optical waveguide layer formed on the main surface of the substrate. The optical waveguide layer comprises a cladding portion and a core portion that is disposed inside the cladding portion and that has a higher refractive index than the cladding portion, and at least one of side surfaces of the optical waveguide layer is positioned at a predetermined distance toward a center of the main surface from an edge of the main surface. This arrangement includes an arrangement having a thin film portion at a peripheral region that includes the edge of the main surface. In the case that the optical waveguide layer has the thin film portion at its periphery, the optical waveguide layer has a side surface that coincide with the side surface of the substrate including the edge of the main surface and a side surface that is separated by a predetermined distance from edge of the main surface. By this arrangement, when cutting a wafer into chip units, even if chipping occurs at an edge of the main surface of the substrate to be cut, peeling of the optical waveguide layer, formed on the substrate, is suppressed effectively.
    • 本发明涉及在切割晶片的过程中具有有效地避免或抑制光波导层的剥离的结构的光波导芯片等。 光波导芯片包括具有主表面的基板和形成在基板的主表面上的光波导层。 光波导层包括包层部分和芯部分,该芯部分设置在包层部分内部并且具有比包层部分更高的折射率,并且光波导层的至少一个侧表面位于预定距离处 主表面的中心从主表面的边缘。 这种布置包括在包括主表面的边缘的周边区域具有薄膜部分的布置。 在光波导层的周边具有薄膜部的情况下,光波导层具有与包括主面的边缘的基板的侧面重合的侧面和由 距离主表面的预定距离。 通过这种布置,即使在将晶片切割成芯片单元时,即使在要切割的基板的主表面的边缘处发生切屑,也有效地抑制了形成在基板上的光波导层的剥离。