专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

CA2718816C LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2718816C
公开(公告)日：2014-06-03
申请号：CA2718816
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , OKUDA KENJI , NANBA CHISE , NAKAMURA AKIRA , AIZAWA JUNICHI
IPC分类号： H01S5/022
摘要： To obtain a laser light source module, a copper-based material is press-fitted into a through hole in a stem of iron-based material, thereby forming a first heat sink. A mount of copper-based material is fixed to the first heat sink and a semiconductor laser device is mounted. A second heat sink is bonded to lower surfaces of the stem and the first heat sink by thermal conductive adhesive. Thus, desired mechanical strength can be obtained and heat-releasing efficiency can be enhanced. An upper surface of the first heat sink is located on a same plane as that of the stem, and a lower surface thereof is located higher than that of the stem. Thus, position adjustment and positioning of the semiconductor laser device can be easily performed. The optical axis of the light-collecting optical system and that an optical fiber are prevented from being deviated from each other.

2. 发明专利

CA2718903A1 LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2718903A1
公开(公告)日：2009-09-24
申请号：CA2718903
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NANBA CHISE , NAKAMURA AKIRA , FUKUDA KEIICHI , FUNAOKA KOJI , KAWAKAMI MANABU , OKAMURA MASAMITSU
IPC分类号： H01S3/042 , H01S3/094 , H01S3/109
摘要： In manufacturing a laser light source module comprising a heat sink whereon a solid-state laser element, an excitation light source, and a wavelength conversion element are mounted, and a stem for supporting the heat sink, the heat sink is divided into three blocks, that is, a first block mounted with a laser oscillating portion for the solid-state laser element on the top face, a second block mounted with the semiconductor laser element for emitting excitation light for the laser oscillating portion and a first temperature sensor on the top face and mounted with a first heater on a predetermined face, and a third block mounted with the wavelength conversion element for wavelength-converting the fundamental wave laser light oscillated by the laser oscillating portion and a second temperature sensor on the top face and mounted with a second heater on a predetermined face. Only the second block is fastened to the stem by the side face or bottom face, the first block is fastened to another side face of the second block, and the third block is fastened to the side face of the first block, reducing the size and improving the positional accuracy of each element.

3. 发明专利

CA2718903C LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2718903C
公开(公告)日：2013-11-19
申请号：CA2718903
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NANBA CHISE , NAKAMURA AKIRA , FUKUDA KEIICHI , FUNAOKA KOJI , KAWAKAMI MANABU , OKAMURA MASAMITSU
IPC分类号： H01S3/042 , H01S3/094 , H01S3/109
摘要： When a laser light source module is configured to include a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, the heat sink is separated into three blocks, which are a first block on the top surface of which a laser oscillating unit for the solid laser element is arranged, a second block on the top surface of which a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block on the top surface of which the wavelength conversion element that converts the wavelength of the fundamental laser beam oscillated by the laser oscillating unit and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged. Only the second block is fixed at its side surface or bottom surface to the stem, the first block is fixed to the other side surface of the second block, and the third block is fixed to the side surface of the first block. The module can thereby be downsized, and the positioning accuracy of the elements can be improved.

4. 发明专利

CA2717476A1 OPTICAL MODULE 未知
公开(公告)号：CA2717476A1
公开(公告)日：2009-09-24
申请号：CA2717476
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAMURA AKIRA , OKAMURA MASAMITSU , FUKUDA KEIICHI , NANBA CHISE , IKEDA KAZUTAKA
IPC分类号： H01S3/042 , H01S3/094 , H01S3/109
摘要： An optical module comprises a mount whereon a solid-state laser element for oscillating fundamental wave laser light, an excitation light source for exciting the solid-state laser element, and a wavelength conversion element for wavelength-converting the fundamental wave laser light oscillated by the solid-state laser element are mounted, and a substrate for supporting the mount. In manufacturing the optical module, the mount is divided into three blocks, that is, a first block mounted with a laser medium, a second block mounted with the excitation light source, and a third block mounted with the wavelength conversion element. Only the second block is fastened to the substrate by the side face or bottom face, the first block is fastened to another side face of the second block, and the third block is fastened to the side face of the first block.

5. 发明专利

CA2708392C LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2708392C
公开(公告)日：2014-03-18
申请号：CA2708392
申请日：2007-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , FUKUDA KEIICHI , OE SHINICHI , NANBA CHISE , NAKAMURA AKIRA
IPC分类号： H01S5/022
摘要： A heat sink (3) made of material excellent in thermal conductivity and mounted on a stem (1); a sub-mount substrate (4) made of material excellent in insulation property and mounted on the heat sink (3); a first lead frame (5) made of material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array (7), mounted on the sub-mount substrate (4), having the semiconductor laser array (7) mounted thereon, and composing a power feeding path of the semiconductor laser array (7); a second lead frame (6) made of material excellent in electric conductivity and thermal conductivity, arranged on the sub-mount substrate (4) side by side with the first lead frame (5), and composing the power feeding path of the semiconductor laser array (7); and wire (8) for electrically bonding the semiconductor laser array (7) and the second lead frame (6).

