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1. 发明授权

US5763903A Avalanche photodiode for light detection 失效
标题翻译：用于光检测的雪崩光电二极管
公开(公告)号：US5763903A
公开(公告)日：1998-06-09
申请号：US516234
申请日：1995-08-17
申请人： Masaaki Mandai , Tomoyuki Yoshino , Tadao Akamine , Yutaka Saitoh , Junko Yamanaka , Osamu Koseki
发明人： Masaaki Mandai , Tomoyuki Yoshino , Tadao Akamine , Yutaka Saitoh , Junko Yamanaka , Osamu Koseki
IPC分类号： H01L27/144 , H01L31/02 , H01L31/0203 , H01L31/107 , H01L31/0328
CPC分类号： H01L31/0203 , H01L27/1443 , H01L27/1464 , H01L31/107 , H01L2224/73265 , H01L2924/01322 , H01L2924/10158
摘要： An avalanche photodiode for detecting x-rays and other radiation comprises a first substrate having a portion removed therefrom, a first insulating film formed on the first substrate, a second substrate comprising a floating zone silicon semiconductor substrate disposed on the first insulating film, an impurity region selectively formed in the second substrate at a surface corresponding to the removed portion, a PN junction formed on the second substrate, a glass substrate mounted to the second substrate, a first electrode formed on the first substrate for applying a voltage to the impurity region, a second electrode formed on the second substrate for applying a voltage to the second substrate, a third electrode formed on the glass substrate and electrically connected to the second electrode, and an integrated circuit package having a lead pin connected to the third electrode. Accordingly, a shallow depletion layer may be provided on a floating zone SOI substrate. The substrates may be joined to the glass substrate using a eutectic bonding process.
摘要翻译：用于检测X射线和其它辐射的雪崩光电二极管包括：第一衬底，其具有从其中去除的部分;第一绝缘膜，形成在第一衬底上;第二衬底，包括布置在第一绝缘膜上的浮动区硅半导体衬底，在与第二基板对应的表面上选择性地形成在第二基板上的区域，形成在第二基板上的PN结，安装到第二基板的玻璃基板，形成在第一基板上的用于向杂质区域施加电压的第一电极形成在第二基板上的用于向第二基板施加电压的第二电极，形成在玻璃基板上并电连接到第二电极的第三电极，以及具有连接到第三电极的引脚的集成电路封装。因此，可以在浮动区域SOI衬底上提供浅耗尽层。可以使用共晶接合工艺将基板连接到玻璃基板。

2. 发明授权

US5869893A Semiconductor device having a trapezoidal joint chip 失效
标题翻译：具有梯形接头芯片的半导体器件
公开(公告)号：US5869893A
公开(公告)日：1999-02-09
申请号：US816195
申请日：1997-03-12
申请人： Osamu Koseki , Takichi Ishii , Masaaki Mandai , Tomoyuki Yoshino , Hitoshi Takeuchi
发明人： Osamu Koseki , Takichi Ishii , Masaaki Mandai , Tomoyuki Yoshino , Hitoshi Takeuchi
IPC分类号： H01L21/98 , H01L23/538 , H01L23/34
CPC分类号： H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/04105 , H01L2224/16 , H01L2224/16225 , H01L2224/24137 , H01L2224/24227 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73267 , H01L2224/92 , H01L24/45 , H01L24/48 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , Y10S438/94
摘要： A semiconductor device comprises at least two semiconductor elements connected together at a connecting region of the semiconductor elements. At least one joint chip is adhered to the connection region of the semiconductor elements for connecting the semiconductor elements together. The joint chip has a trapezoidal cross-section defining a first surface and a second surface wider than the first surface. The second surface of the joint chip is adhered to the connection region of the semiconductor elements.
摘要翻译：半导体器件包括在半导体元件的连接区域处连接在一起的至少两个半导体元件。至少一个接合芯片粘附到用于将半导体元件连接在一起的半导体元件的连接区域。接头芯片具有限定第一表面和比第一表面更宽的第二表面的梯形横截面。接头芯片的第二表面粘附到半导体元件的连接区域。

