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1. 发明授权

US06444491B1 Composite semiconductor devices and method for manufacture thereof 失效
标题翻译：复合半导体器件及其制造方法
公开(公告)号：US06444491B1
公开(公告)日：2002-09-03
申请号：US09547122
申请日：2000-04-11
申请人： Lucian Arthur D'Asaro , Keith Wayne Goossen , Sanghee Park Hui , Betty J. Tseng , James Albert Walker
发明人： Lucian Arthur D'Asaro , Keith Wayne Goossen , Sanghee Park Hui , Betty J. Tseng , James Albert Walker
IPC分类号： H01L2144
CPC分类号： H01L25/167 , H01L31/125 , H01L2221/68359 , H01L2221/68363 , H01L2224/16225 , H01L2924/00014 , H01L2924/10253 , H01L2924/00 , H01L2224/0401
摘要： An integrated semiconductor device is formed from two fabricated semiconductor devices each having a substrate by placing an etch-resist on the substrate of the one semiconductor device, by bonding the conductors of one of the fabricated semiconductor devices to the conductors of the other fabricated semiconductor device, flowing an uncured cement (e.g. epoxy) between the etch-resist and the other substrate, allowing the cement to solidify, and removing the substrate from the one of the semiconductor devices. More specifically, a hybrid semiconductor device is formed from a GaAs/AlGaAs multiple quantum well modulator having a substrate and an IC chip having a substrate by placing an etch resist on the modulator substrate, bonding the conductors of the modulator to the conductors of the chip, wicking an uncured epoxy between the modulators and the chip, allowing the epoxy to cure, and removing the substrate from the modulator.
摘要翻译：由两个制造的半导体器件形成集成半导体器件，每个半导体器件通过将所制造的半导体器件中的一个的导体连接到另一个制造的半导体器件的导体而在一个半导体器件的衬底上放置抗蚀剂而具有衬底使未固化的水泥（例如环氧树脂）在抗蚀剂和另一个基底之间流动，从而允许水泥固化，并从半导体器件中的一个去除衬底。更具体地说，混合半导体器件由GaAs / AlGaAs多量子阱调制器形成，该GaAs / AlGaAs多量子阱调制器具有衬底和具有衬底的IC芯片，通过在调制器衬底上放置蚀刻抗蚀剂，将调制器的导体与芯片的导体在调制器和芯片之间吸收未固化的环氧树脂，允许环氧树脂固化，并从调制器中除去衬底。

2. 发明授权

US6048751A Process for manufacture of composite semiconductor devices 失效
标题翻译：复合半导体器件制造工艺
公开(公告)号：US6048751A
公开(公告)日：2000-04-11
申请号：US572275
申请日：1995-12-13
申请人： Lucian Arthur D'Asaro , Keith Wayne Goossen , Sanghee Park Hui , Betty J. Tseng , James Albert Walker
发明人： Lucian Arthur D'Asaro , Keith Wayne Goossen , Sanghee Park Hui , Betty J. Tseng , James Albert Walker
IPC分类号： H01L25/16 , H01L31/12 , H01L21/54 , H01L21/58 , H01L21/60
CPC分类号： H01L25/167 , H01L31/125 , H01L2221/68359 , H01L2221/68363 , H01L2224/16225 , H01L2924/00014 , H01L2924/10253
摘要： An integrated semiconductor device is formed from two fabricated semiconductor devices each having a substrate by placing an etch-resist on the substrate of the one semiconductor device, by bonding the conductors of one of the fabricated semiconductor devices to the conductors of the other fabricated semiconductor device, flowing an uncured cement (e.g. epoxy) between the etch-resist and the other substrate, allowing the cement to solidify, and removing the substrate from the one of the semiconductor devices. More specifically, a hybrid semiconductor device is formed from a GaAs/AlGaAs multiple quantum well modulator having a substrate and an IC chip having a substrate by placing an etch resist on the modulator substrate, bonding the conductors of the modulator to the conductors of the chip, wicking an uncured epoxy between the modulators and the chip, allowing the epoxy to cure, and removing the substrate from the modulator.
摘要翻译：由两个制造的半导体器件形成集成半导体器件，每个半导体器件通过将所制造的半导体器件中的一个的导体连接到另一个制造的半导体器件的导体而在一个半导体器件的衬底上放置抗蚀剂而具有衬底使未固化的水泥（例如环氧树脂）在抗蚀剂和另一个基底之间流动，从而允许水泥固化，并从半导体器件中的一个去除衬底。更具体地说，混合半导体器件由GaAs / AlGaAs多量子阱调制器形成，该GaAs / AlGaAs多量子阱调制器具有衬底和具有衬底的IC芯片，通过在调制器衬底上放置蚀刻抗蚀剂，将调制器的导体与芯片的导体在调制器和芯片之间吸收未固化的环氧树脂，允许环氧树脂固化，并从调制器中除去衬底。

