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1. 发明授权

US5008120A Method of preparing iron-fortified beverage 失效
标题翻译：铁强化饮料的制备方法
公开(公告)号：US5008120A
公开(公告)日：1991-04-16
申请号：US551922
申请日：1990-07-12
申请人： Maki Tanaka , Teiichi Tojima , Shun-ichi Dousako , Kiyoshi Tatsumi
发明人： Maki Tanaka , Teiichi Tojima , Shun-ichi Dousako , Kiyoshi Tatsumi
IPC分类号： A23J1/20 , A23L1/304 , A23L1/305
CPC分类号： A23J1/205 , A23L33/165 , A23L33/19 , A23V2002/00
摘要： A method of preparing iron-fortified beverage, wherein either aqueous solution of lactoferrin, iron and sodium bicarbonate or aqueous solution of iron lactoferrin is adjusted to the ionic strength to satisfy the conditions given by the formulae below and sterilized by heat; solution of the ingredients other than the above is also sterilized by heat; and the two are mixed to obtain the product: and a method of processing iron-fortified beverage, wherein all ingredients including lactoferrin are dissolved in water and, if the ionic strength of the solution is adjustable to the conditions given by the following formulae, adjusted to the ionic strength given, and sterilized by heat to obtain the product.log I.ltoreq.-T/66.7-0.1(wherein 60.ltoreq.T.ltoreq.80)log 1.ltoreq.-1.3(T.gtoreq.80)(T indicates temperature of sterilization in degrees Celsius.)

2. 发明申请

US20130166240A1 Pattern Dimension Measurement Method Using Electron Microscope, Pattern Dimension Measurement System, and Method for Monitoring Changes in Electron Microscope Equipment Over Time 有权
标题翻译：使用电子显微镜的图案尺寸测量方法，图案尺寸测量系统以及随时间监测电子显微镜设备变化的方法
公开(公告)号：US20130166240A1
公开(公告)日：2013-06-27
申请号：US13807281
申请日：2011-05-20
申请人： Chie Shishido , Maki Tanaka , Katsuhiro Sasada
发明人： Chie Shishido , Maki Tanaka , Katsuhiro Sasada
IPC分类号： G01Q40/00
CPC分类号： G01B15/04 , G01Q40/00 , H01J37/263 , H01J37/28 , H01J2237/22 , H01J2237/24514 , H01J2237/24578 , H01J2237/2823 , H01J2237/2826
摘要： Beforehand, the device characteristic patterns of each critical dimension SEM are measured, a sectional shape of an object to undergo dimension measurement is presumed by a model base library (MBL) matching system, dimension measurements are carried out by generating signal waveforms through SEM simulation by inputting the presumed sectional shapes and the device characteristic parameters, and differences in the dimension measurement results are registered as machine differences. In actual measurements, from the dimension measurement results in each critical dimension SEM, machine differences are corrected by subtracting the registered machine differences. Furthermore, changes in critical dimension SEM's over time are monitored by periodically measuring the above-mentioned device characteristic parameters and predicting the above-mentioned dimension measurement results. According to the present invention, actual measurements of machine differences, which require considerable time and effort, are unnecessary. In addition, the influence of changes in samples over time, which is problematic in monitoring changes in devices over time, can be eliminated.
摘要翻译：之前，测量每个临界尺寸SEM的器件特征图案，通过模型基本库（MBL）匹配系统推测进行尺寸测量的物体的截面形状，通过SEM模拟产生信号波形来进行尺寸测量输入推定的截面形状和装置特性参数，将尺寸测量结果的差异作为机器差异进行登记。在实际测量中，从每个临界尺寸SEM的尺寸测量结果可以看出，通过减去注册的机器差异来校正机器差异。此外，通过周期性地测量上述器件特性参数并预测上述尺寸测量结果来监测临界尺寸SEM随时间变化的变化。根据本发明，需要相当多的时间和精力的机器差异的实际测量是不必要的。另外，随着时间的推移，随着时间的推移，随着时间的推移，随着时间的推移，样品随着时间变化的变化也受到影响。

3. 发明授权

US08274651B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US08274651B2
公开(公告)日：2012-09-25
申请号：US13234897
申请日：2011-09-16
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下检查样本的样本的检查方法和装置以及在多个检查条件中的每一个下检查样本而获得的检查数据以及对应于检查日期的样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

4. 发明申请

US20120006131A1 METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF 有权
公开(公告)号：US20120006131A1
公开(公告)日：2012-01-12
申请号：US13234897
申请日：2011-09-16
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01D21/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

