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1. 发明专利

JP2005222983A Substrate carrier and substrate carrying method 有权
标题翻译：基板载体和基板执行方法
公开(公告)号：JP2005222983A
公开(公告)日：2005-08-18
申请号：JP2004026436
申请日：2004-02-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HIRAKAWA TOSHIRO , NARISEI YASUHIRO , MUKOJIMA HITOSHI , NODA KAZUHIKO , WATANUKI YOSHIMI
IPC分类号： H05K13/02 , H01L21/50 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a substrate carrier for reducing facility costs by using a simple mechanism. SOLUTION: In the substrate carrier for carrying out a substrate 5 carried in along a straight conveyance path L from the upstream side to the downstream side through a working position on the conveyance path L; a work stage 3 that can travel freely by a moving table 2 is arranged between a carry-in stage 4 that is arranged on the conveyance path L, and places a substrate carried onto each upper surface from the upstream side and a carry-out stages 6 for placing a substrate carried out to the downstream side. The substrate 5 on the carry-in stage 4 is carried out to the work stage 3 by a conveyance nib 18A at a first substrate conveyor 11, and the substrate 5 on the work stage 3 is conveyed to the carry-out stage 6 by a conveyance nib 18B in the second substrate conveyor 12 simultaneously driven by the same drive source as the first substrate conveyor 11. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过使用简单的机构来提供用于降低设备成本的基板载体。解决方案：在用于沿着直线输送路径L沿着输送路径L的工作位置从上游侧向下游侧承载基板5的基板载体中，可以通过移动台2自由行进的工作台3布置在布置在输送路径L上的搬入台4之间，并且将从上游侧承载在每个上表面上的基板和进出阶段 6，用于将进行下游侧的基板放置。搬运台4上的基板5通过第一基板输送机11的输送尖头18A进行到工作台3，工作台3上的基板5通过一个输送笔尖18B在第二基板输送机12中同时由与第一基板输送机11相同的驱动源驱动。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2007019138A Component pressurizing apparatus 有权
标题翻译：组件压力装置
公开(公告)号：JP2007019138A
公开(公告)日：2007-01-25
申请号：JP2005197190
申请日：2005-07-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NARISEI YASUHIRO , MUKOJIMA HITOSHI
IPC分类号： H01L21/52 , H02K33/16
摘要： PROBLEM TO BE SOLVED: To provide a component pressurizing apparatus coping with a highly packaged load by using a compact, light voice coil type motor. SOLUTION: In a component pressurizing head 12 that holds a component by a component holding tool 13 provided at one end of an axis member 27, and rotates the component around an axis 27b and pressurizes the component in the direction of the axis 27b, first and second voice coil type motors 30A, 30B sandwich the axis member 27 and are arranged on both sides between upper and lower plates 21, 25, and a load is transmitted to the axis member 27 from the lower plate 25 connected to a movable yoke member in the two voice coil type motors, thus achieving the highly packaged load by using the compact, light voice coil type motor. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过使用紧凑的轻音圈型电动机来提供应对高度封装的负载的部件加压装置。解决方案：在通过设置在轴构件27的一端处的部件保持工具13保持部件的部件加压头12中，并且使部件围绕轴线27b旋转并且使部件沿着轴线27b的方向加压第一和第二音圈型电动机30A，30B夹着轴构件27并且布置在上板21和下板25之间的两侧，并且负载从连接到可移动的下板25的下板25传递到轴构件27 在两个音圈式电动机中的轭构件，因此通过使用紧凑型轻音圈型电动机实现高度封装的负载。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007019137A Component pressurizing apparatus 有权
标题翻译：组件压力装置
公开(公告)号：JP2007019137A
公开(公告)日：2007-01-25
申请号：JP2005197189
申请日：2005-07-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NARISEI YASUHIRO , MUKOJIMA HITOSHI
IPC分类号： H01L21/52 , H02K33/16 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component pressurizing apparatus coping with a highly packaged load by using a compact, light voice coil type motor. SOLUTION: In a component pressurizing head 12 that holds a component by a component holding tool 13 provided at one end of an axis member 27, and rotates the component around an axis 27b and pressurizes the component in the direction of the axis 27b, first and second voice coil type motors 30A, 30B sandwich the axis member 27, and are arranged on both sides between upper and lower plates 21, 25, and a load is transmitted to the axis member 27 from the lower plate 25 connected to a movable magnet holding member in the two voice coil type motors, thus achieving the highly packaged load by using the compact, light voice coil type motor. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过使用紧凑的轻音圈型电动机来提供应对高度封装的负载的部件加压装置。解决方案：在通过设置在轴构件27的一端处的部件保持工具13保持部件的部件加压头12中，并且使部件围绕轴线27b旋转并且使部件沿着轴线27b的方向加压第一和第二音圈型电动机30A，30B夹着轴构件27，并且布置在上板21和下板25之间的两侧，并且负载从连接到两个音圈式电动机中的可移动磁体保持构件，因此通过使用紧凑型轻音圈型电动机实现高度封装的负载。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004265953A Device and method for mounting electronic component 有权
