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    • 4. 发明申请
    • Method of programming a monolithic three-dimensional memory
    • 编写单片三维存储器的方法
    • US20060067127A1
    • 2006-03-30
    • US10955049
    • 2004-09-30
    • Luca FasoliRoy ScheuerleinAlper IlkbaharEn-Hsing ChenTanmay Kumar
    • Luca FasoliRoy ScheuerleinAlper IlkbaharEn-Hsing ChenTanmay Kumar
    • G11C11/34G11C16/04
    • G11C16/12G11C16/16
    • A method of programming a monolithic three-dimensional (3-D) memory having a plurality of levels of memory cells above a silicon substrate is disclosed. The method includes initializing a program voltage and program time interval; selecting a memory cell to be programmed within the three-dimensional memory having the plurality of levels of memory cells; applying a pulse having the program voltage and the program time interval to the selected memory cell; performing a read after write operation with respect to the selected memory cell to determine a measured threshold voltage value; and comparing the measured threshold voltage value to a minimum program voltage. In response to the comparison between the measured threshold voltage value and the minimum program voltage, the method further includes selectively applying at least one subsequent program pulse to the selected memory cell.
    • 公开了一种在硅衬底上编程具有多层存储单元的单片三维(3-D)存储器的方法。 该方法包括初始化程序电压和程序时间间隔; 选择要在具有多个级别的存储器单元的三维存储器内编程的存储器单元; 将具有编程电压和程序时间间隔的脉冲施加到所选存储单元; 在对所选择的存储单元进行写操作之后执行读取以确定测量的阈值电压值; 以及将所测量的阈值电压值与最小编程电压进行比较。 响应于测量的阈值电压值和最小编程电压之间的比较,该方法还包括选择性地将至少一个后续编程脉冲施加到所选存储单元。
    • 6. 发明申请
    • THREE-DIMENSIONAL MEMORY DEVICE INCORPORATING SEGMENTED ARRAY LINE MEMORY ARRAY
    • 配有SEGMENTED阵列线记忆阵列的三维存储器件
    • US20070263423A1
    • 2007-11-15
    • US11764789
    • 2007-06-18
    • Roy ScheuerleinAlper IlkbaharLuca Fasoli
    • Roy ScheuerleinAlper IlkbaharLuca Fasoli
    • G11C5/06
    • G11C7/18G11C16/0416G11C16/0466G11C17/12G11C17/18G11C2213/71G11C2213/77Y10S257/91
    • A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments to global bit lines. The segment switch devices reside on one or more layers of the integrated circuit, preferably residing on each bit line layer. The global bit lines reside preferably on one layer below the memory array, but may reside on more than one layer. The bit line segments preferably share vertical connections to an associated global bit line. In certain EEPROM embodiments, the array includes multiple layers of segmented bit lines with segment connection switches on multiple layers and shared vertical connections to a global bit line layer. Such memory arrays may be realized with much less write-disturb effects for half selected memory cells, and may be realized with a much smaller block of cells to be erased.
    • 三维(3D)高密度存储器阵列包括多个分段位线(即感测线),其中存储器阵列内的段切换器件将段连接到全局位线。 分段交换设备驻留在集成电路的一个或多个层上,优选地驻留在每个位线层上。 全局位线优选地位于存储器阵列下方的一个层上,但可驻留在多于一个层上。 位线段优选地共享到相关联的全局位线的垂直连接。 在某些EEPROM实施例中,该阵列包括多层分段位线,其中多层具有段连接开关,并且共享与全局位线层的垂直连接。 这样的存储器阵列可以通过对于半选择的存储器单元的更少的写入干扰效应来实现,并且可以用要被擦除的小得多的单元块来实现。
    • 10. 发明申请
    • THREE-DIMENSIONAL MEMORY DEVICE INCORPORATING SEGMENTED ARRAY LINE MEMORY ARRAY
    • 配有SEGMENTED阵列线记忆阵列的三维存储器件
    • US20120106253A1
    • 2012-05-03
    • US13348336
    • 2012-01-11
    • Roy E. ScheuerleinAlper IlkbaharLuca Fasoli
    • Roy E. ScheuerleinAlper IlkbaharLuca Fasoli
    • G11C5/06G11C16/04
    • G11C7/18G11C16/0416G11C16/0466G11C17/12G11C17/18G11C2213/71G11C2213/77Y10S257/91
    • A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments to global bit lines. The segment switch devices reside on one or more layers of the integrated circuit, preferably residing on each bit line layer. The global bit lines reside preferably on one layer below the memory array, but may reside on more than one layer. The bit line segments preferably share vertical connections to an associated global bit line. In certain EEPROM embodiments, the array includes multiple layers of segmented bit lines with segment connection switches on multiple layers and shared vertical connections to a global bit line layer. Such memory arrays may be realized with much less write-disturb effects for half selected memory cells, and may be realized with a much smaller block of cells to be erased.
    • 三维(3D)高密度存储器阵列包括多个分段位线(即感测线),其中存储器阵列内的段切换器件将段连接到全局位线。 分段交换设备驻留在集成电路的一个或多个层上,优选地驻留在每个位线层上。 全局位线优选地位于存储器阵列下方的一个层上,但可驻留在多于一个层上。 位线段优选地共享到相关联的全局位线的垂直连接。 在某些EEPROM实施例中,该阵列包括多层分段位线,其中多层具有段连接开关,并且共享与全局位线层的垂直连接。 这样的存储器阵列可以通过对于半选择的存储器单元的更少的写入干扰效应来实现,并且可以用要被擦除的小得多的单元块来实现。