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    • 1. 发明申请
    • Method for Producing a Component with at Least One Organic Material and Component with at Least One Organic Material
    • 使用至少一种有机材料制造具有至少一种有机材料和成分的组分的方法
    • US20120241802A1
    • 2012-09-27
    • US13388275
    • 2010-06-15
    • Marc PhilippensTilman SchlenkerKarsten Heuser
    • Marc PhilippensTilman SchlenkerKarsten Heuser
    • H01L33/52H01L31/18H01L31/0203
    • H01L51/5237H01L51/5246H01L51/56
    • In at least one embodiment of the component (10) the latter comprises a first substrate (1) and a second substrate (2), at least one radiation-emitting or radiation-receiving element (3) being arranged on the first substrate (1), which element contains at least one organic material. The first substrate (1) and the second substrate (2) are arranged relative to one another such that the element (3) is located between the first substrate (1) and second substrate (2). The first substrate (1) and second substrate (2) are bonded together mechanically by means of a bonding agent (4) arranged in a sheet between the first substrate (1) and the second substrate (2), which bonding agent contains a glass and surrounds the element (3) with the organic material in the manner of a frame. Furthermore, the component (10) comprises a sealant (5) between the first substrate (1) and the second substrate (2), the sealant (5) surrounding and sealing the element (3) with the organic material and the bonding agent (4) in the manner of a frame.
    • 在组件(10)的至少一个实施例中,后者包括第一基板(1)和第二基板(2),至少一个辐射发射或辐射接收元件(3)布置在第一基板 ),该元素含有至少一种有机材料。 第一基板(1)和第二基板(2)相对于彼此布置,使得元件(3)位于第一基板(1)和第二基板(2)之间。 第一基板(1)和第二基板(2)通过布置在第一基板(1)和第二基板(2)之间的片材中的粘合剂(4)机械地接合在一起,该粘合剂包含玻璃 并且以框架的方式用有机材料围绕元件(3)。 此外,组件(10)包括在第一基板(1)和第二基板(2)之间的密封剂(5),密封剂(5)围绕元件(3)与有机材料和粘结剂( 4)以帧的方式。
    • 2. 发明授权
    • Organic component and method for the production thereof
    • 有机成分及其制造方法
    • US08829496B2
    • 2014-09-09
    • US13387978
    • 2010-07-08
    • Marc PhilippensTilman Schlenker
    • Marc PhilippensTilman Schlenker
    • H01L51/00
    • H01L51/56H01L51/5246
    • A device comprising: a first substrate (1); a second substrate; at least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate; the first substrate (1) and the second substrate (2) being arranged relative to one another in such a way that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate; a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), said bonding material enclosing the optoelectronic component (4) in a frame type fashion and mechanically connecting the first and second substrates (1, 2) to one another; and wherein the bonding material (3) was softened by an exothermic chemical process of a reactive material (7) for mechanically connecting the substrates (1, 2).
    • 一种装置,包括:第一基板(1); 第二基板; 包含至少一种有机材料的至少一个光电子部件(4)被布置在第一基板上; 第一基板(1)和第二基板(2)相对于彼此布置成使得光电子部件(4)布置在第一基板(1)和第二基板之间; 在第一基板(1)和第二基板(2)之间布置有接合材料(3),所述接合材料以框架形式包围光电子部件(4),并机械连接第一和第二基板(1,2) ) 彼此; 并且其中所述接合材料(3)通过用于机械连接所述基板(1,2)的反应性材料(7)的放热化学过程软化。
    • 3. 发明申请
    • Organic Component and Method for the Production Thereof
    • 有机成分及其生产方法
    • US20120256170A1
    • 2012-10-11
    • US13387978
    • 2010-07-08
    • Marc PhilippensTilman Schlenker
    • Marc PhilippensTilman Schlenker
    • H01L51/52H01L51/48H01L51/44H01L51/56
    • H01L51/56H01L51/5246
    • A device comprising: a first substrate (1); a second substrate; at least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate; the first substrate (1) and the second substrate (2) being arranged relative to one another in such a way that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate; a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), said bonding material enclosing the optoelectronic component (4) in a frame type fashion and mechanically connecting the first and second substrates (1, 2) to one another; and wherein the bonding material (3) was softened by an exothermic chemical process of a reactive material (7) for mechanically connecting the substrates (1, 2).
