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1. 发明授权

US06610960B2 Method for drilling micro-holes with a laser beam 失效
公开(公告)号：US06610960B2
公开(公告)日：2003-08-26
申请号：US10079895
申请日：2002-02-22
申请人： Hubert De Steur , Sébastian Edmé , Marcel Heerman , Eddy Roelants
发明人： Hubert De Steur , Sébastian Edmé , Marcel Heerman , Eddy Roelants
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , H05K3/0035
摘要： To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region. The effective energy density in the second operation is selected, by setting the defocusing and the circumferential velocity, in such a way that the effective energy density lies below the threshold for ablation of the second metal layer.

2. 发明授权

US06783688B2 Method and apparatus for structuring printed circuit boards 失效
标题翻译：用于构造印刷电路板的方法和装置
公开(公告)号：US06783688B2
公开(公告)日：2004-08-31
申请号：US10079896
申请日：2002-02-22
申请人： Hubert De Steur , Marcel Heerman , Eddy Roelants
发明人： Hubert De Steur , Marcel Heerman , Eddy Roelants
IPC分类号： H05K302
CPC分类号： H05K3/027 , H05K1/0263 , H05K1/0265 , H05K3/062 , H05K3/4644 , H05K2201/09727 , H05K2203/108
摘要： A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left. As a result of the removal of the rest of the etch resist, the surfaces of the conductor tracks which are produced are then exposed.
摘要翻译：可以使用方法和装置来对印刷电路板的为粗体导体结构提供的区域和为印刷电路板的相对精细的导体结构提供的区域进行图案化。在每种情况下，这可以通过激光加工完成。这两个区域首先涂覆有连续的金属化层并用蚀刻电阻器覆盖。通过暴露不需要的金属表面，通过具有较长波长的激光束预定义粗导体结构。此外，通过用相对较短的波长的激光束处理该抗蚀剂，该细导体结构也是预成形的。然后，在普通的蚀刻工艺中，金属层的所有暴露的表面区域被蚀刻掉，使得仅留下被剩余的抗蚀剂覆盖的粗略和细小的导体轨道结构。作为去除其余抗蚀剂的结果，然后暴露出所产生的导体迹线的表面。

3. 发明授权

US06531679B2 Method for the laser machining of organic materials 失效
标题翻译：有机材料激光加工方法
公开(公告)号：US06531679B2
公开(公告)日：2003-03-11
申请号：US09965207
申请日：2001-09-27
申请人： Marcel Heerman , Eddy Roelants , Hubert De Steur
发明人： Marcel Heerman , Eddy Roelants , Hubert De Steur
IPC分类号： B23K2638
CPC分类号： B23K26/18 , B23K26/361 , B23K2103/30 , B23K2103/50
摘要： For the laser machining of organic materials, a laser with the below listed parameters is used. The laser has a wavelength of 300 nm to 1200 nm, a pulse width of 20 kHz. To increase a degree of absorption and consequently the machining rate, additives with good absorption of the laser beam with the respectively chosen wavelength are admixed with the organic materials.
摘要翻译：对于有机材料的激光加工，使用具有下列参数的激光。激光器具有300nm至1200nm的波长，<50ns的脉冲宽度和> 20kHz的脉冲频率。为了增加吸收程度和加工速度，将具有分别选择的波长的激光束吸收良好的添加剂与有机材料混合。

4. 发明授权

US06639180B1 Method for describing a predetermined desired course with a beam consisting of particles or waves and use of this method 失效
标题翻译：用由粒子或波浪组成的光束描述预定的期望路线的方法和使用该方法
公开(公告)号：US06639180B1
公开(公告)日：2003-10-28
申请号：US10018381
申请日：2002-04-29
申请人： Hubert De Steur , Marcel Heerman
发明人： Hubert De Steur , Marcel Heerman
IPC分类号： B23K2600
CPC分类号： B23K26/08 , B23K26/082
摘要： The invention relates to a method for describing a predetermined desired course (1) with a beam of particles or waves, wherein a movable beam-directing device influences the direction of the beam, so that the latter describes an actual course (3, 4). The deviation of the actual course (3, 4) from the desired course due to inertia is minimized by specifying a corrected desired course (2), which describes diversions at the point of direction changes. The invention also relates to the use of this method for laser structuring or for writing guard plates or dial plates.
摘要翻译：本发明涉及一种用粒子或波束描述预定的期望路线（1）的方法，其中可移动的光束引导装置影响光束的方向，使得后者描述实际的光线（3,4）。通过指定校正的所需路线（2），实际路线（3,4）与惯性所期望的路线的偏差最小化，其中描述了方向改变点处的转向。本发明还涉及这种方法用于激光结构或书写防护板或表盘的用途。

