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1. 发明申请

US20080036084A1 Laser release process for very thin Si-carrier build 审中-公开
标题翻译：用于非常薄的Si载体构建的激光释放过程
公开(公告)号：US20080036084A1
公开(公告)日：2008-02-14
申请号：US11341458
申请日：2006-01-30
申请人： Leena Buchwalter , Paul Andry , Matthew Farinelli , Sherif Goma , Raymond Horton , Edmund Sprogis
发明人： Leena Buchwalter , Paul Andry , Matthew Farinelli , Sherif Goma , Raymond Horton , Edmund Sprogis
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L21/67092 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68354 , H01L2224/11003 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , Y10S414/139 , H01L2924/00 , H01L2224/0401
摘要： A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.
摘要翻译：提供了用于避免载波边缘破裂的集成电路模块的激光释放和玻璃切屑去除工艺。

2. 发明申请

US20070200572A1 Structure for coupling probes of probe device to corresponding electrical contacts on product substrate 有权
标题翻译：将探针装置的探头耦合到产品基板上的相应电触点的结构
公开(公告)号：US20070200572A1
公开(公告)日：2007-08-30
申请号：US11355726
申请日：2006-02-16
申请人： Ronald Breton , S. Chey , Steven Cordes , Matthew Farinelli , Michael Fregeau , Sherif Goma , Gene Patrick , Mohammed Shaikh
发明人： Ronald Breton , S. Chey , Steven Cordes , Matthew Farinelli , Michael Fregeau , Sherif Goma , Gene Patrick , Mohammed Shaikh
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R31/2863
摘要： An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate comprising a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.
摘要翻译：一种用于测试集成电路装置的装置包括具有多个探针的探针装置，第一基板包括具有第一表面的产品基板和设置在其第一表面上的电触点阵列，以及设置在探针和用于将探针电耦合到布置在产品基板的第一表面上的相应的电触点的第一基板。

3. 发明申请

US20080094085A1 Metalized Elastomeric Probe Structure 有权
标题翻译：金属弹性体探针结构
公开(公告)号：US20080094085A1
公开(公告)日：2008-04-24
申请号：US11718283
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： G01R1/073 , G01R31/26
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
摘要翻译：提供了一种用于电子设备的探针结构。一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。探针结构包括适于连接到测试装置的一个或多个其它接触结构。

4. 发明申请

US20080030209A1 INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME 失效
标题翻译：中间件结构及其制造方法
公开(公告)号：US20080030209A1
公开(公告)日：2008-02-07
申请号：US11741345
申请日：2007-04-27
申请人： Steven Cordes , Matthew Farinelli , Sherif Goma
发明人： Steven Cordes , Matthew Farinelli , Sherif Goma
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R3/00 , H05K3/06 , H05K3/4007 , H05K3/4038
摘要： Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described, Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 μm.
摘要翻译：描述了用于半导体工业的柔性和刚性插入件及其制造方法。自动催化方法用于最小化与柔性插入物的生产相关的成本，同时提高产量和寿命。电接触区域容易隔离，并且由于插入器的所有部分一次镀覆，因此腐蚀的风险降低。从插入件的柔性部分突出的引线可容纳更多种待测试的部件。刚性插入件包括从固定到基板的探针垫突出的销。针的刚度穿过待测接触垫上的氧化物。易于使用的半导体材料和工艺用于制造根据本发明的柔性和刚性插入件。柔性和刚性内插器可以容纳低至25毫米的音高。

5. 发明申请

US20070298626A1 Metalized Elastomeric Electrical Contacts 失效
标题翻译：金属化弹性电触点
公开(公告)号：US20070298626A1
公开(公告)日：2007-12-27
申请号：US11718279
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R13/24
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译：提供了用于形成增强的电连接的技术。一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。

6. 发明申请

US20060024861A1 Interposer structures and improved processes for use in probe technologies for semiconductor manufacturing 审中-公开
标题翻译：内插器结构和用于半导体制造探针技术的改进方法
公开(公告)号：US20060024861A1
公开(公告)日：2006-02-02
申请号：US10909111
申请日：2004-07-30
申请人： Steven Cordes , Matthew Farinelli , Sherif Goma
发明人： Steven Cordes , Matthew Farinelli , Sherif Goma
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： G01R3/00 , G01R1/0735 , H05K3/06 , H05K3/4007 , H05K3/4038
摘要： Systems and method for making flexible and rigid interposers for use in the semiconductor industry. Electroless plating processes are used to minimize the costs associated with the production of flexible interposers while increasing the yield and life-cycle of the interposers. Electrical contact regions are more easily isolated using the electroless processes and risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. The rigid interposers include a pin projecting from a probe pad affixed to a substrate. The pin is aligned with conductive vias in the underlying wafer. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches of as little as 25 μm.
摘要翻译：制造用于半导体行业的柔性和刚性插入件的系统和方法。使用化学镀处理来最小化与柔性插入物的生产相关的成本，同时增加插入物的产量和生命周期。使用无电解方法更容易隔离电接触区域，并且由于中间层的所有部分一次镀覆，因此腐蚀的风险降低。从插入件的柔性部分突出的引线可容纳更多种待测试的部件。刚性插入件包括从固定到基板的探针垫突出的销。引脚与底层晶片中的导电通孔对准。针的刚度穿过待测接触垫上的氧化物。易于使用的半导体材料和工艺用于制造根据本发明的柔性和刚性插入件。柔性和刚性插入件可以容纳少至25毫米的间距。

