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1. 发明授权

US06610960B2 Method for drilling micro-holes with a laser beam 失效
公开(公告)号：US06610960B2
公开(公告)日：2003-08-26
申请号：US10079895
申请日：2002-02-22
申请人： Hubert De Steur , Sébastian Edmé , Marcel Heerman , Eddy Roelants
发明人： Hubert De Steur , Sébastian Edmé , Marcel Heerman , Eddy Roelants
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , H05K3/0035
摘要： To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region. The effective energy density in the second operation is selected, by setting the defocusing and the circumferential velocity, in such a way that the effective energy density lies below the threshold for ablation of the second metal layer.

2. 发明授权

US06783688B2 Method and apparatus for structuring printed circuit boards 失效
标题翻译：用于构造印刷电路板的方法和装置
公开(公告)号：US06783688B2
公开(公告)日：2004-08-31
申请号：US10079896
申请日：2002-02-22
申请人： Hubert De Steur , Marcel Heerman , Eddy Roelants
发明人： Hubert De Steur , Marcel Heerman , Eddy Roelants
IPC分类号： H05K302
CPC分类号： H05K3/027 , H05K1/0263 , H05K1/0265 , H05K3/062 , H05K3/4644 , H05K2201/09727 , H05K2203/108
摘要： A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left. As a result of the removal of the rest of the etch resist, the surfaces of the conductor tracks which are produced are then exposed.
摘要翻译：可以使用方法和装置来对印刷电路板的为粗体导体结构提供的区域和为印刷电路板的相对精细的导体结构提供的区域进行图案化。在每种情况下，这可以通过激光加工完成。这两个区域首先涂覆有连续的金属化层并用蚀刻电阻器覆盖。通过暴露不需要的金属表面，通过具有较长波长的激光束预定义粗导体结构。此外，通过用相对较短的波长的激光束处理该抗蚀剂，该细导体结构也是预成形的。然后，在普通的蚀刻工艺中，金属层的所有暴露的表面区域被蚀刻掉，使得仅留下被剩余的抗蚀剂覆盖的粗略和细小的导体轨道结构。作为去除其余抗蚀剂的结果，然后暴露出所产生的导体迹线的表面。

3. 发明授权

US06531679B2 Method for the laser machining of organic materials 失效
标题翻译：有机材料激光加工方法
公开(公告)号：US06531679B2
公开(公告)日：2003-03-11
申请号：US09965207
申请日：2001-09-27
申请人： Marcel Heerman , Eddy Roelants , Hubert De Steur
发明人： Marcel Heerman , Eddy Roelants , Hubert De Steur
IPC分类号： B23K2638
CPC分类号： B23K26/18 , B23K26/361 , B23K2103/30 , B23K2103/50
摘要： For the laser machining of organic materials, a laser with the below listed parameters is used. The laser has a wavelength of 300 nm to 1200 nm, a pulse width of 20 kHz. To increase a degree of absorption and consequently the machining rate, additives with good absorption of the laser beam with the respectively chosen wavelength are admixed with the organic materials.
摘要翻译：对于有机材料的激光加工，使用具有下列参数的激光。激光器具有300nm至1200nm的波长，<50ns的脉冲宽度和> 20kHz的脉冲频率。为了增加吸收程度和加工速度，将具有分别选择的波长的激光束吸收良好的添加剂与有机材料混合。

4. 发明授权

US06649864B2 Method of laser drilling 失效
公开(公告)号：US06649864B2
公开(公告)日：2003-11-18
申请号：US10076301
申请日：2002-02-19
申请人： Hubert De Steur , Hans Juergen Mayer , Otto Märten , Christian Overmann , Wei Pan , Eddy Roelants , Martin Wehner
发明人： Hubert De Steur , Hans Juergen Mayer , Otto Märten , Christian Overmann , Wei Pan , Eddy Roelants , Martin Wehner
IPC分类号： B23K2600
CPC分类号： H05K3/0032 , B23K26/389 , H05K2203/0554
摘要： In a method for the laser drilling of holes in a circuit substrate with the aid of a perforated mask, a laser beam is moved in the region of the perforated mask on a circular path. The center point of the region lies concentrically with respect to the set position of the respective hole in the mask. Further, the diameter of the region is smaller than the diameter of the hole. At the same time, the diameter of the laser beam spot is chosen to be large enough that it always covers the center point of the perforated mask during the circular motion. As a result, an energy distribution of the laser energy, which is as uniform as possible, is achieved in the region of the perforated mask.