3. 发明授权

US5639693A Semiconductor device and process for fabricating the same 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US5639693A
公开(公告)日：1997-06-17
申请号：US347864
申请日：1994-12-01
申请人： Osamu Koseki , Takichi Ishii , Masaaki Mandai , Tomoyuki Yoshino , Hitoshi Takeuchi
发明人： Osamu Koseki , Takichi Ishii , Masaaki Mandai , Tomoyuki Yoshino , Hitoshi Takeuchi
IPC分类号： H01L21/98 , H01L23/538 , H01L21/60
CPC分类号： H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/04105 , H01L2224/16 , H01L2224/16225 , H01L2224/24137 , H01L2224/24227 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73267 , H01L2224/92 , H01L24/45 , H01L24/48 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , Y10S438/94
摘要： A process for fabricating a semiconductor device which permits the placement of plural semiconductor chip devices at a reduced pitch comprises the steps of bonding a plurality of semiconductor chip devices to a substrate, forming a conductive thin film on the substrate to cover at least connecting regions of the semiconductor chip devices, and patterning the conductive thin film using an excimer laser to form interconnections between the respective semiconductor chip devices. The conductive thin film is formed by a method selected from physical vapor deposition and chemical vapor deposition. The step of bonding the semiconductor chip devices to a substrate is preferably performed using an epoxy-based adhesive. Preferably, an insulating film is formed on the plural semiconductor chip devices in regions except for the connection regions. Patterning of the conductive thin film is performed using an excimer laser beam emitted in two pulses at an output energy of 300 mJ/cm.sup.2.
摘要翻译：制造半导体器件的方法允许以减小的间距布置多个半导体芯片器件包括以下步骤：将多个半导体芯片器件接合到衬底上，在衬底上形成导电薄膜以至少覆盖至少连接区域半导体芯片器件，并且使用准分子激光器对导电薄膜进行构图以在各个半导体芯片器件之间形成互连。导电薄膜是通过选自物理气相沉积和化学气相沉积的方法形成的。将半导体芯片器件接合到衬底的步骤优选使用环氧类粘合剂进行。优选地，除了连接区域之外，在多个半导体芯片器件上形成绝缘膜。使用在300mJ / cm 2的输出能量下以两个脉冲发射的准分子激光束进行导电薄膜的图案化。

4. 发明授权

US08827429B2 Method of manufacturing liquid jet head, liquid jet head, and liquid jet apparatus 有权
标题翻译：液体喷射头，液体喷射头和液体喷射装置的制造方法
公开(公告)号：US08827429B2
公开(公告)日：2014-09-09
申请号：US13401888
申请日：2012-02-22
申请人： Osamu Koseki
发明人： Osamu Koseki
IPC分类号： B41J2/045 , H01L41/22 , H04R17/00
CPC分类号： B41J2/1609 , B41J2/14209 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1643 , B41J2/1646
摘要： In a method of manufacturing a liquid jet head, a piezoelectric substrate is bonded onto a first base. Ejection grooves for ejection channels and dummy grooves for dummy channels are alternately formed in parallel with one another. The ejection grooves and the dummy grooves have such a depth as to pierce the piezoelectric substrate and to reach the first base substrate. An electrode material is deposited on inner surfaces of the ejection grooves and the dummy grooves. A cover plate is bonded to the piezoelectric substrate so as to cover the ejection grooves and the dummy grooves. In a subsequent first base substrate removing step, a part of the first base substrate on a side opposite to the cover plate and the electrode material deposited on bottom surfaces of the dummy grooves are removed. A second base substrate is then bonded to the first base substrate.
摘要翻译：在液体喷射头的制造方法中，将压电基板接合在第一基底上。用于喷射通道的喷射槽和用于虚拟通道的虚拟槽彼此平行地交替地形成。喷射槽和虚拟槽具有刺穿压电基板并到达第一基底的深度。电极材料沉积在喷射槽和虚拟槽的内表面上。盖板结合到压电基板上以覆盖喷射槽和虚拟槽。在随后的第一基底去除步骤中，去除与盖板相对的一侧上的第一基底基板的一部分和沉积在虚拟凹槽的底表面上的电极材料。然后将第二基底接合到第一基底。

5. 发明授权

US07909436B2 Inkjet head, manufacturing method for the same, and inkjet recording apparatus 有权
标题翻译：喷墨头，其制造方法和喷墨记录装置
公开(公告)号：US07909436B2
公开(公告)日：2011-03-22
申请号：US12290153
申请日：2008-10-28
申请人： Osamu Koseki
发明人： Osamu Koseki
IPC分类号： B41J2/04
CPC分类号： B41J2/14209 , B41J2/1609 , B41J2/1623 , B41J2/1632 , B41J2/1642 , B41J2/1643 , Y10T29/42
摘要： An inkjet head has a first substrate having first groove portions formed on one surface of the first substrate and an ink supply path connected to the first groove portions and opening toward another surface of the first substrate. A second substrate has second groove portions and is connected to the first substrate so that the first and second groove portions jointly form ink chambers. First drive electrodes are formed on sidewalls of the first groove portions. Second drive electrodes are formed on sidewalls of the second groove portions. Conduction members are formed only adjacent to the ink supply path of the first substrate and electrically connect the respective first and second drive electrodes to one another.
摘要翻译：喷墨头具有第一基板，其具有形成在第一基板的一个表面上的第一凹槽部分和连接到第一凹槽部分并朝向第一基板的另一表面开口的墨水供应路径。第二基板具有第二凹槽部分并且连接到第一基板，使得第一和第二凹槽部分共同形成墨室。第一驱动电极形成在第一凹槽部分的侧壁上。第二驱动电极形成在第二槽部分的侧壁上。导电构件仅形成在第一基板的墨供给路径附近，并将各自的第一驱动电极和第二驱动电极彼此电连接。