公开(公告)号：JP2004265953A
公开(公告)日：2004-09-24
申请号：JP2003047314
申请日：2003-02-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NODA KAZUHIKO , MUKOJIMA HITOSHI , NARISEI YASUHIRO , HIRAKAWA TOSHIRO , KINKI KOZO , NISHIMURA AKIRA , UCHIDA MAMORU , ISHIKAWA TAKATOSHI
IPC分类号： H05K13/04 , H01L21/50 , H01L21/67 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic component by which productivity can be improved by shortening the tact time. SOLUTION: The electronic component mounting device receives a chip 6 taken out from a supplying section 2 and turned over by means of a take-out/transfer head 16 installed to a rotary chip taking-out/transferring mechanism 15 and mounts the received chip 6 on a substrate 10 by means of a mounting head 14. The mounting device recognizes the position of the chip 6 by picking up the image of the chip 6 at a pre-center recognizing position [C] provided in the course of the taking-out and transferring operation of the take-out/transfer head 16 holding the chip 6 for transferring the head 6 to the receiving position [D] of the mounting head 14, and aligns the chip 4 and mounting head 14 with each other by controlling a mounting head driving mechanism based on the recognized result of the position of the chip 6. Consequently, the tact time can be shortened, because it is not required to retreat the mounting head 14 from the receiving position for pre-center recognition. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004265952A Device and method for mounting electronic component 有权
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：JP2004265952A
公开(公告)日：2004-09-24
申请号：JP2003047313
申请日：2003-02-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NODA KAZUHIKO , MUKOJIMA HITOSHI , NARISEI YASUHIRO , HIRAKAWA TOSHIRO , KINKI KOZO , NISHIMURA AKIRA , UCHIDA MAMORU , ISHIKAWA TAKATOSHI
IPC分类号： H05K13/04 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a device and method for mounting electronic component by which productivity can be improved by shortening the tact time. SOLUTION: The electronic component mounting device receives a chip 6 taken out of a supplying section 2 and turned over by means of a take-out/transfer head 16 installed to a rotary chip taking-out/transferring mechanism 15, and mounts the received chip 6 on a substrate 10 by means of a mounting head 14. The mounting device is constituted to pick up the images of the chip 6 from the above of a supplying position [A] from which the chip 6 is taken out for deciding the taking-out position of the chip 6, and from the below of a receiving position [D] at which the mounting head 14 receives the chip 6 for deciding the mounting position of the chip 6 on the substrate 10. At the time of picking up the image of the chip 6 for deciding the mounting position, the take-out/transfer head 16 is moved to a position at which the head 16 does not interrupt the image picking-up operation by rotating the head 16. Consequently, the tact time can be shortened, because, upon receiving the chip 6, the mounting head 14 can move to the substrate 10 without stopping once after the images of the chip 6 are picked up. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于安装电子部件的装置和方法，通过缩短生产时间可提高生产率。
解决方案：电子部件安装装置接收从供给部2取出并通过安装在旋转芯片取出输送机构15上的取出/转印头16翻转的芯片6，并安装接收的芯片6通过安装头14在基板10上。安装装置构成为从供给位置[A]的上方拾取芯片6的图像，从供给位置[A]取出芯片6以决定芯片6的取出位置和从安装头14接收芯片6的接收位置[D]的下方确定芯片6在基板10上的安装位置。在拾取时取出用于决定安装位置的芯片6的图像，通过旋转头16，取出/转印头16移动到头部16不中断图像拾取操作的位置。因此，时间可以缩短，因为在收到芯片6时，mo 在拾取芯片6的图像之后，打印头14可以移动到基板10而不停止一次。版权所有（C）2004，JPO＆NCIPI

