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1. 发明申请

US20080313036A1 System and method for providing advertisements in online and hardcopy mediums 审中-公开
标题翻译：在网络和硬拷贝媒体中提供广告的系统和方法
公开(公告)号：US20080313036A1
公开(公告)日：2008-12-18
申请号：US11818439
申请日：2007-06-13
申请人： Marc Mosko , Richard H. Bruce , Nitin Parekh , James (Bo) M.A. Begole , Lisa Fahey , Eric Peeters
发明人： Marc Mosko , Richard H. Bruce , Nitin Parekh , James (Bo) M.A. Begole , Lisa Fahey , Eric Peeters
IPC分类号： G06Q30/00 , G06Q40/00
CPC分类号： G06Q30/02 , G06Q20/10 , G06Q30/0242 , G06Q30/0251 , G06Q30/0256 , G06Q30/0277
摘要： A system and method for providing advertisements in online and hardcopy mediums is presented. Advertising content is targeted to a target audience. The characteristics of the target audience are analyzed against the advertising content to identify potential advertisers. At least one of the potential advertisers is selected. One or more advertisements for the selected advertiser is included on a document. The document is provided on at least one of online and hardcopy mediums.
摘要翻译：提出了一种在网络和硬拷贝介质中提供广告的系统和方法。广告内容针对目标受众。根据广告内容分析目标受众的特征，以识别潜在的广告客户。至少有一个潜在的广告客户被选中。所选择的广告商的一个或多个广告被包括在文档上。该文档至少提供在线和硬拷贝介质之一。

2. 发明申请

US20080313035A1 System and method for providing print advertisements 有权
标题翻译：提供打印广告的系统和方法
公开(公告)号：US20080313035A1
公开(公告)日：2008-12-18
申请号：US11818327
申请日：2007-06-13
申请人： Eric Peeters , Richard H. Bruce , Ana Arias , James (Bo) M.A. Begole , Ross Bringans , Celia Chow , Lawrence Lee , Lisa Fahey , Linda Jacobson , Marc Mosko , Susan (Susie) Mulhern , Nitin Parekh , David Weinerth
发明人： Eric Peeters , Richard H. Bruce , Ana Arias , James (Bo) M.A. Begole , Ross Bringans , Celia Chow , Lawrence Lee , Lisa Fahey , Linda Jacobson , Marc Mosko , Susan (Susie) Mulhern , Nitin Parekh , David Weinerth
IPC分类号： G06Q30/00
CPC分类号： G06Q30/02 , G06Q30/0239 , G06Q30/0251 , G06Q30/0275 , G06Q30/0277
摘要： A system and method for providing print advertisements is presented. A target audience is assembled from characteristics about readers. Advertising content is targeted to the target audience. The characteristics of the target audience are analyzed against the advertising content to identify potential advertisers. At least one of the potential advertisers is selected. At least one print advertisement for the selected advertiser is included on the document.
摘要翻译：提出了一种用于提供打印广告的系统和方法。目标受众是从读者的特点来组织的。广告内容针对目标受众。根据广告内容分析目标受众的特征，以识别潜在的广告客户。至少有一个潜在的广告客户被选中。所选择的广告商的至少一个打印广告包括在文档中。

3. 发明授权

US07949560B2 System and method for providing print advertisements 有权
标题翻译：提供打印广告的系统和方法
公开(公告)号：US07949560B2
公开(公告)日：2011-05-24
申请号：US11818327
申请日：2007-06-13
申请人： Eric Peeters , Richard H. Bruce , Ana Arias , Bo Begole , Ross Bringans , Celia Chow , Lawrence Lee , Lisa Fahey , Linda Jacobson , Marc Mosko , Susan (Susie) Mulhern , Nitin Parekh , David Weinerth
发明人： Eric Peeters , Richard H. Bruce , Ana Arias , Bo Begole , Ross Bringans , Celia Chow , Lawrence Lee , Lisa Fahey , Linda Jacobson , Marc Mosko , Susan (Susie) Mulhern , Nitin Parekh , David Weinerth
IPC分类号： G06Q30/00
CPC分类号： G06Q30/02 , G06Q30/0239 , G06Q30/0251 , G06Q30/0275 , G06Q30/0277
摘要： A system and method for providing print advertisements is presented. A target audience is assembled from characteristics about readers. Advertising content is targeted to the target audience. The characteristics of the target audience are analyzed against the advertising content to identify potential advertisers. At least one of the potential advertisers is selected. At least one print advertisement for the selected advertiser is included on the document.
摘要翻译：提出了一种用于提供打印广告的系统和方法。目标受众是从读者的特点来组织的。广告内容针对目标受众。根据广告内容分析目标受众的特征，以识别潜在的广告客户。至少有一个潜在的广告客户被选中。所选择的广告商的至少一个打印广告包括在文档中。