5. 发明授权

US06713719B1 Method and device for laser drilling laminates 失效
标题翻译：激光钻孔层压板的方法和装置
公开(公告)号：US06713719B1
公开(公告)日：2004-03-30
申请号：US10089301
申请日：2002-03-29
申请人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
发明人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/50 , H05K3/0055 , H05K2201/0112 , H05K2203/0195
摘要： A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width
摘要翻译：用于层压板的激光钻孔的方法和装置包括使用倍频Nd钒酸盐激光器。激光器包括以下参数：金属层的脉冲宽度<40ns，脉冲频率> = 30kHz，介电层的脉冲宽度> 20kHz，波长= 532nmn。这种激光器用于具有至少一个金属层和至少一个包括有机材料的介电层的层压板的激光钻孔。

6. 发明授权

US06649864B2 Method of laser drilling 失效
公开(公告)号：US06649864B2
公开(公告)日：2003-11-18
申请号：US10076301
申请日：2002-02-19
申请人： Hubert De Steur , Hans Juergen Mayer , Otto Märten , Christian Overmann , Wei Pan , Eddy Roelants , Martin Wehner
发明人： Hubert De Steur , Hans Juergen Mayer , Otto Märten , Christian Overmann , Wei Pan , Eddy Roelants , Martin Wehner
IPC分类号： B23K2600
CPC分类号： H05K3/0032 , B23K26/389 , H05K2203/0554
摘要： In a method for the laser drilling of holes in a circuit substrate with the aid of a perforated mask, a laser beam is moved in the region of the perforated mask on a circular path. The center point of the region lies concentrically with respect to the set position of the respective hole in the mask. Further, the diameter of the region is smaller than the diameter of the hole. At the same time, the diameter of the laser beam spot is chosen to be large enough that it always covers the center point of the perforated mask during the circular motion. As a result, an energy distribution of the laser energy, which is as uniform as possible, is achieved in the region of the perforated mask.

7. 发明授权

US06833528B2 Method and apparatus for laser processing 失效
标题翻译：激光加工方法和装置
公开(公告)号：US06833528B2
公开(公告)日：2004-12-21
申请号：US10378884
申请日：2003-03-05
申请人： Hubert De Steur , Eddy Roelants
发明人： Hubert De Steur , Eddy Roelants
IPC分类号： B23K2638
CPC分类号： B23K26/0624 , B23K26/389 , B23K2101/42 , H05K3/0032
摘要： A method and an apparatus are for rapidly processing dielectric substrates using laser beams. A pulsed laser beam having a pulse repetition frequency greater than approximately 50 kHz and having pulse lengths shorter than approximately 200 ns is used for this purpose. Given a suitable choice of the parameters which characterize the processing laser beam, it is possible to ensure both a high throughput of bored holes and a high hole quality. With the use of a Q-switched CO2 laser, a wavelength of approximately 9.2 &mgr;m and a pulse energy of approximately 0.7 mJ are used. As a result, by way of example, 500 holes per second can be bored into an LCP substrate having a thickness of 0.4 mm. The high throughput and the simultaneously high hole quality are a consequence of the wavelength chosen, the short pulse lengths, the high repetition rate and the pulse energy that is likewise high compared with conventional laser processing apparatuses in the area of electronic fabrication.
摘要翻译：用于使用激光束快速处理电介质基片的方法和装置。为此，使用具有大于约50kHz的脉冲重复频率并具有短于约200ns的脉冲长度的脉冲激光束。考虑到处理激光束的特征参数的合适选择，可以确保钻孔的高生产率和高孔质量。使用Q开关CO2激光器，使用约9.2μm波长的波长和约0.7mJ的脉冲能量。结果，作为示例，可以将每秒500个孔孔钻入厚度为0.4mm的LCP基板中。高通量和同时高孔质量是选择的波长，短脉冲长度，高重复率和脉冲能量的结果，与电子制造领域的传统激光加工设备相比是高的。