6. 发明专利

JP2000286307A METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2000286307A
公开(公告)日：2000-10-13
申请号：JP2000064931
申请日：2000-03-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARISEI YASUHIRO
IPC分类号： B23P21/00 , H01L21/60 , H05K3/32 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To accurately and easily adjust the flatness of a pressure-fitting tool. SOLUTION: An electronic component is placed on the electrode of a substrate, and the electronic component is pressed to the electrode by a pressure- fitting tool for mounting. Here, a heater block 13 contacts the tool, and heaters a, b, c, d, e, and f are arranged above and below the heater block 13, with each of heaters a, b, c, d, e, and f independently adjusted for temperature. Thus, thermal stress in a direction in which the flatness of a press-fitting surface improves, is produced at the press-fitting took, for correcting warping of the press-fitting surface.

7. 发明专利

JPH08274130A THERMOCOMPRESSION BONDING DEVICE FOR ELECTRONIC PARTS 失效
公开(公告)号：JPH08274130A
公开(公告)日：1996-10-18
申请号：JP7170995
申请日：1995-03-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIKAWA TAKATOSHI , NARISEI YASUHIRO , TAKAHASHI SEIJI
IPC分类号： H01L21/60 , H01L21/603 , H05K3/34 , H05K3/36
摘要： PURPOSE: To provide a thermocompression bonding device for electronic parts which hardly deform an outer lead by thermal expansion at the time of bonding the outer lead stuck to the lower surface of a film carrier to the electrode of a substrate through an anisotropic conductive tape by pressing a thermocompression bonding tool against the film carrier. CONSTITUTION: A substrate 6 placing stage 29 is formed of glass having thermal conductivity smaller than that of a thermocompression bonding tool 9. An outer lead 3 on the lower surface of a film carrier 2 for electronic parts is joined to the electrode 7 of the substrate 6 with an anisotropic conductive tape 8 in between and the tool 9 is pressed against the carrier 2. When the tool 9 is pressed against the carrier 2, the temperature gradients at the points A, O, and B of a lead section become smaller, since the heat can hardly escape to the stage 29. Therefore, the deformation of the outer lead 3 by thermal expansion does not become large and the outer lead 3 can be bonded to the electrode 7 with accuracy.

8. 发明专利

JPH08125400A SUBSTRATE POSITION DETECTION DEVICE AND DETECTION OF POSITION OF SUBSTRATE 失效
公开(公告)号：JPH08125400A
公开(公告)日：1996-05-17
申请号：JP25343294
申请日：1994-10-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARISEI YASUHIRO , FUKUDA YOSHIHIRO
IPC分类号： B23Q17/24 , H05K13/04 , H05K13/08
摘要： PURPOSE: To provide a substrate position detection device, which does not enlarge the whole device and can hold a high positional detection accuracy, and a method of detecting the position of a substrate. CONSTITUTION: A substrate 7, marked with a plurality of alignment marks 7a and 7b respectively at a position apart from the mark 7b or the mark 7a, is held on a table 6, cameras 10a and 10b are respectively arranged in the vicinities of the alignment marks 7a and 7b and the table 6 is driven, whereby the substrate 7 is horizontally moved to put the marks 7a and 7b in the visual fields of the cameras 10a and 10b arranged in the vicinities of the marks 7a and 7b to observe the marks and the position of the substrate 7 is detected on the basis of the positions of the marks 7a and 7b.

9. 发明专利

JPH08122018A METHOD FOR MEASURING POSITION OF SUBSTRATE 失效
公开(公告)号：JPH08122018A
公开(公告)日：1996-05-17
申请号：JP25343394
申请日：1994-10-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARISEI YASUHIRO , FUKUDA YOSHIHIRO
IPC分类号： G01B11/00 , H05K13/04
摘要： PURPOSE: To obtain a position detection method in which a position is detected with high accuracy by supporting a substrate horizontally, detecting the position of an alignment mark on the substrate with a fixed camera, turning the substrate horizontally by a definite angle, detecting the position of another alignment mark on the substrate and computing the position of the substrate on the basis of positions of both marks. CONSTITUTION: A substrate 7 is held horizontally on a table 6, a camera 10 is fixed to a base stand 1, the table 6, an X-table 3 and a Y-table 4 are driven, and an alignment mark 7a on the substrate 7 is caught by the camera 10 so as to detect its dislocation. Then, the table 6 is turned by a prescribed angle, and an alignment mark 7b is caught so as to detect its dislocation. Then, the coordinates of the marks 7a, 7b are computed, and a deviation from the ideal position of the substrate 7 is found on the basis of them. After that, the substrate 7 is positioned in the ideal position by means of the tables 3, 4, 6. Since the substrate 7 is turned in this method, a horizontal movement distance is reduced, and a position can be detected with high accuracy by the fixed camera 10.

10. 发明专利

JP2002158425A SYSTEM AND METHOD FOR THERMOCOMPRESSION BONDING OF ELECTRONIC COMPONENT 失效
公开(公告)号：JP2002158425A
公开(公告)日：2002-05-31
申请号：JP2000349354
申请日：2000-11-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARISEI YASUHIRO
IPC分类号： H05K3/32 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a system and a method for thermocompression bonding of an electronic component in which warp on the lower surface of a compression tool is corrected efficiently with high accuracy and compression bonding quality can be ensured. SOLUTION: At the time of heating a compression bonding tool 21 for thermocompression bonding of an electronic component to a substrate, heat blocks 14A and 14B are arranged vertically in two stages on side face parallel to the longitudinal direction of the tool 21 and a heat block 15 is arranged on the opposite side face. Temperature of the heat block 14A proximate to the lower end of the compression bonding tool 21 is controlled to a set level associated with the compression boding temperature of the compression bonding tool 21, the heat block 14B is controlled at a temperature for correcting vertical warp of the compression bonding tool 21 and the heat block 15 on the opposite side is controlled at a temperature for correcting horizontal warp of the compression bonding tool 21.

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