3. 发明授权

US5918794A Solder bonding of dense arrays of microminiature contact pads 失效
标题翻译：微型接触垫密集阵列的焊接
公开(公告)号：US5918794A
公开(公告)日：1999-07-06
申请号：US581299
申请日：1995-12-28
申请人： Lucian Arthur D'Asaro , Keith Wayne Goossen , Sanghee Park Hui , Betty Jyue Tseng , James Albert Walker
发明人： Lucian Arthur D'Asaro , Keith Wayne Goossen , Sanghee Park Hui , Betty Jyue Tseng , James Albert Walker
IPC分类号： B23K20/00 , B23K20/08 , B23K35/14 , H01L21/60 , H01L21/603 , H01L23/485 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/34 , B23K1/19
CPC分类号： H01L24/10 , B23K20/085 , H01L24/02 , H01L24/13 , B23K2201/40 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/19042
摘要： Each microminiature contact pad included in a dense array of pads on an electronic component contains a relatively thick layer of solder. The layer is treated to form a relatively thin brittle protective layer on the surface of the solder. The structure is then brought into contact with a contact pad in a mating array of pads on another component in a thermo-compression bonding step carried out below the melting point of the solder. In that step, the brittle layer is fractured. As a result, solid-state diffusion of conductive material occurs through fissures in the fractured layer, thereby to provide an electrical connection between mating pads on the two components.
摘要翻译：包含在电子部件上的密集的焊盘阵列中的每个微型接触焊盘包含相对厚的焊料层。处理该层以在焊料的表面上形成相对薄的脆性保护层。然后将该结构与在焊料的熔点之下进行的热压接步骤中在另一部件上的焊盘的配合阵列中的接触焊盘接触。在该步骤中，脆性层断裂。结果，导电材料的固态扩散通过断裂层中的裂缝发生，从而在两个部件上的匹配焊盘之间提供电连接。

4. 发明授权

US5996221A Method for thermocompression bonding structures 失效
标题翻译：热压接结构方法
公开(公告)号：US5996221A
公开(公告)日：1999-12-07
申请号：US766215
申请日：1996-12-12
申请人： Leo Maria Freishyn Chirovsky , John Edward Cunningham , Lucian Arthur D'Asaro , Keith Wayne Goossen
发明人： Leo Maria Freishyn Chirovsky , John Edward Cunningham , Lucian Arthur D'Asaro , Keith Wayne Goossen
IPC分类号： H01L21/60 , G02B6/42 , H01L21/603 , H01L21/607 , H01L25/16 , H01L33/00 , H05K3/32
CPC分类号： G02B6/4236 , H01L24/81 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/10336 , H01L2924/1204 , H01L2924/14 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178
摘要： A method for thermocompression bonding structures together including structures having different coefficients of thermal expansion, for example, thermocompression bonding optical diode arrays or other semiconductor structures to silicon substrates to form electronic or optoelectronic devices. The method includes aligning and contacting the structures to be interconnected, thermocompressing the structures via their contact pad elements at a bonding temperature, establishing an encapsulation temperature, applying an encapsulant material between the bonded structures, and curing the encapsulant material at the encapsulation temperature. Conventional bonding processes, which treat encapsulation as a separate step apart from bonding processes, melt the bonded assembly together and include at least one thermal cycle in which the bonded assembly is cooled to room temperature and then is re-heated to the encapsulation temperature before applying the encapsulant material. The inventive method eliminates this thermal cycle by including encapsulation as an integral step in the thermocompression bonding process and therefore reduces or eliminates the possibility of damage to bonds or their multi-layered contact elements between the time of bonding and the time of encapsulation. Resultingly, the inventive method advantageously improves the quality and reliability of the resulting bonds within the formed device compared to bonds formed in a conventional manner.
摘要翻译：一起将热膨胀系数不同的结构例如热压接光二极管阵列或其他半导体结构热压接合结构的方法，以形成电子或光电器件。该方法包括对准和接触要互连的结构，在接合温度下通过其接触垫元件热压结构，建立封装温度，在结合的结构之间施加密封剂材料，以及在封装温度下固化密封剂材料。常规的粘合方法将封装作为离开粘结工艺的独立步骤进行处理，将结合的组件熔化在一起并且包括至少一个热循环，其中粘合组件被冷却至室温，然后在施加之前再加热至包封温度密封材料。本发明的方法通过将封装作为热压接合工艺中的一个整体步骤来消除该热循环，并因此降低或消除了在键合时间和封装时间之间对键或其多层接触元件的损坏的可能性。因此，与以常规方式形成的键相比，本发明的方法有利地提高了所形成的装置内所得结合物的质量和可靠性。

