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    • 1. 发明授权
    • Method and system for using a spacer to offset implant damage and reduce lateral diffusion in flash memory devices
    • 使用间隔物补偿植入物损伤并减少闪存装置中的横向扩散的方法和系统
    • US06410956B1
    • 2002-06-25
    • US09478864
    • 2000-01-07
    • Vei-Han ChanScott D. LuningMark RandolphNicholas H. TripsasDaniel SobekJanet WangTimothy J. ThurgateSameer Haddad
    • Vei-Han ChanScott D. LuningMark RandolphNicholas H. TripsasDaniel SobekJanet WangTimothy J. ThurgateSameer Haddad
    • H01L2976
    • H01L29/66825
    • A system and method for providing a memory cell on a semiconductor is disclosed. In one aspect, the method and system include providing at least one gate stack on the semiconductor, depositing at least one spacer, and providing at least one source implant in the semiconductor. The at least one gate stack has an edge. A portion of the at least one spacer is disposed along the edge of the at least one gate stack. In another aspect, the method and system include providing at least one gate stack on the semiconductor, providing a first junction implant in the semiconductor, depositing at least one spacer, and providing a second junction implant in the semiconductor after the at least one spacer is deposited. The at least one gate stack has an edge. A portion of the at least one spacer is disposed at the edge of the at least one gate stack. In a third aspect, the method and system include providing at least one gate stack on the semiconductor, providing at least one source implant in the semiconductor, depositing at least one spacer after the at least one source implant is provided, and providing at least one drain implant in the semiconductor after the spacer is deposited. The at least one gate has an edge. A portion of the at least one spacer is disposed along the edge of the at least one gate.
    • 公开了一种在半导体上提供存储单元的系统和方法。 在一个方面,所述方法和系统包括在半导体上提供至少一个栅极堆叠,沉积至少一个间隔物,以及在半导体中提供至少一个源极注入。 至少一个栅极堆叠具有边缘。 所述至少一个间隔物的一部分沿着所述至少一个栅极叠层的边缘设置。 在另一方面,该方法和系统包括在半导体上提供至少一个栅极叠层,在半导体中提供第一结注入,沉积至少一个间隔物,以及在至少一个间隔物之后在半导体中提供第二结注入 存放 至少一个栅极堆叠具有边缘。 所述至少一个间隔件的一部分设置在所述至少一个栅极叠层的边缘处。 在第三方面,所述方法和系统包括在半导体上提供至少一个栅极堆叠,在半导体中提供至少一个源极注入,在提供至少一个源极植入之后沉积至少一个间隔物,并且提供至少一个 在间隔物沉积之后在半导体中的漏极注入。 至少一个门具有边缘。 所述至少一个间隔物的一部分沿着所述至少一个栅极的边缘设置。
    • 3. 发明授权
    • Use of a large angle implant and current structure for eliminating a critical mask in flash memory processing
    • 使用大角度注入和电流结构来消除闪存处理中的关键掩模
    • US06168637A
    • 2001-01-02
    • US08991322
    • 1997-12-16
    • Mark RandolphTimothy J. ThurgateScott D. Luning
    • Mark RandolphTimothy J. ThurgateScott D. Luning
    • H01L218247
    • H01L27/11521Y10T29/41
    • A method and system for providing a flash memory cell on a semiconductor is disclosed. In one aspect, the method and system include providing a plurality of gate stacks and providing a drain implant at an angle. The plurality of gate stacks define a plurality of drain areas and a plurality of source areas. The angle is measured from a direction perpendicular to the surface of the semiconductor. The angle allows the plurality of gate stacks to block the drain implant from reaching the plurality of source areas. In another aspect, the method and system include providing a plurality of gate stacks and providing a source implant at an angle. The plurality of gate stacks define a plurality of drain areas and a plurality of source areas. The angle is measured from a direction perpendicular to the surface of the semiconductor. The angle allows the plurality of gate stacks to block the source implant from reaching the plurality of drain areas.
