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1. 发明授权

US06751151B2 Ultra high-speed DDP-SRAM cache 有权
标题翻译：超高速DDP-SRAM缓存
公开(公告)号：US06751151B2
公开(公告)日：2004-06-15
申请号：US09827073
申请日：2001-04-05
申请人： Louis L. Hsu , Toshiaki K. Kirihata , Li-Kong Wang , Robert C. Wong
发明人： Louis L. Hsu , Toshiaki K. Kirihata , Li-Kong Wang , Robert C. Wong
IPC分类号： G11C800
CPC分类号： G06F12/0853 , G11C8/16 , H01L27/1104
摘要： An ultra high-speed DDP-SRAM (Dual Dual-Port Static Random Access Memory) cache having a cache speed in approximately the GHz range. This is accomplished by (1) a specially designed dual-port SRAM whose size is slightly larger than that of a conventional single port SRAM, and (2) the use of a dual dual-port SRAM architecture which doubles its speed by interleaved read and write operations. A first embodiment provides a 6-T (transistor) all nMOS dual-port SRAM cell. A second embodiment provides a dual port 7T-SRAM cell which has only one port for write, and both ports for read.
摘要翻译：具有大约GHz范围内的高速缓存的超高速DDP-SRAM（双重双端口静态随机存取存储器）缓存。这通过（1）专门设计的双端口SRAM（其尺寸略大于常规单端口SRAM）的实现来实现，以及（2）使用双重双端口SRAM架构，其通过交错读取将其速度加倍，写操作。第一实施例提供了6T（晶体管）全部nMOS双端口SRAM单元。第二实施例提供了一个双端口7T-SRAM单元，其仅具有一个用于写入的端口，以及用于读取的两个端口。

2. 发明授权

US06512683B2 System and method for increasing the speed of memories 有权
标题翻译：提高记忆速度的系统和方法
公开(公告)号：US06512683B2
公开(公告)日：2003-01-28
申请号：US09827071
申请日：2001-04-05
申请人： Louis L. Hsu , Li-Kong Wang , Toshiaki K. Kirihata
发明人： Louis L. Hsu , Li-Kong Wang , Toshiaki K. Kirihata
IPC分类号： G11C1500
CPC分类号： G06F12/0895 , G06F12/0846 , G11C7/1042
摘要： The speed of memories is increased by trading memory density (or area) for speed (or cycle time). An n by n memory array is used to reduce the memory cycle time by 1/n. For example, if an existing memory cycle time is 6 ns, in order to achieve a 3ns (or n=2) cycle time, a 2 by 2 memory array is used. Or, in order to achieve a 1ns cycle time (or n=6), then a 6 by 6 memory array is used.
摘要翻译：通过为速度（或循环时间）交易记忆密度（或面积）来提高记忆速度。 n n存储器阵列用于将存储器周期时间减少1 / n。例如，如果现有存储器周期时间为6ns，为了实现3ns（或n = 2）周期时间，则使用2乘2存储器阵列。或者，为了实现1ns周期时间（或n = 6），则使用6乘6存储器阵列。

3. 发明授权

US06542973B2 Integrated redundancy architecture system for an embedded DRAM 有权
标题翻译：嵌入式DRAM的集成冗余架构系统
公开(公告)号：US06542973B2
公开(公告)日：2003-04-01
申请号：US09898434
申请日：2001-07-03
申请人： Louis L. Hsu , Li-Kong Wang , Toshiaki K. Kirihata , Gregory J. Fredeman
发明人： Louis L. Hsu , Li-Kong Wang , Toshiaki K. Kirihata , Gregory J. Fredeman
IPC分类号： G06F1200
CPC分类号： G11C29/846 , G06F12/0893
摘要： An integrated redundancy eDRAM architecture system for an embedded DRAM macro system having a wide data bandwidth and wide internal bus width is disclosed which provides column and row redundancy for defective columns and rows of the eDRAM macro system. Internally generated column and row addresses of defective columns and rows of each micro-cell block are stored in a memory device, such as a fuse bank, during an eDRAM macro test mode in order for the information to be quickly retrieved during each cycle of eDRAM operation to provide an SRAM-like operation. A column steering circuit steers column redundant elements to replace defective column elements. Redundancy information is either supplied from a SRAM fuse data storage device or from a TAG memory device depending on whether a read or write operation, respectively, is being performed. The integrated redundancy eDRAM architecture system enables data to be sent and received to and from the eDRAM macro system without adding any extra delay to the data flow, thereby protecting data flow pattern integrity.
摘要翻译：公开了一种用于具有宽数据带宽和宽内部总线宽度的嵌入式DRAM宏系统的集成冗余eDRAM架构系统，其为eDRAM宏系统的有缺陷的列和行提供列和行冗余。在eDRAM宏测试模式期间，每个微小区块的有缺陷的列和行的内部生成的列和行地址存储在诸如保险丝库的存储器件中，以便在eDRAM的每个周期期间快速检索信息操作提供类似SRAM的操作。列转向电路引导列冗余元件来替换有缺陷的列元素。根据是否正在执行读取或写入操作，冗余信息是从SRAM熔丝数据存储设备提供的，或者从TAG存储设备提供的。集成冗余eDRAM架构系统使数据能够从eDRAM宏系统发送和接收数据，而不会对数据流增加任何额外的延迟，从而保护数据流模式的完整性。

