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    • 2. 发明专利
    • JOSEPHSON TUNNEL JUNCTION ELEMENT
    • JPS58151076A
    • 1983-09-08
    • JP3359582
    • 1982-03-02
    • MITSUBISHI ELECTRIC CORP
    • SUGAWARA HIROSHITSUBOI SHIYUNGONOGUCHI TAKU
    • H01L39/22
    • PURPOSE:To contrive the improvement of corrosion resistance without damaging the characteristic, by forming the electrode material of a Josephson tunnel junction element of a thin film laminated structure by adding Bi and Cr to Pb. CONSTITUTION:The lower electrode 2 of the Josephson tunnel junction element is provided on a substrate 1 by continuously depositing by evaporating Au to 4.5nm, Pb to 160nm and In to 35.5nm, and a tunnel barrier layer 4 is provided on an aperture part of an SiO2 deposited film 3, while the upper electrode 5 is formed by continuously depositing by evaporating Pb to 136nm, Bi to 128nm, Pb to 136nm and Cr to 30-100nm. The lower electrode is easily changed into an alloy at a room temperature or the temperature of approx. 80 deg.C, and the upper electrode is likewise diffused and changed into an alloy except for Cr. Besides, Cr is diffused to the lowermost part of the film, and accordingly the corrosion resistance is improved. On the other hand, the temperature of superconductive transition is decreased more or less by the Cr diffusion into Pb-Bi, however, there is no hindrance in using this junction element for a logic and memory circuit.
    • 3. 发明专利
    • JOSEPHSON MEMORY DEVICE
    • JPS5823391A
    • 1983-02-12
    • JP12209581
    • 1981-08-03
    • MITSUBISHI ELECTRIC CORP
    • SUGAWARA HIROSHI
    • G11C11/44H01L39/22H01L39/24H03K19/195
    • PURPOSE:To form a device through the use of a material high in superconduction transit temperature with simple process and to attain high speed operation, by adopting a current injection Josephson element construction as a driver switching gate. CONSTITUTION:The 1st electrode 25 constitutes a current supply loop line and the 2nd upper electrode 29 forms a current injection control line. After a thermo- oxidated silicon substrate 20 is heated to a temperature of 400 deg.C and a niobium nitride (NbN) film is formed on the entire substrate surface with the high frequency reaction sputtering method, a ground plane 21 and a lower electrode 23 are separately formed with the plasma etching in gaseous carbon tetrafluoride (CF4). After an isolation layer 24 is formed with an SiO evaportion film with the lift-off method and a tunnel barrier layer 26 is formed with the sputter oxidation method, and the 1st and 2nd upper electrodes 25 and 29 are simultaneously formed with a bismuth lead continuous evaporation film by the lift-off method.
    • 6. 发明专利
    • METHOD OF FORMING METAL IMAGE
    • JPS5541786A
    • 1980-03-24
    • JP11609278
    • 1978-09-19
    • MITSUBISHI ELECTRIC CORP
    • UMEZAKI MITSUMASASUGAWARA HIROSHIOZEKI TATSUOTOTSUTORI HIROSHI
    • H01L21/306H01L21/302
    • PURPOSE:To provide the subject method comprising the steps of: providing partitions consisting of photoresists the intervals of which are defined on the substrate, applying metal films on the partitioned regions, and removing by etching metal films in the unnecessary partitions while masking the partitioned regions with the resists thereby to obtain a fine metal wiring. CONSTITUTION:If the substrate 1 is made of a material unable to be electroplated, a plated layer 2 which becomes a surface layer is firstly applied thereon, and there are formed thereon partitions 7 consisting of plating photoresist images having a width d of less than 10mum at an interval of l the same as the width t of the fine image 5 formed subsequently. Then, while the layer 2 encircled by partitions 7 is subjected to photoresist coat plating to form the metal film 3, the film 3 is divided into two parts 3a and 3b without adhering to the partitions 7. Thereafter, an etching photoresist image 8 containing the upper parts of partitions 7 at both sides are removed by etching using the image 8 as a mask. Then, the partitions 7 and the image 8 are removed, and only the fine image 5 having the width t being caused to remain at the central part.
    • 10. 发明专利
    • PRODUCTION OF MAGNETIC RECORDING MEDIUM
    • JPS6295739A
    • 1987-05-02
    • JP23811085
    • 1985-10-22
    • MITSUBISHI ELECTRIC CORP
    • DAI KAZUHIKOSUGAWARA HIROSHI
    • C23C14/20C30B28/12C30B29/52G11B5/85G11B5/851
    • PURPOSE:To obtain a smooth surface by applying a high-frequency bias voltage to a substrate and selectively resputtering a film grown on the projecting parts of the substrate in the stage of forming a high permeability magnetic film on the substrate by a sputtering method. CONSTITUTION:Ar is introduced into a vessel 8 to maintain a prescribed vacuum degree therein. A high-frequency voltage is impressed from a power source 3 to a target 1 to generated plasma and a high permeability Fe-Ni alloy film is formed on the Al alloy substrate 4 formed by subjecting the surface to an alumite treatment from Fe-Ni 2. Electrons from the plasma are accumulated in the substrate and the same state as the state in which a negative bias voltage is impressed is attained when the high-frequency voltage is impressed from a power source 6 to a substrate holder 5. The Ar ions in the plasma arrive at the substrate and balance near the substrate 4. The average negative DC bias is thus determined. The film grown on the projecting parts of the substrate is selectively resputtered by the Ar ions arriving at the substrate, by which the surface is smoothed and the vertical magnetic recording medium having a good surface characteristic is obtd. The spacing quantity between a magnetic head and the medium is decreased and the substantial reproduction voltage is obtd.