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    • 5. 发明专利
    • Device and method for mounting electronic component
    • 用于安装电子元件的装置和方法
    • JP2004265952A
    • 2004-09-24
    • JP2003047313
    • 2003-02-25
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • NODA KAZUHIKOMUKOJIMA HITOSHINARISEI YASUHIROHIRAKAWA TOSHIROKINKI KOZONISHIMURA AKIRAUCHIDA MAMORUISHIKAWA TAKATOSHI
    • H05K13/04H01L21/60
    • PROBLEM TO BE SOLVED: To provide a device and method for mounting electronic component by which productivity can be improved by shortening the tact time. SOLUTION: The electronic component mounting device receives a chip 6 taken out of a supplying section 2 and turned over by means of a take-out/transfer head 16 installed to a rotary chip taking-out/transferring mechanism 15, and mounts the received chip 6 on a substrate 10 by means of a mounting head 14. The mounting device is constituted to pick up the images of the chip 6 from the above of a supplying position [A] from which the chip 6 is taken out for deciding the taking-out position of the chip 6, and from the below of a receiving position [D] at which the mounting head 14 receives the chip 6 for deciding the mounting position of the chip 6 on the substrate 10. At the time of picking up the image of the chip 6 for deciding the mounting position, the take-out/transfer head 16 is moved to a position at which the head 16 does not interrupt the image picking-up operation by rotating the head 16. Consequently, the tact time can be shortened, because, upon receiving the chip 6, the mounting head 14 can move to the substrate 10 without stopping once after the images of the chip 6 are picked up. COPYRIGHT: (C)2004,JPO&NCIPI
    • 要解决的问题:提供一种用于安装电子部件的装置和方法,通过缩短生产时间可提高生产率。

      解决方案:电子部件安装装置接收从供给部2取出并通过安装在旋转芯片取出输送机构15上的取出/转印头16翻转的芯片6,并安装 接收的芯片6通过安装头14在基板10上。安装装置构成为从供给位置[A]的上方拾取芯片6的图像,从供给位置[A]取出芯片6以决定 芯片6的取出位置和从安装头14接收芯片6的接收位置[D]的下方确定芯片6在基板10上的安装位置。在拾取时 取出用于决定安装位置的芯片6的图像,通过旋转头16,取出/转印头16移动到头部16不中断图像拾取操作的位置。因此, 时间可以缩短,因为在收到芯片6时,mo 在拾取芯片6的图像之后,打印头14可以移动到基板10而不停止一次。 版权所有(C)2004,JPO&NCIPI