4. 发明授权

US06751152B2 Method and configuration to allow a lower wordline boosted voltage operation while increasing a sensing signal with access transistor threshold voltage 失效
标题翻译：方法和配置允许在增加具有存取晶体管阈值电压的感测信号的同时降低字线升压电压操作
公开(公告)号：US06751152B2
公开(公告)日：2004-06-15
申请号：US09999379
申请日：2001-10-31
申请人： Louis L. Hsu , Toshiaki K. Kirihata , Daniel W. Storaska
发明人： Louis L. Hsu , Toshiaki K. Kirihata , Daniel W. Storaska
IPC分类号： G11C800
CPC分类号： G11C11/4085 , G11C7/065 , G11C11/4091
摘要： A memory array architecture employs a full Vdd bitline precharged voltage and a low wordline boost voltage, which is less than Vdd plus the threshold voltage of the access transistor. In a write mode, a first low level of a data bit is almost fully written to a storage element, however a second high level of the data bit is not fully written to the storage element. In a read mode, the first low level of the data bit is fully read out from the storage element, however the second high level of the data bit is not read out by utilizing the access transistor threshold voltage. This allows a sensing signal only with the first voltage level transfer to the Vdd precharged BL. A reference WL is preferably used for generating a reference bitline voltage for a differential Vdd sensing scheme. Alternatively, a single BL digital sensing scheme may be used. Lowering the wordline voltage results in a reduction in power consumption by saving power on Vpp generator and support circuits, and a reduction in the size of the Vpp generator and support circuits, and also eliminates high Vpp voltage related problems such as dielectric breakdown and other reliability concerns while avoiding a complex decoding scheme and saving cost.
摘要翻译：存储器阵列架构采用全Vdd位线预充电电压和低字线升压电压，其小于Vdd加上存取晶体管的阈值电压。在写入模式中，数据位的第一低电平几乎完全写入存储元件，然而数据位的第二高电平未完全写入存储元件。在读取模式下，数据位的第一低电平从存储元件完全读出，然而数据位的第二高电平不通过利用存取晶体管阈值电压被读出。这允许感测信号仅在第一电压电平传输到Vdd预充电BL。参考WL优选地用于产生用于差分Vdd感测方案的参考位线电压。或者，可以使用单个BL数字感测方案。降低字线电压通过节省Vpp发生器和支持电路上的功率以及减小Vpp发生器和支持电路的尺寸而降低功耗，并且消除了与Vpp电压相关的高电压问题，例如介质击穿和其他可靠性同时避免复杂的解码方案并节省成本。