6. 发明申请

US20090109263A1 Inkjet head, manufacturing method for the same, and inkjet recording apparatus 有权
标题翻译：喷墨头，其制造方法和喷墨记录装置
公开(公告)号：US20090109263A1
公开(公告)日：2009-04-30
申请号：US12290153
申请日：2008-10-28
申请人： Osamu Koseki
发明人： Osamu Koseki
IPC分类号： B41J2/045 , H01L41/22
CPC分类号： B41J2/14209 , B41J2/1609 , B41J2/1623 , B41J2/1632 , B41J2/1642 , B41J2/1643 , Y10T29/42
摘要： In order to provide an inkjet head easily manufactured while saving material costs and processing costs, and a manufacturing method for the same, an inkjet head comprises a first piezoelectric substrate which includes a plurality of first groove portions formed on one surface thereof and an ink supply path which is connected to the plurality of first groove portions and opens toward another surface thereof. A second piezoelectric substrate is bonded to the first piezoelectric substrate and includes a plurality of second groove portions forming ink chambers together with the plurality of first groove portions on a bonding surface between the first piezoelectric substrate and the second piezoelectric substrate. Drive electrodes are formed on side walls of the first groove portions and side walls of the second groove portions.
摘要翻译：为了在节省材料成本和加工成本的同时提供容易制造的喷墨头及其制造方法，喷墨头包括：第一压电基板，其包括形成在其一个表面上的多个第一凹槽部分和墨水供应部路径，其连接到多个第一槽部并朝向其另一个表面开口。第二压电基板被接合到第一压电基板，并且包括在第一压电基板和第二压电基板之间的接合表面上与多个第一凹槽部分一起形成墨室的多个第二凹槽部分。驱动电极形成在第一槽部的侧壁和第二槽部的侧壁上。

7. 发明授权

US07172271B2 Ink-jet print head and ink-jet recording apparatus 有权
标题翻译：喷墨打印头和喷墨记录装置
公开(公告)号：US07172271B2
公开(公告)日：2007-02-06
申请号：US10397863
申请日：2003-03-26
申请人： Kazuyoshi Tominaga , Osamu Koseki , Masaki Denda , Tomiharu Makishima , Yasuhito Sekiya , Jun Tsuneyoshi , Yuuji Nakamura , Kentarou Suzuki
发明人： Kazuyoshi Tominaga , Osamu Koseki , Masaki Denda , Tomiharu Makishima , Yasuhito Sekiya , Jun Tsuneyoshi , Yuuji Nakamura , Kentarou Suzuki
IPC分类号： B41J2/045
CPC分类号： B41J2/14145
摘要： An ink-jet print head has a piezoelectric ceramic plate having grooves for receiving ink, a nozzle plate connected to the piezoelectric ceramic plate and having nozzle apertures each disposed in communication with respective ones of the grooves, and an ink storing device for storing ink. An ink chamber plate is connected to the piezoelectric ceramic plate and has an ink chamber for supplying ink from the ink storing device to the grooves. A base plate is connected to a side of the ink chamber plate and has an ink reservoir defining a portion of an ink flow path for transporting ink from the ink storing device to the ink chamber of the ink chamber plate. The ink reservoir has at least one tapered portion progressively diverging in a direction toward the ink chamber of the ink chamber plate.
摘要翻译：喷墨打印头具有压电陶瓷板，其具有用于接收墨水的凹槽，连接到压电陶瓷板的喷嘴板，并且具有各自设置成与各个凹槽连通的喷嘴孔，以及用于存储墨水的墨水存储装置。墨室板连接到压电陶瓷板，并且具有用于将油墨从储墨装置供给到凹槽的墨室。基板连接到墨室板的一侧，并且具有限定用于将墨从墨存储装置输送到墨室板的墨室的墨流路的一部分的墨储存器。墨水储存器具有至少一个锥形部分，朝向墨水室板的墨水腔的方向逐渐发散。