8. 发明授权

US06781092B2 Method for drilling holes in a substrate 失效
标题翻译：在基板上钻孔的方法
公开(公告)号：US06781092B2
公开(公告)日：2004-08-24
申请号：US10369623
申请日：2003-02-21
申请人： Hubert De Steur , Alexander Kilthau , Andre Kletti , Hans Juergen Mayer , Petra Mitzinneck , Eddy Roelants , Oliver Thuerk , Marc Van Biesen
发明人： Hubert De Steur , Alexander Kilthau , Andre Kletti , Hans Juergen Mayer , Petra Mitzinneck , Eddy Roelants , Oliver Thuerk , Marc Van Biesen
IPC分类号： B23K2600
CPC分类号： H05K3/0032 , B23K26/389 , B23K2101/42 , H05K3/0035 , H05K2201/0394 , H05K2203/0554
摘要： When holes are being drilled in an electric circuit substrate, a laser beam is moved on concentric circular tracks in the region of the hole to be drilled. The transition from one circular track to the next takes place in each case on an arc that departs approximately tangentially from the circular track last traversed and nestles approximately tangentially against the circular track newly to be described in such a way that in each case the starting point of a new circular track is offset by a prescribed angle from the starting point of the preceding circular track.
摘要翻译：当在电路基板中钻孔时，激光束在待钻孔的区域中的同心圆形轨道上移动。从一个圆形轨迹到下一个轨迹的过渡在每一种情况下都发生在与最后穿过的圆形轨迹大致相切地离开的弧上，并且以这样一种方式近似地切合近似于待描述的圆形轨道，即在每种情况下起始点新的圆形轨道的距离与前一圆形轨道的起点偏移了一个规定的角度。

9. 发明授权

US06861008B1 Method and device for laser drilling organic materials 失效
标题翻译：激光钻孔有机材料的方法和装置
公开(公告)号：US06861008B1
公开(公告)日：2005-03-01
申请号：US10089308
申请日：2000-09-29
申请人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
发明人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
IPC分类号： B23K26/18 , B23K26/402 , B23K101/42 , H01S3/00 , H05K3/00 , C03C15/00
CPC分类号： H05K3/0032 , B23K2103/30 , B23K2103/50 , H05K2201/0112
摘要： For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: pulse width
摘要翻译：对于有机材料的激光钻孔，特别是在电介质层中制造盲孔，使用具有以下参数的倍频Nd-钒酸盐激光器：

10. 发明授权

US06485999B1 Wiring arrangements having electrically conductive cross connections and method for producing same 失效
标题翻译：具有导电交叉连接的接线装置及其制造方法
公开(公告)号：US06485999B1
公开(公告)日：2002-11-26
申请号：US09743568
申请日：2001-01-10
申请人： Luc Boone , Hubert De Steur , Marcel Heermann , Jozef Van Puymbroeck
发明人： Luc Boone , Hubert De Steur , Marcel Heermann , Jozef Van Puymbroeck
IPC分类号： H01L2150
CPC分类号： H01L21/4846 , B29L2031/3493 , H01L23/13 , H01L23/49811 , H01L24/48 , H01L2224/05599 , H01L2224/29007 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15159 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K3/027 , H05K3/3442 , H05K3/403 , H05K2201/09045 , H05K2201/09118 , H05K2201/09154 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S1).
摘要翻译：本发明涉及用于制造具有在基板的顶部和底部之间的导电交叉连接以及具有这种交叉连接的互连的互连的方法。衬底（S1）在凹部的至少一个前表面和/或至少一个内壁的区域中被赋予倾斜的屋顶形或凸形轮廓（K1）。在金属化基板（S1）之后，在顶部（0）上的印刷电路板导体（L）的激光结构同时，在上述轮廓（K1）的区域中产生印刷电路板导体形状的交叉连接（Q））和基板（S1）的底部（U）。

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