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    • 7. 发明授权
    • Thermal sensing with bridge circuitry
    • 具有桥接电路的热感测
    • US07833800B2
    • 2010-11-16
    • US11167612
    • 2005-06-27
    • Alan BellRichard H. BruceEric PeetersMichal V. WolkinDirk De Bruyker
    • Alan BellRichard H. BruceEric PeetersMichal V. WolkinDirk De Bruyker
    • G01N33/00
    • G01K7/30G01K17/00G01N25/482
    • Thermal sensing devices can include two subsets of thermal sensors connected in a bridge by circuitry on the same support layer or surface with the sensors. Each thermal sensor can be formed in a patterned layer of semiconductor material, and the bridge circuitry can include leads formed in a patterned layer of conductive material, over or under the semiconductor layer. In one implementation, the bridge circuitry includes conductive portions that extend across and electrically contact the lower surface of each sensor's semiconductor slab. The bridge circuitry can also include pads that can be electrically contacted, such as by pogo pins. The device's reaction surface can be spaced apart from or over the thermal sensors. The device's components can be shaped and positioned so that the bridge's offset voltage is below the sensitivity level required for an application, such as by left-right symmetry about an axis.
    • 热感测装置可以包括通过与传感器相同的支撑层或表面上的电路在桥中连接的两个热传感器子集。 每个热传感器可以形成在半导体材料的图案化层中,并且桥接电路可以包括形成在导电材料的图案化层中的引线,在半导体层之上或之下。 在一个实施方式中,桥接电路包括导电部分,其延伸并且电接触每个传感器的半导体板的下表面。 桥接电路还可以包括可以电接触的焊盘,例如通过弹簧销。 设备的反应表面可以与热传感器间隔开或超过热传感器。 该装置的部件可以被成形和定位,使得桥的偏移电压低于应用所需的灵敏度水平,例如通过关于轴的左右对称。
    • 10. 发明授权
    • Thermal sensing device
    • 感温装置
    • US07754492B2
    • 2010-07-13
    • US11167635
    • 2005-06-27
    • Alan BellRichard H. BruceEric Peeters
    • Alan BellRichard H. BruceEric Peeters
    • G01N33/00
    • G01K7/30B82Y15/00G01K17/00G01N25/482G01N25/4846G01N25/4866
    • Thermal detectors and thermal sensing cells can include a region of a support layer or support structure. Within the region can be reaction surfaces or other reaction regions, as well as contact pads and circuitry connecting the contact pads to other components. Also, a cell region can include a structure with reaction regions, contact pads, and control/detection circuitry connected to the contact pads; the control/detection circuitry controls occurrence of reactions in response to control signals, such as by drop merging, and also allows electrical detection of thermal signals from the reaction regions. The control/detection circuitry can include reaction control components such as drop merger electrodes and also thermal sensors such as thermistors, or it can include control/sensor elements such as semiconductor slabs that perform both functions. Each cell in an array can have control/detection circuitry that does not extend or connect outside the cell except through contact pads.
    • 热检测器和热感测单元可以包括支撑层或支撑结构的区域。 该区域内可以是反应表面或其它反应区域,以及接触焊盘和将接触焊盘连接到其它部件的电路。 此外,电池区域可以包括具有反应区域,接触焊盘以及连接到接触焊盘的控制/检测电路的结构; 控制/检测电路控制响应于控制信号的反应的发生,例如通过下降合并,并且还允许来自反应区域的热信号的电检测。 控制/检测电路可以包括反应控制部件,例如液滴合并电极和热敏传感器,例如热敏电阻,或者它可以包括执行这两个功能的控制/传感器元件,例如半导体板。 阵列中的每个单元都可以具有控制/检测电路,除了通过接触焊盘之外,它们不会扩展或连接到电池外部。