5. 发明授权

US07894658B2 Pattern inspection method and apparatus 有权
标题翻译：图案检验方法及装置
公开(公告)号：US07894658B2
公开(公告)日：2011-02-22
申请号：US11931693
申请日：2007-10-31
申请人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
发明人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8854 , G01N2021/8861 , G01N2021/8864 , G01R31/311 , G03F1/86 , G06T1/0007 , G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/265 , H01J37/28 , H01J2237/221 , H01J2237/24592 , H01J2237/28
摘要： An apparatus for processing a defect candidate image, including: an imager for taking an enlarged image of a specimen; an image processor for processing the image taken by the imager to detect defect candidates existing on the specimen and classify the detected defect candidates into one of plural defect classes; a memory for storing information of the defect candidates including the images of the defect candidates and the classified defect class data outputted from the image processor; and a display unit having a display screen for displaying information stored in the memory, wherein the display unit displays an image of the defect candidates together with the defect class data stored in the memory and the displayed defect class data is changeable on the display screen, and the memory changes the stored defect class data of the displayed defect candidate to the changed defect class data.
摘要翻译：一种用于处理缺陷候选图像的装置，包括：用于拍摄样本的放大图像的成像器; 图像处理器，用于处理由成像器拍摄的图像以检测存在于样本上的缺陷候选，并将检测到的缺陷候选分类为多个缺陷类别中的一个; 存储器，用于存储包括缺陷候选图像和从图像处理器输出的分类缺陷类别数据的缺陷候选的信息; 以及显示单元，具有用于显示存储在存储器中的信息的显示屏幕，其中所述显示单元与存储在所述存储器中的缺陷类别数据一起显示所述缺陷候选的图像，并且所显示的缺陷类别数据可在所述显示屏幕上变化，并且存储器将存储的缺陷候选的缺陷类别数据改变为改变的缺陷类别数据。

6. 发明授权

US07889908B2 Method and apparatus for measuring shape of a specimen 有权
标题翻译：用于测量样品形状的方法和装置
公开(公告)号：US07889908B2
公开(公告)日：2011-02-15
申请号：US11335515
申请日：2006-01-20
申请人： Atsushi Miyamoto , Maki Tanaka , Hidetoshi Morokuma
发明人： Atsushi Miyamoto , Maki Tanaka , Hidetoshi Morokuma
IPC分类号： G06K9/00 , A61N5/00 , G06G5/00
CPC分类号： H01J37/28 , H01J37/222 , H01J2237/226 , H01J2237/2611
摘要： In the past, when a shape was corrected by adjusting parameters of a shape calculating equation proper for a measuring method used in measuring a two-dimensional or three-dimensional shape by correlating the parameters and a shape index value, the degree of freedom of modifying a shape by correction depended on a model equation used in the calculation of the shape, and therefore such a shape correction method was unsuitable for objects of correction having a number of shape variations. According to the present invention, the three-dimensional shape is corrected by fitting a curvature equation to a three-dimensional shape of a semiconductor pattern measured by any three-dimensional shape measuring method and by adjusting parameters of the curvature equation based on a shape index value separately calculated. The relations between the shape index value and the parameters are stored in a data base, and at the time of measurement the measured shapes are corrected based on the relations mentioned above.
摘要翻译：过去，当通过对参数和形状指标值进行关联来调整用于测量二维或三维形状的测量方法的形状计算方程的参数来校正形状时，修改自由度通过校正的形状取决于在形状计算中使用的模型方程，因此这种形状校正方法不适合具有多个形状变化的校正对象。根据本发明，通过将曲率方程拟合为通过任何三维形状测量方法测量的半导体图案的三维形状并且通过基于形状指数调整曲率方程的参数来校正三维形状价值分别计算。形状指标值与参数之间的关系存储在数据库中，在测量时，根据上述关系校正测量的形状。