6. 发明专利

CA2784697A1 LASER MODULE 未知
公开(公告)号：CA2784697A1
公开(公告)日：2011-06-23
申请号：CA2784697
申请日：2010-12-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NANBA CHISE , YANAGISAWA TAKAYUKI , OE SHINICHI , YAMAMOTO SHUHEI , YOKOYAMA AKIRA
IPC分类号： H01S5/022
摘要： Provided is an inexpensive module structure wherein it is possible to drive an LD array at low stress and at an appropriate temperature. The module is provided with a heat sink (3) for releasing the heat from a member which comes into contact therewith, a submount substrate (4) disposed on the heat sink (3) and configured from an insulating material, a feed layer (5A) disposed on the submount substrate (4), and a semiconductor laser array (6) having a plurality of light-emitting units disposed in parallel on the feed layer (5A), wherein: the linear expansion coefficient of the submount substrate (4) is smaller than the linear expansion coefficient of the semiconductor laser array (6); and the linear expansion coefficient of the submount substrate (4) when connected to the heat sink (3), which has a linear expansion coefficient higher than that of the semiconductor laser array (6), is set to be within a predetermined range which includes the linear expansion coefficient of the semiconductor laser array (6).

7. 发明专利

CA2718816A1 LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2718816A1
公开(公告)日：2009-09-24
申请号：CA2718816
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , OKUDA KENJI , NANBA CHISE , NAKAMURA AKIRA , AIZAWA JUNICHI
IPC分类号： H01S5/022
摘要： In obtaining a laser light source module, a copper-based material is press-fit into a through-hole formed in a stem formed of an iron-based material to form a first heat sink, and a mount formed of a copper-based material is fixed on the first heat sink, and at least one semiconductor laser element is mounted on the mount. Meanwhile, by joining a second heat sink to the bottom face of the stem and the first heat sink, a desired mechanical strength can be easily obtained and the heat exhausting efficiency can also be improved. Moreover, the top face of the first heat sink is made flush with that of the stem and the bottom face of the first heat sink is located above the bottom face of the stem, facilitating the position adjustment of the semiconductor laser element in a direction perpendicular to the optical axis of a condensing optical system and the positioning of the semiconductor laser element in the optical axis direction of the condensing optical system, and at the same time, preventing a deviation between the optical axis of the condensing optical system and that of an optical element such as an optical fiber.

8. 发明公开

EP2256880A4 LASER LIGHT SOURCE MODULE 有权
标题翻译：激光光源模块
公开(公告)号：EP2256880A4
公开(公告)日：2011-12-28
申请号：EP08722352
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , OKUDA KENJI , NANBA CHISE , NAKAMURA AKIRA , AIZAWA JUNICHI
IPC分类号： H01S5/022
CPC分类号： H01S5/02469 , H01S5/02212 , H01S5/02272 , H01S5/02284 , H01S5/02492 , H01S5/4025

9. 发明公开

EP2259391A4 LASER LIGHT SOURCE MODULE 有权
标题翻译：激光光源模块
公开(公告)号：EP2259391A4
公开(公告)日：2012-03-21
申请号：EP08722353
申请日：2008-03-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NANBA CHISE , NAKAMURA AKIRA , FUKUDA KEIICHI , FUNAOKA KOJI , KAWAKAMI MANABU , OKAMURA MASAMITSU
IPC分类号： H01S3/042 , H01S3/02 , H01S3/094 , H01S3/109
CPC分类号： H01S3/025 , G02F1/37 , H01S3/0092 , H01S3/042 , H01S3/09415

10. 发明专利

CA2779062C SEMICONDUCTOR LASER MODULE 未知
公开(公告)号：CA2779062C
公开(公告)日：2015-10-13
申请号：CA2779062
申请日：2010-01-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NAKAMURA AKIRA , NANBA CHISE
IPC分类号： H01S5/022
摘要： In order to obtain a semiconductor laser module in which breakage is not made in a cooling process during sealing with glass, magneto-striction deformation is in an acceptable range, and a large current can be flown, the semiconductor laser module includes: a semiconductor laser element (10) which emits light by the supply of a current; a package base (1) having a through hole (1A); a lead pin (2) which passes through the through hole (1A) and supplies the current to the semiconductor laser element (10); a glass material (3) which seals the through hole (1A) through which the lead pin (2) passes through; and a cap (30) which has a window (31) from which light emitted by the semiconductor laser element (10) is taken out and has the semiconductor laser element (10) in the inside thereof, the cap (30) being hermetically joined to the package base (1). The lead pin (2) is an iron-nickel alloys in which the coefficient of linear expansion is not higher than a predetermined ratio in difference with the glass material (3), the saturation magneto-striction constant is not higher than a predetermined value, and volume resistivity is not higher than a predetermined rate.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式