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1. 发明专利

CA2708392A1 LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2708392A1
公开(公告)日：2009-07-02
申请号：CA2708392
申请日：2007-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , FUKUDA KEIICHI , OE SHINICHI , NANBA CHISE , NAKAMURA AKIRA
IPC分类号： H01S5/022
摘要： A laser light source module is provided with a heat sink (3) which is formed of a material superior in thermal conductivity and is mounted on a stem (1), a submount substrate (4) which is formed of a material superior in insulation property and is mounted on the heat sink (3), a first lead frame (5) which is superior in electrical conductivity and thermal conductivity, is formed of a material having the almost same coefficient of linear expansion as a semiconductor laser array (7), is mounted on the submount substrate (4), mounts the semiconductor laser array (7) and constitutes a feed line of the semiconductor laser array (7), a second lead frame (6) which is formed of a material superior in electrical conductivity and thermal conductivity, is arranged on the submount substrate (4) with the first lead frame (5) and constitutes a feed line of the semiconductor laser array (7), and a wire (8) which electrically connects the semiconductor laser array (7) and the second lead frame (6).

2. 发明专利

CA2710955C LASER LIGHT SOURCE DEVICE 未知
公开(公告)号：CA2710955C
公开(公告)日：2014-08-19
申请号：CA2710955
申请日：2007-12-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： OE SHINICHI , TAMAYA MOTOAKI , NAKAMURA AKIRA , FUKUDA KEIICHI
IPC分类号： H01S5/022 , G02F1/37 , H01S3/042 , H01S3/094
摘要： In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.

3. 发明专利

CA2718504A1 OPTICAL MODULE 未知
公开(公告)号：CA2718504A1
公开(公告)日：2009-09-17
申请号：CA2718504
申请日：2008-03-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUKUDA KEIICHI , TAMAYA MOTOAKI , OE SHINICHI , HAMAGUCHI TSUNEO , NAKAMURA AKIRA
IPC分类号： H01S5/022
摘要： To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced.

4. 发明专利

CA2710955A1 LASER LIGHT SOURCE DEVICE 未知
公开(公告)号：CA2710955A1
公开(公告)日：2009-07-09
申请号：CA2710955
申请日：2007-12-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： OE SHINICHI , TAMAYA MOTOAKI , NAKAMURA AKIRA , FUKUDA KEIICHI
IPC分类号： H01S5/022 , G02F1/37 , H01S3/042 , H01S3/094
摘要： A laser light source device has a plurality of optical elements bonded to a heat sink through a submount. Deterioration of an optical characteristic due to flow down of extra bond at the time of assembly to a side of the heat sink is prevented, and the laser light source device having the optical characteristic of high quality can be obtained. For optically and directly bonding a plurality of the optical elements, the heat sinks of the respective elements are bonded mutually by adhesives, and a groove part for storing extra bond is formed on a face of the submount bonded with the heat sink. The groove part is extended to a direction substantially orthogonal to an optical axis of light emitted from the laser light source device.

5. 发明专利

CA2708392C LASER LIGHT SOURCE MODULE 未知
公开(公告)号：CA2708392C
公开(公告)日：2014-03-18
申请号：CA2708392
申请日：2007-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , FUKUDA KEIICHI , OE SHINICHI , NANBA CHISE , NAKAMURA AKIRA
IPC分类号： H01S5/022
摘要： A heat sink (3) made of material excellent in thermal conductivity and mounted on a stem (1); a sub-mount substrate (4) made of material excellent in insulation property and mounted on the heat sink (3); a first lead frame (5) made of material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array (7), mounted on the sub-mount substrate (4), having the semiconductor laser array (7) mounted thereon, and composing a power feeding path of the semiconductor laser array (7); a second lead frame (6) made of material excellent in electric conductivity and thermal conductivity, arranged on the sub-mount substrate (4) side by side with the first lead frame (5), and composing the power feeding path of the semiconductor laser array (7); and wire (8) for electrically bonding the semiconductor laser array (7) and the second lead frame (6).

6. 发明专利

CA2784697A1 LASER MODULE 未知
公开(公告)号：CA2784697A1
公开(公告)日：2011-06-23
申请号：CA2784697
申请日：2010-12-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , NANBA CHISE , YANAGISAWA TAKAYUKI , OE SHINICHI , YAMAMOTO SHUHEI , YOKOYAMA AKIRA
IPC分类号： H01S5/022
摘要： Provided is an inexpensive module structure wherein it is possible to drive an LD array at low stress and at an appropriate temperature. The module is provided with a heat sink (3) for releasing the heat from a member which comes into contact therewith, a submount substrate (4) disposed on the heat sink (3) and configured from an insulating material, a feed layer (5A) disposed on the submount substrate (4), and a semiconductor laser array (6) having a plurality of light-emitting units disposed in parallel on the feed layer (5A), wherein: the linear expansion coefficient of the submount substrate (4) is smaller than the linear expansion coefficient of the semiconductor laser array (6); and the linear expansion coefficient of the submount substrate (4) when connected to the heat sink (3), which has a linear expansion coefficient higher than that of the semiconductor laser array (6), is set to be within a predetermined range which includes the linear expansion coefficient of the semiconductor laser array (6).