5. 发明授权

US06426914B1 Floating wordline using a dynamic row decoder and bitline VDD precharge 有权
标题翻译：浮动字线使用动态行解码器和位线VDD预充电
公开(公告)号：US06426914B1
公开(公告)日：2002-07-30
申请号：US09839105
申请日：2001-04-20
申请人： Robert H. Dennard , Louis L. Hsu , Toshiaki K. Kirihata
发明人： Robert H. Dennard , Louis L. Hsu , Toshiaki K. Kirihata
IPC分类号： G11C800
CPC分类号： G11C8/08 , G11C7/22 , G11C8/10 , G11C11/4076 , G11C11/4085 , G11C11/4087
摘要： A short cycle DRAM use a floating wordline, dynamic row decoder and bitline VDD precharge, which improves the array efficiency of the short cycle DRAM (3-6 ns) without compromising its performance. A small size wordline driver circuit is provided to reduce the row size of the short cycle DRAM without compromising row access timing. A dynamic decoding operation is implemented which intentionally allows some of the deselected wordlines to float during row access. A Vdd bitline precharge/sensing technique avoids a detrimental (or positive) coupling effect to the floating wordlines during row accessing. A Vdd data-line (or DQ) precharge for a read operation, and control of incoming data timing avoids a detrimental (or positive) coupling effect for a write operation.
摘要翻译：短周期DRAM使用浮动字线，动态行解码器和位线VDD预充电，这提高了短周期DRAM（3-6ns）的阵列效率，而不损害其性能。提供了一种小尺寸字线驱动器电路，以减少短周期DRAM的行大小，而不会影响行访问时序。实现动态解码操作，其有意地允许一些未选择的字线在行访问期间浮动。 Vdd位线预充电/感测技术在行访问期间避免了对浮动字线的有害（或正）耦合效应。用于读取操作的Vdd数据线（或DQ）预充电以及输入数据时序的控制避免了写入操作的有害（或正）耦合效应。

6. 发明授权

US07057866B2 System and method for disconnecting a portion of an integrated circuit 失效
公开(公告)号：US07057866B2
公开(公告)日：2006-06-06
申请号：US09929591
申请日：2001-08-14
申请人： Louis L. Hsu , Rajiv V. Joshi , Chorng-Lii Hwang , Toshiaki K. Kirihata , Paul C. Parries
发明人： Louis L. Hsu , Rajiv V. Joshi , Chorng-Lii Hwang , Toshiaki K. Kirihata , Paul C. Parries
IPC分类号： G11C8/00
CPC分类号： G11C5/14 , G11C5/147
摘要： An integrated circuit system having a plurality of macros is provided. The integrated circuit system includes an external voltage supply input configured for supplying an external voltage to the integrated circuit; and a plurality of internal voltage supply generators, each of the plurality of internal voltage supply generators being connected to a respective macro of the plurality of macros and configured for receiving the external voltage via the external voltage supply input for generating an internal voltage supply for operating its respective macro. Each of the plurality of internal voltage supply generators includes circuitry for generating the internal voltage supply and circuitry for disconnecting at least a portion of its respective macro. The integrated circuit system can be applied to a semiconductor chip to save active or stand-by power. It can also be used to disconnect a defective portion of the chip and optionally replace it with a non-defective portion of the chip.

7. 发明授权

US07052937B2 Method and structure for providing improved thermal conduction for silicon semiconductor devices 失效
公开(公告)号：US07052937B2
公开(公告)日：2006-05-30
申请号：US10429758
申请日：2003-05-05
申请人： Lawrence A. Clevenger , Louis L. Hsu , Li-Kong Wang , Tsorng-Dih Yuan
发明人： Lawrence A. Clevenger , Louis L. Hsu , Li-Kong Wang , Tsorng-Dih Yuan
IPC分类号： H01L21/44
CPC分类号： H01L21/76264 , H01L21/76283 , H01L23/3677 , H01L23/3732 , H01L27/1203 , H01L2924/0002 , H01L2924/00
摘要： Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of thermal paths, formed after shallow trench and device fabrication steps are completed, which extend through the buried oxide and provide heat dissipation through to the underlying bulk silicon substrate. The thermal conduction path material is preferably diamond which has high thermal conductivity with low electrical conductivity. A second diamond trench cooling structure, formed after device fabrication has been completed, comprises diamond shallow trenches disposed between the devices and extending through the buried oxide layer. An alternative diamond thermal cooling structure includes a diamond insulation layer deposited over the semiconductor devices in either an SOI or bulk silicon structure. Yet another embodiment comprises diamond sidewalls formed along the device walls in thermal contact with the device junctions to provide heat dissipation through the device junctions to underlying cooling structures. It is also proposed that the foregoing structures, and combinations of the foregoing structures, could be used in conjunction with other known cooling schemes.