5. 发明授权

US06833528B2 Method and apparatus for laser processing 失效
标题翻译：激光加工方法和装置
公开(公告)号：US06833528B2
公开(公告)日：2004-12-21
申请号：US10378884
申请日：2003-03-05
申请人： Hubert De Steur , Eddy Roelants
发明人： Hubert De Steur , Eddy Roelants
IPC分类号： B23K2638
CPC分类号： B23K26/0624 , B23K26/389 , B23K2101/42 , H05K3/0032
摘要： A method and an apparatus are for rapidly processing dielectric substrates using laser beams. A pulsed laser beam having a pulse repetition frequency greater than approximately 50 kHz and having pulse lengths shorter than approximately 200 ns is used for this purpose. Given a suitable choice of the parameters which characterize the processing laser beam, it is possible to ensure both a high throughput of bored holes and a high hole quality. With the use of a Q-switched CO2 laser, a wavelength of approximately 9.2 &mgr;m and a pulse energy of approximately 0.7 mJ are used. As a result, by way of example, 500 holes per second can be bored into an LCP substrate having a thickness of 0.4 mm. The high throughput and the simultaneously high hole quality are a consequence of the wavelength chosen, the short pulse lengths, the high repetition rate and the pulse energy that is likewise high compared with conventional laser processing apparatuses in the area of electronic fabrication.
摘要翻译：用于使用激光束快速处理电介质基片的方法和装置。为此，使用具有大于约50kHz的脉冲重复频率并具有短于约200ns的脉冲长度的脉冲激光束。考虑到处理激光束的特征参数的合适选择，可以确保钻孔的高生产率和高孔质量。使用Q开关CO2激光器，使用约9.2μm波长的波长和约0.7mJ的脉冲能量。结果，作为示例，可以将每秒500个孔孔钻入厚度为0.4mm的LCP基板中。高通量和同时高孔质量是选择的波长，短脉冲长度，高重复率和脉冲能量的结果，与电子制造领域的传统激光加工设备相比是高的。

6. 发明授权

US06781092B2 Method for drilling holes in a substrate 失效
标题翻译：在基板上钻孔的方法
公开(公告)号：US06781092B2
公开(公告)日：2004-08-24
申请号：US10369623
申请日：2003-02-21
申请人： Hubert De Steur , Alexander Kilthau , Andre Kletti , Hans Juergen Mayer , Petra Mitzinneck , Eddy Roelants , Oliver Thuerk , Marc Van Biesen
发明人： Hubert De Steur , Alexander Kilthau , Andre Kletti , Hans Juergen Mayer , Petra Mitzinneck , Eddy Roelants , Oliver Thuerk , Marc Van Biesen
IPC分类号： B23K2600
CPC分类号： H05K3/0032 , B23K26/389 , B23K2101/42 , H05K3/0035 , H05K2201/0394 , H05K2203/0554
摘要： When holes are being drilled in an electric circuit substrate, a laser beam is moved on concentric circular tracks in the region of the hole to be drilled. The transition from one circular track to the next takes place in each case on an arc that departs approximately tangentially from the circular track last traversed and nestles approximately tangentially against the circular track newly to be described in such a way that in each case the starting point of a new circular track is offset by a prescribed angle from the starting point of the preceding circular track.
摘要翻译：当在电路基板中钻孔时，激光束在待钻孔的区域中的同心圆形轨道上移动。从一个圆形轨迹到下一个轨迹的过渡在每一种情况下都发生在与最后穿过的圆形轨迹大致相切地离开的弧上，并且以这样一种方式近似地切合近似于待描述的圆形轨道，即在每种情况下起始点新的圆形轨道的距离与前一圆形轨道的起点偏移了一个规定的角度。

7. 发明授权

US06576402B2 Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures 失效
公开(公告)号：US06576402B2
公开(公告)日：2003-06-10
申请号：US09835336
申请日：2001-04-16
申请人： Marcel Heerman , Eddy Roelants , Jozef Van Puymbroeck
发明人： Marcel Heerman , Eddy Roelants , Jozef Van Puymbroeck
IPC分类号： H05K300
CPC分类号： H05K1/0265 , H05K3/027 , H05K3/062 , H05K3/064 , H05K3/426 , H05K3/4644 , H05K2201/09727 , H05K2203/0361 , Y10S430/146
摘要： A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures and the entire region of the later fine conductor structures. After the uncovered etching resist has been stripped, the photoresist is removed, whereupon the etching resist is patterned with the aid of a laser beam in such a way that it has the pattern of the fine conductor structures. The coarse conductor structures and the fine conductor structures are then formed in a common etching process.

8. 发明授权

US06437283B1 Device and method for processing substrates 有权
标题翻译：用于处理基板的装置和方法
公开(公告)号：US06437283B1
公开(公告)日：2002-08-20
申请号：US09725348
申请日：2000-11-29
申请人： Udo Wiggermann , Alex Schreiner , Hans Jürgen Mayer , Leo Higgins , Eddy Roelants
发明人： Udo Wiggermann , Alex Schreiner , Hans Jürgen Mayer , Leo Higgins , Eddy Roelants
IPC分类号： B23K2638
CPC分类号： B23K26/0613 , B23K26/0604 , B23K26/073 , B23K26/389 , H05K3/0026 , H05K3/027 , H05K2203/108
摘要： When a laser beam is focussed onto a substrate for the purpose of substrate processing, the optical units such as beam expander, deflecting unit, and optical imaging device prescribe the range of depth of focus in which it is possible to work with a minimum spot size. The difficulty of boring thin holes, especially in thick substrates, is overcome with a second laser beam that is widened via a second beam expander and likewise focused onto the substrate via the deflecting unit and the optical imaging device. The position and the length of the second range of depth of focus can be varied by selecting the magnification of the second beam expander or by maladjustment. Thin holes can also be bored into thick substrates by using the two laser beams one after another.
摘要翻译：当激光束聚焦到基板上用于基板处理时，诸如光束扩展器，偏转单元和光学成像装置的光学单元规定了可以以最小光斑尺寸工作的聚焦深度的范围。通过第二激光束通过第二光束扩展器加宽并同样通过偏转单元和光学成像装置聚焦到基板上，克服了在较厚基板上钻孔细孔的难度。可以通过选择第二光束扩展器的放大率或通过不适应来改变第二焦深范围的位置和长度。通过使用两个激光束一个接一个地也可以将细孔钻入厚基板中。