7. 发明公开

EP2239823A4 LASER LIGHT SOURCE MODULE 有权
标题翻译：激光光源模块
公开(公告)号：EP2239823A4
公开(公告)日：2013-07-17
申请号：EP07859969
申请日：2007-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAMAYA MOTOAKI , FUKUDA KEIICHI , OE SHINICHI , NANBA CHISE , NAKAMURA AKIRA
IPC分类号： H01S5/022 , H01S5/024 , H01S5/40
CPC分类号： H01S5/02276 , H01L2224/48091 , H01L2224/49175 , H01S5/0224 , H01S5/02272 , H01S5/02492 , H01S5/4031 , H01L2924/00014

8. 发明公开

EP2226909A4 LASER LIGHT SOURCE DEVICE 审中-公开
标题翻译：激光光源设备
公开(公告)号：EP2226909A4
公开(公告)日：2012-07-04
申请号：EP07860523
申请日：2007-12-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： OE SHINICHI , TAMAYA MOTOAKI , NAKAMURA AKIRA , FUKUDA KEIICHI
IPC分类号： H01S3/02 , H01S3/042 , H01S3/0941 , H01S5/022 , H01S5/024
CPC分类号： H01S3/09415 , G02F1/353 , G02F2001/3505 , H01S3/0092 , H01S3/025 , H01S3/0405 , H01S3/042 , H01S3/0627 , H01S5/02248 , H01S5/02469

9. 发明专利

JP2011177874A Device and method for adjusting position of rotary plate 审中-公开
标题翻译：调整旋转位置的装置和方法
公开(公告)号：JP2011177874A
公开(公告)日：2011-09-15
申请号：JP2010047326
申请日：2010-03-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OE SHINICHI , SUGIURA SEI , SATONE TOSHIKAZU , HASEGAWA RITSUKO
IPC分类号： B25J15/06 , B25J13/08 , B65G49/06
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for adjusting a position of a rotary plate responsive to micro displacement of the rotary plate, wherein its structure is simple.
SOLUTION: The device 50 for adjusting the position of the rotary plate includes an absorption conveying device 51, a recognition camera 7, and a control device 10. The absorption conveying device is provided with an absorption head 1 to absorb the rotary plate 2, wherein the absorption head 1 includes a head body 101, a metal absorption pad 102 absorbing the rotary plate, and a bonding part 103 joining the head body and the absorption pad and deformed so that the absorption pad can follow an attitude of the rotary plate.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种响应于旋转板的微小位移来调节旋转板的位置的装置和方法，其结构简单。解决方案：用于调节旋转板的位置的装置50包括吸收输送装置51，识别照相机7和控制装置10.吸收输送装置设置有吸收头1，以吸收旋转板如图2所示，吸收头1包括头部主体101，吸收旋转板的金属吸收垫102和接合头部本体和吸收垫并变形的接合部103，使得吸收垫可以跟随旋转体的姿态盘子。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2004281336A Color selection electrode assembly for color cathode ray tube, and method and device for manufacturing the same 审中-公开
标题翻译：用于彩色阴极射线管的彩色选择电极组件及其制造方法和装置
公开(公告)号：JP2004281336A
公开(公告)日：2004-10-07
申请号：JP2003074761
申请日：2003-03-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OE SHINICHI , WATANUKI HARUO , TSUKASAKI TAKESHI , MIZUMOTO YOSHIO
IPC分类号： H01J9/12 , H01J9/14 , H01J9/236 , H01J29/07 , H01J29/80
CPC分类号： H01J29/073 , H01J9/142 , H01J2229/0716
摘要： PROBLEM TO BE SOLVED: To enable a color selection electrode element to be reliably welded to a hollow frame formed by bending a sheet metal, achieving a light weight, low cost color cathode ray tube.
SOLUTION: The hollow frame obtained by bending a sheet metal comprises two opposing support parts 2a each including a curbed surface portion having a predetermined radius in the cross section. The color selection electrode element 1 is welded by a roller electrode 3 to the frame along a portion 2c abutting the curbed surface portion. The roller electrode 3 travels with an inclination of a predetermined angle of θ(θ1
摘要翻译：要解决的问题：为了使选色电极元件可靠地焊接到通过弯曲金属板而形成的中空框架，实现了重量轻，成本低的彩色阴极射线管。解决方案：通过弯曲金属板获得的中空框架包括两个相对的支撑部件2a，每个支撑部件包括在横截面中具有预定半径的弯曲表面部分。选色电极元件1通过邻接弯曲面部的部分2c被辊电极3焊接到框架。辊电极3与框架的外侧以预定角度θ（θ1<θ<θ2）关系的倾斜行进。版权所有（C）2005，JPO＆NCIPI

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