    • 公开了一种用于在半导体上提供闪存单元的方法和系统。 在一个方面,该方法和系统包括提供多个栅极堆叠并以一定角度提供漏极注入。 多个栅极堆叠限定多个漏极区域和多个源极区域。 该角度是从垂直于半导体表面的方向测量的。 该角度允许多个栅极堆叠阻挡漏极植入物到达多个源极区域。 在另一方面,该方法和系统包括提供多个栅极叠层并以一定角度提供源植入物。 多个栅极堆叠限定多个漏极区域和多个源极区域。 该角度是从垂直于半导体表面的方向测量的。 该角度允许多个栅极堆叠阻挡源植入物到达多个漏极区域。
    • 4. 发明授权
    • Method and system for gate stack reoxidation control
    • 栅堆叠再氧化控制方法与系统
    • US6015736A
    • 2000-01-18
    • US993787
    • 1997-12-19
    • Scott D. LuningMark Randolph
    • Scott D. LuningMark Randolph
    • H01L21/28H01L21/26
    • H01L21/28273Y10S438/911Y10T29/41
    • A system and method for providing at least one memory cell on a semiconductor is disclosed. The method and system include providing a tunneling barrier on the semiconductor, providing at least one floating gate having a corner, and oxidizing the tunneling barrier, a portion of the semiconductor, and the at least one floating gate. A portion of the at least one floating gate including the corner is disposed above the tunneling barrier. The portion of the semiconductor oxidizes at a first rate and at least the corner of the at least one floating gate oxidizes at a second rate. The second rate is sufficiently higher than the first rate to provide a desired thickness of the tunneling barrier a distance from the corner of the at least one floating gate for a particular rounding of the corner of the at least one floating gate.
    • 公开了一种在半导体上提供至少一个存储单元的系统和方法。 所述方法和系统包括在半导体上提供隧道势垒,提供至少一个具有拐角的浮动栅极,以及氧化隧道势垒,半导体的一部分和至少一个浮动栅极。 包括拐角的至少一个浮动栅极的一部分设置在隧道势垒上方。 半导体的部分以第一速率氧化,并且至少一个浮栅的至少角部以第二速率氧化。 第二速率足够高于第一速率,以便为至少一个浮动门的拐角的特定四舍五入提供距离至少一个浮动栅极的角的距离的隧道势垒的期望厚度。
    • 8. 发明授权
    • High K stack for non-volatile memory
    • 高K堆栈用于非易失性存储器
    • US07492001B2
    • 2009-02-17
    • US11086310
    • 2005-03-23
    • Wei ZhengMark RandolphHidehiko Shiraiwa
    • Wei ZhengMark RandolphHidehiko Shiraiwa
    • H01L29/788H01L29/72
    • H01L29/792G11C16/0475H01L21/28273H01L21/28282
    • A memory device may include a source region and a drain region formed in a substrate and a channel region formed in the substrate between the source and drain regions. The memory device may further include a first oxide layer formed over the channel region, the first oxide layer having a first dielectric constant, and a charge storage layer formed upon the first oxide layer. The memory device may further include a second oxide layer formed upon the charge storage layer, a layer of dielectric material formed upon the second oxide layer, the dielectric material having a second dielectric constant that is greater than the first dielectric constant, and a gate electrode formed upon the layer of dielectric material.
    • 存储器件可以包括形成在衬底中的源极区域和漏极区域以及形成在源极和漏极区域之间的衬底中的沟道区域。 存储器件还可以包括形成在沟道区上的第一氧化物层,第一氧化物层具有第一介电常数,以及形成在第一氧化物层上的电荷存储层。 存储器件还可以包括形成在电荷存储层上的第二氧化物层,形成在第二氧化物层上的介电材料层,介电材料具有大于第一介电常数的第二介电常数,以及栅电极 形成在电介质材料层上。