8. 发明授权

US07029956B2 Memory system capable of operating at high temperatures and method for fabricating the same 失效
公开(公告)号：US07029956B2
公开(公告)日：2006-04-18
申请号：US10666972
申请日：2003-09-19
申请人： Louis L. Hsu , Li-Kong Wang
发明人： Louis L. Hsu , Li-Kong Wang
IPC分类号： H01L21/332
CPC分类号： H01L27/1027 , H01L21/8213 , H01L27/0605 , Y10S438/931
摘要： A memory system having a plurality of T-RAM cells arranged in an array is presented where each T-RAM cell has dual vertical devices and is fabricated over a SiC substrate. Each T-RAM cell has a vertical thyristor and a vertical transfer gate. The top surface of each thyristor is coplanar with the top surface of each transfer gate within the T-RAM array to provide a planar cell structure for the T-RAM array. A method is also presented for fabricating the T-RAM array having the vertical thyristors, the vertical transfer gates and the planar cell structure over the SiC substrate.

9. 发明授权

US06911375B2 Method of fabricating silicon devices on sapphire with wafer bonding at low temperature 失效
标题翻译：在低温下用蓝宝石制造硅器件的方法
公开(公告)号：US06911375B2
公开(公告)日：2005-06-28
申请号：US10452715
申请日：2003-06-02
申请人： Kathryn W. Guarini , Louis L. Hsu , Leathen Shi , Dinkar V. Singh , Li-Kong Wang
发明人： Kathryn W. Guarini , Louis L. Hsu , Leathen Shi , Dinkar V. Singh , Li-Kong Wang
IPC分类号： H01L21/30 , H01L21/68 , H01L21/762
CPC分类号： H01L21/76256 , H01L21/6835 , H01L21/76254 , H01L2221/68368 , H01L2924/19041
摘要： Described is a method for making silicon on sapphire structures, and devices therefrom. The inventive method of forming integrated circuits on a sapphire substrate comprises the steps of providing a device layer on an oxide layer of a temporary substrate; bonding the device layer to a handling substrate; removing the temporary substrate to provide a structure containing the device layer between the oxide layer and the handling substrate; bonding a sapphire substrate to the oxide layer; removing the handling substrate from the structure; and annealing the final structure to provide a substrate comprising the oxide layer between the device layer and the sapphire substrate. The sapphire substrate may comprise bulk sapphire or may be a conventional substrate material with an uppermost sapphire layer.
摘要翻译：描述了在蓝宝石结构上制造硅的方法及其装置。在蓝宝石衬底上形成集成电路的本发明的方法包括以下步骤：在临时衬底的氧化物层上提供器件层; 将所述器件层接合到处理衬底; 去除所述临时衬底以提供在所述氧化物层和所述处理衬底之间包含所述器件层的结构; 将蓝宝石衬底结合到氧化物层; 从结构中去除处理基板; 并退火最终结构以提供包括在器件层和蓝宝石衬底之间的氧化物层的衬底。蓝宝石衬底可以包括散装蓝宝石，或者可以是具有最上层蓝宝石层的常规衬底材料。

10. 发明授权

US06781185B2 Semiconductor high dielectric constant decoupling capacitor structures and process for fabrication 有权
标题翻译：半导体高介电常数去耦电容器结构及其制造工艺
公开(公告)号：US06781185B2
公开(公告)日：2004-08-24
申请号：US10091193
申请日：2002-03-05
申请人： Howard Hao Chen , Louis L. Hsu , Li-Kong Wang
发明人： Howard Hao Chen , Louis L. Hsu , Li-Kong Wang
IPC分类号： H01L27108
CPC分类号： H01L28/91 , H01L23/5222 , H01L27/0805 , H01L28/55 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and method for providing high dielectric constant decoupling capacitors for semiconductor structures. The high dielectric constant decoupling capacitor can be fabricated by depositing high dielectric constant material between adjacent conductors on the same level, between conductors in successive levels, or both, to thereby provide very large capacitance value without any area or reliability penalty.
摘要翻译：用于为半导体结构提供高介电常数去耦电容器的装置和方法。高介电常数去耦电容器可以通过在相同电平上的相邻导体之间，连续电平的导体之间沉积高介电常数材料或两者来制造，从而提供非常大的电容值而没有任何面积或可靠性损失。

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