5. 发明授权

US06222206B1 Wafer having top and bottom emitting vertical-cavity lasers 失效
标题翻译：具有顶部和底部发射垂直腔激光器的晶片
公开(公告)号：US06222206B1
公开(公告)日：2001-04-24
申请号：US09105573
申请日：1998-06-25
申请人： Leo Maria Chirovsky , John Edward Cunningham , Keith Wayne Goossen , Sanghee Park Hui , Betty Jyue Tseng
发明人： Leo Maria Chirovsky , John Edward Cunningham , Keith Wayne Goossen , Sanghee Park Hui , Betty Jyue Tseng
IPC分类号： H01L3300
CPC分类号： H01S5/18305 , H01L27/156 , H01S5/0201 , H01S5/0224 , H01S5/0422 , H01S5/18311 , H01S5/18341 , H01S5/18361 , H01S5/18372 , H01S5/18375 , H01S5/18377
摘要： A technique is described for determining the performance of substrate-side emitting VCSELs formed on a wafer. The technique involves forming top-emitting VCSELs on the same wafer as bottom-emitting VCSELs and then testing the top-emitting VCSELs and using the results to determine the performance of the bottom-emitting VCSELs of the wafer.
摘要翻译：描述了一种用于确定在晶片上形成的衬底侧发射VCSEL的性能的技术。该技术涉及在与底部发射VCSEL相同的晶片上形成顶部发射VCSEL，然后测试顶部发射VCSEL并使用结果来确定晶片的底部发射VCSEL的性能。

6. 发明授权

US06485996B2 Method of making wafer having top and bottom emitting vertical-cavity lasers 有权
标题翻译：制造具有顶部和底部发射垂直腔激光器的晶片的方法
公开(公告)号：US06485996B2
公开(公告)日：2002-11-26
申请号：US09769024
申请日：2001-01-25
申请人： Leo Maria Chirovsky , John Edward Cunningham , Keith Wayne Goossen , Sanghee Park Hui , Betty Jyue Tseng
发明人： Leo Maria Chirovsky , John Edward Cunningham , Keith Wayne Goossen , Sanghee Park Hui , Betty Jyue Tseng
IPC分类号： H01L2715
CPC分类号： H01S5/18305 , H01L27/156 , H01S5/0201 , H01S5/0224 , H01S5/0422 , H01S5/18311 , H01S5/18341 , H01S5/18361 , H01S5/18372 , H01S5/18375 , H01S5/18377
摘要： A technique is described for determining the performance of substrate-side emitting VCSELs formed on a wafer. The technique involves forming top-emitting VCSELs on the same wafer as bottom-emitting VCSELs and then testing the top-emitting VCSELs and using the results to determine the performance of the bottom-emitting VCSELs of the wafer.
摘要翻译：描述了一种用于确定在晶片上形成的衬底侧发射VCSEL的性能的技术。该技术涉及在与底部发射VCSEL相同的晶片上形成顶部发射VCSEL，然后测试顶部发射VCSEL并使用结果来确定晶片的底部发射VCSEL的性能。

7. 发明授权

US06631246B2 Wavelength division multiplexed optical communication system having tunable multi-channel dispersion compensating filters 有权
标题翻译：具有可调谐多通道色散补偿滤波器的波分复用光通信系统
公开(公告)号：US06631246B2
公开(公告)日：2003-10-07
申请号：US09332677
申请日：1999-06-14
申请人： Joseph Earl Ford , Keith Wayne Goossen , Christi Kay Madsen , James Albert Walker
发明人： Joseph Earl Ford , Keith Wayne Goossen , Christi Kay Madsen , James Albert Walker
IPC分类号： G02B626
CPC分类号： G02B6/29374 , G02B6/29358 , G02B6/29394 , G02B6/29395 , H04B10/25133
摘要： In accordance with the invention, a WDM optical communication system includes a new tunable multi-channel dispersion compensating filter having low loss, low polarization dependence and capable of compensating many channels over a large wavelength range. In essence, the filter comprises an optical cavity with a near 100% reflector on one side and a variable partial reflector on the other side. The device acts as a tunable all-pass filter.
摘要翻译：根据本发明，WDM光通信系统包括具有低损耗，低偏振依赖性并且能够在大波长范围内补偿多个信道的新的可调谐多通道色散补偿滤波器。本质上，滤光器包括一个光学腔，一侧具有接近100％的反射器，另一侧具有可变部分反射器。该器件充当可调谐全通滤波器。