4. 发明申请

US20100100877A1 STATISTICAL PACKING OF RESOURCE REQUIREMENTS IN DATA CENTERS 有权
标题翻译：数据中心资源需求的统计包装
公开(公告)号：US20100100877A1
公开(公告)日：2010-04-22
申请号：US12253111
申请日：2008-10-16
申请人： Daniel H. Greene , Maurice Chu , Haitham Hindi , Bryan T. Preas , Nitin Parekh
发明人： Daniel H. Greene , Maurice Chu , Haitham Hindi , Bryan T. Preas , Nitin Parekh
IPC分类号： G06F9/455 , G06F15/18 , G06G7/62 , G06F9/50
CPC分类号： G06F9/45533 , G06F9/5011 , G06F2209/5019 , Y02D10/22
摘要： A computer-implemented method of managing resources in a virtual machine environment can include determining a specification of provisioning success corresponding to each of multiple jobs in the virtual machine environment, determining a prediction of resource needs corresponding to each of the jobs, and determining a resource specification corresponding to each of the jobs based on the specification of provisioning success and the prediction of resource needs.
摘要翻译：管理虚拟机环境中的资源的计算机实现的方法可以包括确定与虚拟机环境中的多个作业中的每一个对应的供应成功的规范，确定与每个作业相对应的资源需求的预测，以及确定资源基于提供成功的规范和资源需求的预测，与每个作业相对应的规范。

5. 发明申请

US20090153165A1 High Density Interconnect System Having Rapid Fabrication Cycle 失效
标题翻译：高密度互连系统具有快速制造周期
公开(公告)号：US20090153165A1
公开(公告)日：2009-06-18
申请号：US12354520
申请日：2009-01-15
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/02
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

6. 发明申请

US20120152814A1 MEMBRANE BIOREACTOR (MBR) AND MOVING BED BIOREACTOR (MBBR) CONFIGURATIONS FOR WASTEWATER TREATMENT 有权
标题翻译：膜生物反应器（MBR）和移动床生物反应器（MBBR）用于废水处理的配置
公开(公告)号：US20120152814A1
公开(公告)日：2012-06-21
申请号：US12973083
申请日：2010-12-20
申请人： Meng H. Lean , Joe Zuback , Nitin Parekh , Norine E. Chang , Huangpin Ben Hsieh , Kai Melde
发明人： Meng H. Lean , Joe Zuback , Nitin Parekh , Norine E. Chang , Huangpin Ben Hsieh , Kai Melde
IPC分类号： C02F3/02
CPC分类号： C02F3/1268 , C02F1/385 , C02F3/085 , Y02W10/15
摘要： The water treatment system and method incorporating the use of a hydrodynamic separator to remove most of the total suspended solids (TSS) in source water being treated to thereby lighten the load on membrane filtration in the water treatment system and lower energy costs.
摘要翻译：水处理系统和方法结合使用流体动力分离器来去除待处理的源水中的大部分总悬浮固体（TSS），从而减轻水处理系统中膜过滤的负荷并降低能量成本。

7. 发明授权

US07382142B2 High density interconnect system having rapid fabrication cycle 失效
标题翻译：具有快速制造周期的高密度互连系统
公开(公告)号：US07382142B2
公开(公告)日：2008-06-03
申请号：US11133021
申请日：2005-05-18
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/02
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