9. 发明授权

US06678061B2 Method of calibrating the optical system of a laser machine for processing electrical circuit substrates 失效
标题翻译：用于校准用于处理电路基板的激光机的光学系统的方法
公开(公告)号：US06678061B2
公开(公告)日：2004-01-13
申请号：US10121731
申请日：2002-04-15
申请人： Alexander Kilthau , Andre Kletti , Hans Juergen Mayer , Eddy Roelants
发明人： Alexander Kilthau , Andre Kletti , Hans Juergen Mayer , Eddy Roelants
IPC分类号： G01B1114
CPC分类号： B23K26/04 , B23K26/02 , B23K26/705 , H05K3/0026
摘要： To calibrate the optical system of a laser machine having a laser source, a deflecting unit and an imaging unit, firstly a first sample plate is arranged in the focal plane of the imaging unit, with prescribed grid points being marked by the laser beam. After that, the marked points are measured by means of a camera, and their position values are compared with the prescribed position values of the target points, in order to derive first correction values from this and store them. After that, a second sample plate is arranged in a second calibrating plane, at a distance from the focal plane, and is targeted by the laser beam and provided with markings. The second sample plate is measured by the camera, and the measured positions of the markings are compared with the positions of the target points, in order to derive second correction values and store them. From the stored first and second correction values of the two planes, correction values can then be determined by interpolation for arbitrary target points in the spatial region between the focal plane and the second calibrating plane and be used for the activation of the deflecting unit.
摘要翻译：为了校准具有激光源，偏转单元和成像单元的激光机的光学系统，首先将第一样品板布置在成像单元的焦平面中，其中规定的网格点由激光束标记。之后，通过照相机测量标记点，并将它们的位置值与目标点的规定位置值进行比较，以便从中导出第一校正值并存储它们。之后，将第二样品板设置在与焦平面相距一定距离的第二校准平面中，并由激光束对准并具有标记。通过相机测量第二样品板，并将标记的测量位置与目标点的位置进行比较，以得到第二校正值并存储它们。根据所存储的两个平面的第一和第二校正值，可以通过对焦平面和第二校准平面之间的空间区域中的任意目标点的插值来确定校正值，并且用于激活偏转单元。

10. 发明授权

US5134056A Method for applying a solder resist layer to a printed circuit board 失效
标题翻译：将印刷电路板应用于焊接电阻层的方法
公开(公告)号：US5134056A
公开(公告)日：1992-07-28
申请号：US631944
申请日：1990-12-21
申请人： Hans-Fr. Schmidt , Helmut Hadwiger , Milan Prochazka , Eddy Roelants
发明人： Hans-Fr. Schmidt , Helmut Hadwiger , Milan Prochazka , Eddy Roelants
IPC分类号： G03F7/00 , H05K3/28
CPC分类号： H05K3/28 , H05K2201/09118 , H05K2203/0585 , H05K2203/107 , H05K2203/1105
摘要： A solder resist and a positively-acting photoresist are successively applied on a surface-wide basis onto a printed circuit board, whereupon the photoresist is selectively exposed and developed in the region of plated-through holes and/or solder pads of a printed conductor pattern carried on the printed circuit board, preferably with the assistance of laser beams. Subsequently, the solder resist is stripped in the regions not protected by the photoresist, i.e. in the regions of plated-through holes and/or solder pads and, as a last step, the remaining photoresist is likewise stripped. The method is particularly suited for the application of a solder resist layer onto three-dimensional printed circuit boards since traditional mask techniques for structuring the solder resist cannot be employed with respect to three-dimensional printed circuit boards.
摘要翻译：在表面宽度的基础上连续地施加阻焊剂和正性光致抗蚀剂到印刷电路板上，于是在印刷导体图案的电镀通孔和/或焊盘的区域中选择性地暴露和显影光致抗蚀剂最好在激光束的帮助下携带在印刷电路板上。随后，在未被光致抗蚀剂保护的区域，即在通孔和/或焊盘的区域中剥离阻焊剂，并且作为最后一步，同样剥离剩余的光致抗蚀剂。该方法特别适用于在三维印刷电路板上应用阻焊层，因为用于构造阻焊剂的传统掩模技术不能用于三维印刷电路板。

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