8. 发明授权

US5786925A Method and composition for arbitrary angle mirrors in substrates for use in hybrid optical systems 失效
标题翻译：用于混合光学系统的基板中的任意角度镜的方法和组成
公开(公告)号：US5786925A
公开(公告)日：1998-07-28
申请号：US650582
申请日：1996-05-20
申请人： Keith Wayne Goossen , James Albert Walker
发明人： Keith Wayne Goossen , James Albert Walker
IPC分类号： H01L27/15 , G02B6/12 , G02B6/122 , G02B6/42 , H01S5/00 , G02F1/025 , G02B6/26 , G02F1/035 , G02F1/295
CPC分类号： G02B6/4214 , G02B6/122 , G02B2006/12104
摘要： A method for forming, and an arrangement for using arbitrary angle mirrors in substrates is disclosed. An erodible material, such as a photoresist, is applied to a substrate at a site and is exposed to radiation at that site which has a linear variation in energy at the surface of the erodible material. Due to this variation in exposure energy, a taper results in the erodible material after development. The tapered region is then etched in a manner which etches both the erodible layer and the underlying substrate. The taper in the erodible layer provides a varying attenuation during the etching process such that the taper of the erodible layer, or a multiple of it, is transferred to the substrate. In a first embodiment, a tapered reflective surface is formed in a substrate, which surface engages an optical signal and deflects it to an optical device or another surface. In a second embodiment, two tapered reflective surfaces are formed in a substrate and oriented to deflect incident light to a modulation device. In a third embodiment, an arrangement for modulating a light signal is formed by two tapered reflective surfaces. The surfaces are oriented to form a vee groove in a substrate and are coated with an active semiconductor device.
摘要翻译：公开了一种用于在衬底中使用任意角度镜的形成方法和布置。将一种可蚀刻材料，例如光致抗蚀剂施加到位于基底的位置，并暴露于该位置处的辐射，其在可侵蚀材料的表面处具有线性的能量变化。由于暴露能量的这种变化，锥形导致显影后的可侵蚀材料。然后以蚀刻两个可侵蚀层和下面的衬底的方式蚀刻该锥形区域。可蚀化层中的锥度在蚀刻工艺期间提供变化的衰减，使得可侵蚀层的锥度或其多次被转移到衬底。在第一实施例中，锥形反射表面形成在衬底中，该表面接合光信号并将其偏转到光学器件或另一表面。在第二实施例中，两个锥形反射表面形成在基板中并且被定向成将入射光偏转到调制装置。在第三实施例中，用于调制光信号的装置由两个锥形反射表面形成。这些表面被定向成在基底中形成一个vee凹槽并涂覆有一个有源半导体器件。

9. 发明授权

US5654819A Micromechanical modulator 失效
标题翻译：微机械调制器
公开(公告)号：US5654819A
公开(公告)日：1997-08-05
申请号：US478590
申请日：1995-06-07
申请人： Keith Wayne Goossen , James Albert Walker
发明人： Keith Wayne Goossen , James Albert Walker
IPC分类号： G02B26/00 , G02B26/02
CPC分类号： G02B26/02 , G02B26/001
摘要： A method and apparatus for modulating an optical signal, and a method for fabricating such an apparatus, are disclosed. The modulator comprises a membrane, which consists of at least three layers, and a substrate, spaced to form an air gap. The layers of the membrane are characterized by a relationship between the refractive indices of the layers and the refractive index of the substrate. The membrane is suspended in a first position over the substrate by a flexible support arrangement. A biasing force is applied to the membrane and the substrate to create an electrostatic force to move the membrane towards the substrate to a second position. The reflectivity of the device to an optical signal changes as the membrane moves from the first position to the second position, thereby modulating the signal.
摘要翻译：公开了一种用于调制光信号的方法和装置及其制造方法。调制器包括由至少三层组成的膜和间隔开以形成气隙的衬底。膜的层的特征在于层的折射率和基板的折射率之间的关系。膜通过柔性支撑装置悬挂在衬底上的第一位置。偏压力施加到膜和基底上以产生静电力，以将膜朝向衬底移动到第二位置。当膜从第一位置移动到第二位置时，器件对光学信号的反射率改变，从而调制信号。

10. 发明授权

US07180652B2 Mars optical modulators 有权
标题翻译：火星光学调制器
公开(公告)号：US07180652B2
公开(公告)日：2007-02-20
申请号：US11060870
申请日：2005-02-18
申请人： David John Bishop , Keith Wayne Goossen , Dennis S. Greywall , James Albert Walker
发明人： David John Bishop , Keith Wayne Goossen , Dennis S. Greywall , James Albert Walker
IPC分类号： G02B26/00
CPC分类号： G02B26/0825
摘要： The specification describes an improved Moving Anti-Reflection Switch (MARS) device structure that largely eliminates charge build up on the movable membrane, and reduces stresses that cause curling of the membrane. The improved device uses a movable membrane made of single crystal silicon.
摘要翻译：该规范描述了改进的移动防反射开关（MARS）器件结构，其大大消除了可移动膜上的电荷积累，并且减少了引起膜卷曲的应力。改进的装置使用由单晶硅制成的可移动膜。

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