    • 一种装置,包括:第一基板(1); 第二基板; 包含至少一种有机材料的至少一个光电子部件(4)被布置在第一基板上; 第一基板(1)和第二基板(2)相对于彼此布置成使得光电子部件(4)布置在第一基板(1)和第二基板之间; 在第一基板(1)和第二基板(2)之间布置有接合材料(3),所述接合材料以框架形式包围光电子部件(4),并机械连接第一和第二基板(1,2) ) 彼此; 并且其中所述接合材料(3)通过用于机械连接所述基板(1,2)的反应性材料(7)的放热化学过程软化。
    • 4. 发明申请
    • Method For Producing An Organic Optoelectronic Component And Organic Optoelectronic Component
    • 生产有机光电子元件和有机光电元件的方法
    • US20120139001A1
    • 2012-06-07
    • US13141081
    • 2009-12-10
    • Angela EberhardtTilman SchlenkerMarc PhilippensUlrike BeerJoachim Wirth-SchoenFlorian PeskollerEwald Poesl
    • Angela EberhardtTilman SchlenkerMarc PhilippensUlrike BeerJoachim Wirth-SchoenFlorian PeskollerEwald Poesl
    • H01L51/52H01L51/56
    • C03C27/06H01L51/5246H01L51/5256H01L51/5259
    • Production of an organic optoelectronic component comprising the following steps: A) providing a first substrate (1) having an active region (12) and a first connection region (11) surrounding said active region (12), wherein an organic, functional layer sequence (3) is formed in said active region (12), B) providing a second substrate (2) having a cover region (22) and a second connection region (21) surrounding said cover region (22), C) applying a first connection layer (4) made from a first glass solder material directly to said second substrate (2) in said second connection region (21), D) vitrifying (91) said first glass solder material of said first connection layer (4), E) applying a second connection layer (5) to said vitrified first connection layer (4) or to said first connection region (11) of said first substrate (1) and F) connecting said first substrate (1) to said second substrate (2) such that said second connection layer (5) connects said first connection region (11) to said first connection layer (4). The invention furthermore relates to an organic optoelectronic component.
    • 制备有机光电子部件包括以下步骤:A)提供具有有源区(12)的第一衬底(1)和围绕所述有源区(12)的第一连接区(11),其中有机功能层序列 (3)形成在所述有源区(12)中,B)提供具有覆盖区域(22)和围绕所述覆盖区域(22)的第二连接区域(21)的第二基板(2),C) 在所述第二连接区域(21)中由第一玻璃焊料直接与所述第二基板(2)制成的连接层(4),D)玻璃化所述第一连接层(4)的所述第一玻璃焊料材料,E 将第二连接层(5)施加到所述玻璃化的第一连接层(4)或所述第一基板(1)的所述第一连接区域(11)上,以及F)将所述第一基板(1)连接到所述第二基板 ),使得所述第二连接层(5)将所述第一连接区域(11) 到所述第一连接层(4)。 本发明还涉及有机光电子部件。
    • 5. 发明授权
    • Method for producing a component with at least one organic material and component with at least one organic material
    • 用至少一种有机材料制成组分的方法和具有至少一种有机材料的组分
    • US08866181B2
    • 2014-10-21
    • US13388275
    • 2010-06-15
    • Marc PhilippensTilman SchlenkerKarsten Heuser
    • Marc PhilippensTilman SchlenkerKarsten Heuser
    • H01L33/00H01L23/02H01L51/52H01L51/56
    • H01L51/5237H01L51/5246H01L51/56
    • In at least one embodiment of the component (10) the latter comprises a first substrate (1) and a second substrate (2), at least one radiation-emitting or radiation-receiving element (3) being arranged on the first substrate (1), which element contains at least one organic material. The first substrate (1) and the second substrate (2) are arranged relative to one another such that the element (3) is located between the first substrate (1) and second substrate (2). The first substrate (1) and second substrate (2) are bonded together mechanically by means of a bonding agent (4) arranged in a sheet between the first substrate (1) and the second substrate (2), which bonding agent contains a glass and surrounds the element (3) with the organic material in the manner of a frame. Furthermore, the component (10) comprises a sealant (5) between the first substrate (1) and the second substrate (2), the sealant (5) surrounding and sealing the element (3) with the organic material and the bonding agent (4) in the manner of a frame.
    • 在组件(10)的至少一个实施例中,后者包括第一基板(1)和第二基板(2),至少一个辐射发射或辐射接收元件(3)布置在第一基板 ),该元素含有至少一种有机材料。 第一基板(1)和第二基板(2)相对于彼此布置,使得元件(3)位于第一基板(1)和第二基板(2)之间。 第一基板(1)和第二基板(2)通过布置在第一基板(1)和第二基板(2)之间的片材中的粘合剂(4)机械地接合在一起,该粘合剂包含玻璃 并且以框架的方式用有机材料围绕元件(3)。 此外,组件(10)包括在第一基板(1)和第二基板(2)之间的密封剂(5),密封剂(5)围绕元件(3)与有机材料和粘结剂( 4)以帧的方式。