8. 发明申请

US20070008384A1 Inkjet head and inkjet recording device 有权
标题翻译：喷墨头和喷墨记录装置
公开(公告)号：US20070008384A1
公开(公告)日：2007-01-11
申请号：US11388372
申请日：2006-03-24
申请人： Osamu Koseki
发明人： Osamu Koseki
IPC分类号： B41J2/05
CPC分类号： B41J2/19 , B41J2/14209 , B41J2/17563 , B41J2002/14403 , B41J2002/14419 , B41J2202/07
摘要： An inkjet head capable of achieving stable ejection of ink by preventing air bubbles from being left in the upstream side of a nozzle of a filter element such as mesh filter that is provided in an inkjet head owing to the efficient use of the open area of the filter element. The inkjet head is provided to have a fluid channel communicated with the atmosphere from the upstream side region of the filter element such as mesh filter, with regard to the nozzle without passing through the filter element and the nozzle.
摘要翻译：一种喷墨头，其能够通过防止气泡留在喷墨头中设置的网状过滤器等过滤元件的喷嘴的上游侧，从而能够实现油墨的稳定喷射，这是由于有效利用了喷墨头的开放区域过滤元件喷墨头设置成具有与过滤元件的上游侧区域（例如网状过滤器）相连的与大气连通的流体通道，而不通过过滤元件和喷嘴。

9. 发明授权

US06811247B2 Ink jet head and ink jet recording apparatus 有权
标题翻译：喷墨头和喷墨记录装置
公开(公告)号：US06811247B2
公开(公告)日：2004-11-02
申请号：US10434322
申请日：2003-05-08
申请人： Kazuyoshi Tominaga , Osamu Koseki , Kentaro Suzuki , Yuji Nakamura , Yasuhito Sekiya , Jun Tsuneyoshi , Tomiharu Makishima , Masaki Denda
发明人： Kazuyoshi Tominaga , Osamu Koseki , Kentaro Suzuki , Yuji Nakamura , Yasuhito Sekiya , Jun Tsuneyoshi , Tomiharu Makishima , Masaki Denda
IPC分类号： B41J204
CPC分类号： B41J2/19 , B41J2/055 , B41J2/14209 , B41J2/17563
摘要： To provide an ink jet head and an ink jet recording apparatus in which it is possible to reliably prevent ink bubbles from staying in the ink sump and the interior of the head chip and in which it is relatively easy to remove the bubbles. The ink jet head includes: a plurality of grooves arranged side by side so as to communicate with nozzle openings; an ink chamber for supplying ink to each of the grooves; an ink sump provided so as to communicate with the ink chamber; and ink storage unit (50) communicating with the ink sump through ink supply passages, in which there is provided an air duct (100) establishing communication between a region in the ink sump which is substantially free from interference with an ink flow from the ink supply passages (33) to the ink chamber and in which bubbles easily gather and an air region of the ink storage unit (50). Therefore, the bubbles in the ink can be surely removed.
摘要翻译：为了提供一种喷墨头和喷墨记录装置，其中可以可靠地防止墨泡停留在墨水槽和头部芯片的内部，并且其中相对容易去除气泡。喷墨头包括：与喷嘴开口连通的并排布置的多个槽; 用于向每个凹槽供墨的墨室; 设置为与墨水室连通的墨水槽; 以及油墨存储单元（50），其通过供墨通道与油墨槽连通，其中设置有空气管道（100），该空气管道（100）在墨水池中的区域之间建立连通，所述区域基本上不受来自墨水的墨流的干扰供应通道（33）到墨水室，并且其中气泡容易聚集，并且墨水存储单元（50）的空气区域。因此，能够可靠地除去油墨中的气泡。

10. 发明授权

US5455203A Method of adjusting the pressure detection value of semiconductor pressure switches 失效
标题翻译：调整半导体压力开关压力检测值的方法
公开(公告)号：US5455203A
公开(公告)日：1995-10-03
申请号：US16767
申请日：1993-02-11
申请人： Osamu Koseki , Yoshifumi Yoshida
发明人： Osamu Koseki , Yoshifumi Yoshida
IPC分类号： B81B3/00 , H01H1/00 , H01H35/26 , H01H35/34 , H01L21/465
CPC分类号： H01H35/34 , H01H1/0036 , H01H35/2607 , Y10S148/093
摘要： A method of adjusting a semiconductor pressure switch of the type having a silicon substrate having a pressure receiving diaphragm includes mounting and pressurizing the semiconductor pressure switch in a pressure chamber and measuring the pressure of the switch to determine if the pressure is above or below the predetermined pressure detection value. If the measured pressure is above the predetermined pressure detection value, the thickness of the diaphragm is adjusted by thinning the diaphragm to adjust the measured pressure to the predetermined pressure detection value. If the measured pressure is below the predetermined pressure detection value, the thickness of the diaphragm is adjusted by thickenning the diaphragm to adjust the measured pressure to the predetermined pressure detection value.
摘要翻译：一种调节具有具有压力接收膜的硅衬底的半导体压力开关的方法包括：在压力室中安装并加压半导体压力开关并测量开关的压力，以确定压力是否高于或低于预定值压力检测值。如果测量的压力高于预定压力检测值，则通过使隔膜变薄来调节隔膜的厚度，以将测量的压力调节到预定压力检测值。如果测量的压力低于预定的压力检测值，则通过增厚隔膜来调节隔膜的厚度，以将测量的压力调节到预定的压力检测值。

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