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1. 发明公开

EP2782196A4 SEMICONDUCTOR LASER-EXCITATION SOLID-STATE LASER 有权
标题翻译：随着半导体激光器激励固体激光器
公开(公告)号：EP2782196A4
公开(公告)日：2015-09-02
申请号：EP11876012
申请日：2011-11-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , YOKOYAMA AKIRA
IPC分类号： H01S3/094 , H01S3/02 , H01S3/06
CPC分类号： H01S3/025 , H01S3/0405 , H01S3/0632 , H01S3/0941 , H01S3/09415 , H01S5/0224 , H01S5/02272 , H01S5/02438 , H01S5/02476 , H01S5/4031
摘要： The present invention aims at providing a highly efficient semiconductor laser excitation solid-state laser using a simple structure. To this end, the semiconductor laser excitation solid-state laser comprises: a planar waveguide-type solid-state laser element (101) in which claddings (15a, 15b) with a refraction index different from that of a plate-shaped solid-state laser medium (3) are formed on both surfaces of the solid-state laser medium, and which is disposed on a solid-state laser substrate (2); an LD array (1) in which a light-emitting layer sandwiched between cladding layers is formed on an LD substrate, and which generates laser light for exciting the solid-state laser medium from an end face thereof; and a sub-mount substrate (5) on which joining layers (6a, 7, 70) of two different thicknesses are formed on the same plane; wherein the planar waveguide-type solid-state laser element is joined to the sub-mount substrate on the surface on the opposite side of a surface on which the solid-state laser substrate (2) is mounted, via a joining layer of one of the thicknesses out of the joining layers of the two different thicknesses, and the LD array is joined to the sub-mount substrate (5) on the surface on the light-emitting layer side, via another joining layer of the other thickness out of the joining layers of the two different thicknesses.

2. 发明专利

CA2855913A1 SEMICONDUCTOR LASER EXCITATION SOLID-STATE LASER 未知
公开(公告)号：CA2855913A1
公开(公告)日：2013-05-23
申请号：CA2855913
申请日：2011-11-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , YOKOYAMA AKIRA
IPC分类号： H01S3/094 , H01S3/02 , H01S3/06
摘要： The purpose of the present invention is to achieve a high-efficiency semiconductor laser-excitation solid-state laser with a simple structure. For this purpose, the following are provided: a planar waveguide type solid-state laser element (101) that is disposed on a solid-state laser substrate (2) and in which on both faces of a plate-shaped solid-state laser medium (3) are formed claddings (15a, 15b) with a refractive index different from that of the solid-state laser medium; an LD array (1) that generates laser light for exciting the solid-state laser medium from an end face, and in which a light emission layer is formed between cladding layers on an LD substrate; and a sub-mount substrate (5) in which joining layers (6a, 7, 70) of two types of thicknesses are formed on the same face. The planar waveguide type solid-state laser element is joined to the sub-mount substrate via the joining layer of one of the two types of thicknesses, on the face opposite the face on which the solid-state laser substrate is disposed. The LD array is joined to the sub-mount substrate via the joining layer of the other of the two types of thicknesses, on the light emission layer side face.

3. 发明专利

CA2824579A1 LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2824579A1
公开(公告)日：2012-07-26
申请号：CA2824579
申请日：2011-01-17
申请人： MITSUBISHI ELECTRIC CORP
发明人： YOKOYAMA AKIRA , TAMAYA MOTOAKI , YANAGISAWA TAKAYUKI
IPC分类号： H01S5/022 , H01S5/024 , H01S5/026
摘要： The present invention is provided with: a laser light source (10) that radiates laser light (LB); a wavelength conversion element (1) that converts the wavelength of the laser light (LB); a temperature sensor (2) carried on the first surface of the wavelength conversion element (1); a heater substrate (3) that has a ceramic as a base material and carries the wavelength conversion element (1) by affixing the second surface of the wavelength conversion element (1); and a heater (4) that is on the heater substrate (3). The heater substrate (3) and a submount substrate (11) that carries the laser light source (10) are affixed to a heat sink. By means of having a concavity (G) at a position corresponding to the projection region of the wavelength conversion element (1) and facing the substrate (3), the heat sink holds the entire wavelength conversion element at an optimal operating temperature, and it is possible to highly efficiently convert the wavelength of the laser light.

4. 发明专利

CA2784697A1 LASER MODULE 未知
公开(公告)号：CA2784697A1
公开(公告)日：2011-06-23
申请号：CA2784697
申请日：2010-12-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NANBA CHISE , YANAGISAWA TAKAYUKI , OE SHINICHI , YAMAMOTO SHUHEI , YOKOYAMA AKIRA
IPC分类号： H01S5/022
摘要： Provided is an inexpensive module structure wherein it is possible to drive an LD array at low stress and at an appropriate temperature. The module is provided with a heat sink (3) for releasing the heat from a member which comes into contact therewith, a submount substrate (4) disposed on the heat sink (3) and configured from an insulating material, a feed layer (5A) disposed on the submount substrate (4), and a semiconductor laser array (6) having a plurality of light-emitting units disposed in parallel on the feed layer (5A), wherein: the linear expansion coefficient of the submount substrate (4) is smaller than the linear expansion coefficient of the semiconductor laser array (6); and the linear expansion coefficient of the submount substrate (4) when connected to the heat sink (3), which has a linear expansion coefficient higher than that of the semiconductor laser array (6), is set to be within a predetermined range which includes the linear expansion coefficient of the semiconductor laser array (6).