7. 发明申请

US20090212212A1 Scanning Electron Microscope system and Method for Measuring Dimensions of Patterns Formed on Semiconductor Device By Using the System 有权
标题翻译：扫描电子显微镜系统和通过使用系统测量在半导体器件上形成的图案尺寸的方法
公开(公告)号：US20090212212A1
公开(公告)日：2009-08-27
申请号：US12370870
申请日：2009-02-13
申请人： Chie Shishido , Maki Tanaka , Atsushi Miyamoto
发明人： Chie Shishido , Maki Tanaka , Atsushi Miyamoto
IPC分类号： G01N23/00
CPC分类号： G03F1/84 , G03F1/86 , G03F7/70625
摘要： The present invention is for providing a scanning electron microscope system adapted to output contour information fitting in with the real pattern edge end of a sample, and is arranged to generate a local projection waveform by projecting the scanning electron microscope image in the tangential direction with respect to the pattern edge at each point of the pattern edge of the scanning electron microscope image, estimate the cross-sectional shape of the pattern transferred on the sample by applying the local projection waveform generated at each point to a library, which has previously been created, correlating the cross-sectional shape with the electron beam signal waveform, obtain position coordinate of the edge end fitting in with the cross-sectional shape, and output the contour of the pattern as a range of position coordinates.
摘要翻译：本发明提供一种扫描电子显微镜系统，其适于输出与样品的实际图案边缘端相匹配的轮廓信息，并且被布置成通过相对于扫描电子显微镜图像沿切线方向投影而产生局部投影波形到扫描电子显微镜图像的图案边缘的每个点处的图案边缘，通过将在每个点处生成的局部投影波形应用到先前已经创建的库来估计在样本上传送的图案的横截面形状将横截面形状与电子束信号波形相关联，以横截面形状获得边缘端配件的位置坐标，并将图案的轮廓作为位置坐标的范围输出。

8. 发明授权

US07457453B2 Pattern inspection method and apparatus 有权
标题翻译：图案检验方法及装置
公开(公告)号：US07457453B2
公开(公告)日：2008-11-25
申请号：US11782274
申请日：2007-07-24
申请人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
发明人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8854 , G01N2021/8861 , G01N2021/8864 , G01R31/311 , G03F1/86 , G06T1/0007 , G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/265 , H01J37/28 , H01J2237/221 , H01J2237/24592 , H01J2237/28
摘要： A pattern inspection apparatus including: an image detecting part for detecting a digital image of an object substrate; a display having a screen on which the digital image of the object substrate and/or a distribution of defect candidates in a map form are displayable; an input device for inputting information of a non-inspection region to be masked on the object substrate by defining a region on the screen on which said distribution of defect candidates is displayed in a map form; a memory part for storing coordinate data, pattern data or feature quantity data of the non-inspection region to be masked on the object substrate inputted on the screen by the input device; and a defect judging part in which the digital image detected by the image detecting part is examined in a state that a region matching with a condition stored in the memory part is masked and a defect is detected in a region other than said masked region.
摘要翻译：一种图案检查装置，包括：图像检测部，用于检测对象基板的数字图像; 具有可以显示对象基板的数字图像的屏幕和/或以地图形式的缺陷候选的分布的显示器; 输入装置，用于通过在屏幕上定义要以掩模形式显示所述缺陷候选的分布的区域来输入要被掩蔽在对象基板上的不检查区域的信息; 用于存储由输入装置输入到屏幕上的待掩蔽的待检查区域的坐标数据，图案数据或特征量数据的存储部分; 以及缺陷判断部分，其中在与存储在存储器部分中的条件匹配的区域被屏蔽并且在除了所述屏蔽区域之外的区域中检测到缺陷的状态下，检查由图像检测部分检测到的数字图像。

9. 发明授权

US07417723B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US07417723B2
公开(公告)日：2008-08-26
申请号：US11443222
申请日：2006-05-31
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

10. 发明授权

US07335881B2 Method of measuring dimensions of pattern 有权
标题翻译：测量图案尺寸的方法
公开(公告)号：US07335881B2
公开(公告)日：2008-02-26
申请号：US11019995
申请日：2004-12-23
申请人： Maki Tanaka , Chie Shishido , Yuji Takagi
发明人： Maki Tanaka , Chie Shishido , Yuji Takagi
IPC分类号： H01L21/02 , G01B15/00
CPC分类号： G01N23/2251
摘要： With complexity of a process, the setting of conditions for pattern measurement by an SEM image falls into difficulties. However, the present invention aims to realize the setting of easy and reliable measuring conditions even with respect to a pattern complex in structure. Points characterized in terms of an SEM image signal are calculated as candidates for measurement values. The calculated candidates for measurement values are displayed with being superimposed on the SEM image. An operator selects the optimum one from the displayed candidates and thereby determines the optimum image processing condition for measurement. The relationship between the result of measurement under a predetermined image processing condition and pattern portions has been made clear using model data of a sectional shape and an electron beam simulation image.
摘要翻译：由于处理的复杂性，通过SEM图像进行图案测定的条件的设定变得困难。然而，本发明的目的在于即使对于结构上的图案复合体也能实现容易且可靠的测量条件的设定。以SEM图像信号为特征的点被计算为测量值的候选。计算出的测量值候选被叠加在SEM图像上。操作者从所显示的候选者中选择最佳值，从而确定用于测量的最佳图像处理条件。使用截面形状和电子束模拟图像的模型数据，在预定图像处理条件下的测量结果与图案部分之间的关系已经被清楚。

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