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1. 发明授权

US5044074A Method for manufacturing metal core printed circuit boards 失效
标题翻译：金属芯印刷电路板的制造方法
公开(公告)号：US5044074A
公开(公告)日：1991-09-03
申请号：US495740
申请日：1990-03-16
申请人： Helmut Hadwiger , Hans Schmidt
发明人： Helmut Hadwiger , Hans Schmidt
IPC分类号： B32B15/08 , H05K1/00 , H05K1/05 , H05K3/38 , H05K3/44
CPC分类号： H05K3/445 , B32B15/08 , H05K1/056 , H05K1/0393 , H05K2201/0195 , H05K2201/09118 , H05K2201/09581 , H05K2203/1327 , H05K2203/1438 , H05K3/386 , Y10T29/49158 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form. The manufacturing of such pc boards can occur by injection molding, injection/compression methods or by a pressing method. High-heat resistant thermoplastics, as well as thermoset plastics are preferably used as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil.

2. 发明授权

US5134056A Method for applying a solder resist layer to a printed circuit board 失效
标题翻译：将印刷电路板应用于焊接电阻层的方法
公开(公告)号：US5134056A
公开(公告)日：1992-07-28
申请号：US631944
申请日：1990-12-21
申请人： Hans-Fr. Schmidt , Helmut Hadwiger , Milan Prochazka , Eddy Roelants
发明人： Hans-Fr. Schmidt , Helmut Hadwiger , Milan Prochazka , Eddy Roelants
IPC分类号： G03F7/00 , H05K3/28
CPC分类号： H05K3/28 , H05K2201/09118 , H05K2203/0585 , H05K2203/107 , H05K2203/1105
摘要： A solder resist and a positively-acting photoresist are successively applied on a surface-wide basis onto a printed circuit board, whereupon the photoresist is selectively exposed and developed in the region of plated-through holes and/or solder pads of a printed conductor pattern carried on the printed circuit board, preferably with the assistance of laser beams. Subsequently, the solder resist is stripped in the regions not protected by the photoresist, i.e. in the regions of plated-through holes and/or solder pads and, as a last step, the remaining photoresist is likewise stripped. The method is particularly suited for the application of a solder resist layer onto three-dimensional printed circuit boards since traditional mask techniques for structuring the solder resist cannot be employed with respect to three-dimensional printed circuit boards.
摘要翻译：在表面宽度的基础上连续地施加阻焊剂和正性光致抗蚀剂到印刷电路板上，于是在印刷导体图案的电镀通孔和/或焊盘的区域中选择性地暴露和显影光致抗蚀剂最好在激光束的帮助下携带在印刷电路板上。随后，在未被光致抗蚀剂保护的区域，即在通孔和/或焊盘的区域中剥离阻焊剂，并且作为最后一步，同样剥离剩余的光致抗蚀剂。该方法特别适用于在三维印刷电路板上应用阻焊层，因为用于构造阻焊剂的传统掩模技术不能用于三维印刷电路板。

3. 发明授权

US4924590A Method for making metal core printed circuit board 失效
标题翻译：制作金属芯印刷电路板的方法
公开(公告)号：US4924590A
公开(公告)日：1990-05-15
申请号：US291119
申请日：1988-12-28
申请人： Helmut Hadwiger , Hans Schmidt
发明人： Helmut Hadwiger , Hans Schmidt
IPC分类号： B32B15/08 , H05K1/00 , H05K1/05 , H05K3/38 , H05K3/44
CPC分类号： H05K3/445 , B32B15/08 , H05K1/056 , H05K1/0393 , H05K2201/0195 , H05K2201/09118 , H05K2201/09581 , H05K2203/1327 , H05K2203/1438 , H05K3/386 , Y10T29/49158 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form with or without throughplating. The manufacturing of such pc boards can occur by injection molding, injection/compressing molding or by a pressing method. High-heat resistant thermoplastics, as well as duroplastics are preferably employed as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; introduction of the desired hole pattern with a corresponding over dimension into the laminated metal plate; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil and simultaneously filling out the holes to a final dimension with the plastic.
摘要翻译：一种用于制造具有或不具有通孔的任何形式的二维或三维金属芯片印刷电路板的金属芯片印刷电路板的制造方法。这种印刷电路板的制造可以通过注射成型，注射/压缩成型或压制方法进行。优选使用高耐热性热塑性塑料以及硬质塑料作为印刷电路板材料。核心使用具有良好导热性的金属。选择材料使得金属芯和印刷电路板材料的热膨胀系数最佳相等。该制造包括以下步骤：金属板与塑料箔在一侧或两侧上的层叠; 将所需的具有相应尺寸的孔图案引入到层压金属板中; 将这种制备的金属芯放置在注射成型工具中; 并在塑料箔上将叠层芯上的塑料热成型，同时用塑料填充孔至最终尺寸。

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