5. 发明专利

CA2855913C SEMICONDUCTOR LASER EXCITATION SOLID-STATE LASER 未知
公开(公告)号：CA2855913C
公开(公告)日：2016-11-29
申请号：CA2855913
申请日：2011-11-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , YOKOYAMA AKIRA
IPC分类号： H01S3/094 , H01S3/02 , H01S3/06
摘要： Conventional solid state laser technology can require high precision positioning or numerous parts and assembly processes. The present invention provides a semiconductor laser excitation solid-state laser comprising: a planar waveguide-type solid-state laser element disposed on a solid-state laser substrate; an LD array; and a sub-mount substrate on which joining layers of two different thicknesses are formed on the same plane; wherein the planar waveguide-type solid-state laser element is joined to the sub-mount substrate on the surface on the opposite side of a surface on which the solid-state laser substrate is mounted, via a joining layer of one of the thicknesses out of the joining layers of the two different thicknesses, and the LD array is joined to the sub-mount substrate on the surface on a light-emitting layer side, via another joining layer of the other thickness out of the joining layers of the two thicknesses.

6. 发明专利

JP2014138021A Alignment device and alignment method using the same 有权
标题翻译：对准装置和使用其的对准方法
公开(公告)号：JP2014138021A
公开(公告)日：2014-07-28
申请号：JP2013004546
申请日：2013-01-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YOKOYAMA AKIRA , YAMAMOTO SHUHEI , NAKAMURA SATOSHI , IKEDA KAZUTAKA
IPC分类号： H01S5/022 , G02B6/32
摘要： PROBLEM TO BE SOLVED: To provide an alignment device which can highly accurately align a cylindrical lens, a micro lens array arrayed one-dimensionally or the like with respect to a light source part emitting laser beam, and to provide an alignment method using the alignment device.SOLUTION: An alignment device 100 aligns a collimate element 11 for collimating laser beam from a light source part 10 emitting laser beam from a plurality of light-emitting points arrayed one-dimensionally, with respect to the light source part 10. The alignment device 100 includes: a screen 20 to which the laser beam emitted from the collimate element is projected; an imaging device 21 which captures a plurality of images of the projected laser beam; a control part 22 which generates a control signal for alignment by analyzing the shapes of the plurality of captured images; and a movable part 13 which adjusts a relative position and a relative angle between the light source part and the collimate element in accordance with the control signal. The alignment method includes a process for rotating the collimate element in a plane along an emission end surface of the light source part so as to separate the images which are projected to the screen and overlapped with each other.
摘要翻译：要解决的问题：提供一种可以高精度对准柱面透镜的对准装置，相对于发射激光束的光源部分一维等排列的微透镜阵列，并提供使用该对准的对准方法装置。解决方案：对准装置100对齐准直元件11，用于对来自相对于光源部分10一维排列的多个发光点发射激光束的光源部分10的激光束进行准直。对准装置100包括：投影从准直元件发射的激光束的屏幕20; 捕获投影激光束的多个图像的成像装置21; 控制部22，其通过分析多个拍摄图像的形状来生成用于对准的控制信号; 以及可动部13，其根据控制信号调整光源部和准直元件之间的相对位置和相对角度。对准方法包括用于沿着光源部的发射端面在平面内旋转准直元件以分离投射到屏幕并彼此重叠的图像的处理。

7. 发明专利

JP2013058641A Bonding method and bonding device 有权
标题翻译：接合方法和接合装置
公开(公告)号：JP2013058641A
公开(公告)日：2013-03-28
申请号：JP2011196489
申请日：2011-09-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YOKOYAMA AKIRA , TAMAYA MOTOAKI
IPC分类号： H01L21/60 , B23K20/00 , B23K20/10
摘要： PROBLEM TO BE SOLVED: To obtain a bonding method capable of bonding a beam portion of a workpiece having a cantilever with a ribbon in a satisfactory contact state.SOLUTION: The bonding method for bonding the cantilever of a workpiece 30 having a cantilever 32 with a bonding object 31 comprises the steps of: fixing the workpiece to an attachment portion rotatably supported around a center line C; and pressing on a bonding portion a bonding tool 20 for bonding the cantilever to the bonding object. In the step of fixing the workpiece, the workpiece is retained at a position remote from the center line, and disposed in such a manner that the bonding portion of the cantilever with the bonding object coincides with a portion of the center line and the cantilever extends to a direction in parallel with the rotation direction of the attachment portion.
摘要翻译：要解决的问题：获得能够以令人满意的接触状态将具有悬臂的工件的梁部与带接合的接合方法。解决方案：用于将具有悬臂32的工件30的悬臂与接合物体31接合的接合方法包括以下步骤：将工件固定到围绕中心线C可旋转地支撑的安装部分; 并且将接合工具20按压在接合部分上，用于将悬臂接合到接合体上。在固定工件的步骤中，工件被保持在远离中心线的位置，并且以这样的方式设置，使得悬臂与接合物的接合部分与中心线的一部分重合并且悬臂延伸到与安装部的旋转方向平行的方向。版权所有（C）2013，JPO＆INPIT

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