8. 发明授权

US07884634B2 High density interconnect system having rapid fabrication cycle 失效
公开(公告)号：US07884634B2
公开(公告)日：2011-02-08
申请号：US12354520
申请日：2009-01-15
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/26
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

9. 发明授权

US5556507A Multifunctional contactless interconnect technology 失效
标题翻译：多功能非接触式互连技术
公开(公告)号：US5556507A
公开(公告)日：1996-09-17
申请号：US206444
申请日：1994-03-03
申请人： Nitin Parekh , Dominic Massetti
发明人： Nitin Parekh , Dominic Massetti
IPC分类号： H01L21/768 , H01L21/00
CPC分类号： H01L21/76895
摘要： The present invention is a method for providing multifunctional, contactless, interconnect technology that can simultaneously fabricate four features on a silicon wafer within the same metallization level including a diffusion barrier layer, a trim element (fuse), a higher resistivity local interconnect/strap, and a lower resistivity global interconnect. The fabrication only requires two lithographic operations and one metal deposition. A first metal (a refractory metal) film having constant thickness is sputter deposited on the silicon wafer. In the preferred embodiment, the refractory metal is titanitun-tungsten. A second metal fihn may be sputter deposited on the first metal film. The first metal fihn has a higher resistivity than the second metal film. In the preferred embodiment, the second metal is aluminum-copper. Four features may be defined using a first mask. The features are etched and the first mask is removed. Three of the four features may be further defined using a second, non-critical mask. The second metal film of the three features are wet etched and the second mask is removed to provide the four features. An intermetal oxide is deposited. The present invention maintains good barrier integrity, even as devices are scaled down into the submicron and sub-half micron regimes.
摘要翻译：本发明是一种用于提供多功能，非接触的互连技术的方法，其可以在同一金属化水平的同时制造硅晶片上的四个特征，包括扩散阻挡层，修剪元件（保险丝），更高电阻率的局部互连/ 和较低电阻率的全局互连。该制造仅需要两次光刻操作和一次金属沉积。在硅晶片上溅射沉积具有恒定厚度的第一金属（难熔金属）膜。在优选实施例中，难熔金属是钛钛矿钨。第二金属膜可以溅射沉积在第一金属膜上。第一金属膜具有比第二金属膜更高的电阻率。在优选实施例中，第二金属是铝 - 铜。可以使用第一掩码来定义四个特征。蚀刻特征并移除第一个掩模。可以使用第二非关键掩模进一步限定四个特征中的三个。三个特征的第二金属膜被湿蚀刻并且第二掩模被去除以提供四个特征。沉积金属间氧化物。本发明保持良好的屏障完整性，即使器件按比例缩小到亚微米和次半微米的方式。

10. 发明授权

US08656404B2 Statistical packing of resource requirements in data centers 有权
标题翻译：数据中心资源需求的统计包装
公开(公告)号：US08656404B2
公开(公告)日：2014-02-18
申请号：US12253111
申请日：2008-10-16
申请人： Daniel H. Greene , Maurice Chu , Haitham Hindi , Bryan T. Preas , Nitin Parekh
发明人： Daniel H. Greene , Maurice Chu , Haitham Hindi , Bryan T. Preas , Nitin Parekh
IPC分类号： G06F9/50
CPC分类号： G06F9/45533 , G06F9/5011 , G06F2209/5019 , Y02D10/22
摘要： A computer-implemented method of managing resources in a virtual machine environment can include determining a specification of provisioning success corresponding to each of multiple jobs in the virtual machine environment, determining a prediction of resource needs corresponding to each of the jobs, and determining a resource specification corresponding to each of the jobs based on the specification of provisioning success and the prediction of resource needs.
摘要翻译：管理虚拟机环境中的资源的计算机实现的方法可以包括确定与虚拟机环境中的多个作业中的每一个对应的供应成功的规范，确定与每个作业相对应的资源需求的预测，以及确定资源基于提供成功的规范和资源需求的预测，与每个作业相对应的规范。

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