7. 发明申请

US20110290413A1 Laser Ablation of Adhesive for Integrated Circuit Fabrication 有权
标题翻译：激光烧蚀用于集成电路制造的粘合剂
公开(公告)号：US20110290413A1
公开(公告)日：2011-12-01
申请号：US12788839
申请日：2010-05-27
申请人： Bing Dang , Matthew Farinelli , John Knickerbocker , Aparna Prabhakar , Robert E. Trzcinski , Cornelia K. Tsang
发明人： Bing Dang , Matthew Farinelli , John Knickerbocker , Aparna Prabhakar , Robert E. Trzcinski , Cornelia K. Tsang
IPC分类号： B32B38/10 , B29C65/16
CPC分类号： H01L21/6835 , B23K26/0622 , B23K26/0823 , B23K26/361 , B23K26/57 , B23K2101/40 , B23K2103/42 , B23K2103/50 , C09J5/00 , C09J2203/326 , C09J2205/302 , C09J2400/22 , H01L2221/68381 , Y10T156/1158 , Y10T156/1917
摘要： A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.
摘要翻译：一种用于从晶片释放处理器的方法，所述晶片包括集成电路（IC），包括使用包含热固性聚合物的粘合剂将所述处理器附接到所述晶片，所述处理器包括在约193的波长范围内是透明的材料纳米（nm）至约400nm; 使用激光器通过处理器烧蚀粘合剂，其中基于处理材料的透明度选择激光的波长; 并将处理器与晶片分离。

8. 发明申请

US20070085625A1 Flexible capacitive coupler assembly and method of manufacture 有权
标题翻译：柔性电容耦合器组件及其制造方法
公开(公告)号：US20070085625A1
公开(公告)日：2007-04-19
申请号：US11390510
申请日：2006-03-27
申请人： Steven Cordes , Matthew Farinelli , Robert Garner , Winfried Wilcke
发明人： Steven Cordes , Matthew Farinelli , Robert Garner , Winfried Wilcke
IPC分类号： H01P5/02
CPC分类号： G06F1/18 , H01L23/48 , H01L25/105 , H01L2225/1005 , H01L2924/0002 , H01L2924/3011 , Y10S439/95 , H01L2924/00
摘要： A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem.
摘要翻译：柔性电容耦合器组件包括具有前表面和后表面的柔性介电衬底组件，前表面上具有宏观金属电容衬垫。封装支撑柔性电介质基片。进行电连接以在柔性电介质基板上封装布线或引线以与计算机子系统建立电接触。

9. 发明申请

US20060244138A1 Techniques for improving bond pad performance 审中-公开
公开(公告)号：US20060244138A1
公开(公告)日：2006-11-02
申请号：US11115936
申请日：2005-04-27
申请人： Frederic Beaulieu , Gobinda Das , Steven Duda , Matthew Farinelli , Adreanne Kelly , Samuel McKnight , William Murphy
发明人： Frederic Beaulieu , Gobinda Das , Steven Duda , Matthew Farinelli , Adreanne Kelly , Samuel McKnight , William Murphy
IPC分类号： H01L23/495
CPC分类号： H01L21/76886 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/035 , H01L2224/0362 , H01L2224/03848 , H01L2224/0391 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01064 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/00014
摘要： Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.

10. 发明授权

US08679280B2 Laser ablation of adhesive for integrated circuit fabrication 有权
标题翻译：用于集成电路制造的粘合剂的激光烧蚀
公开(公告)号：US08679280B2
公开(公告)日：2014-03-25
申请号：US12788839
申请日：2010-05-27
申请人： Bing Dang , Matthew Farinelli , John Knickerbocker , Aparna Prabhakar , Robert E. Trzcinski , Cornelia K. Tsang
发明人： Bing Dang , Matthew Farinelli , John Knickerbocker , Aparna Prabhakar , Robert E. Trzcinski , Cornelia K. Tsang
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , B23K26/0622 , B23K26/0823 , B23K26/361 , B23K26/57 , B23K2101/40 , B23K2103/42 , B23K2103/50 , C09J5/00 , C09J2203/326 , C09J2205/302 , C09J2400/22 , H01L2221/68381 , Y10T156/1158 , Y10T156/1917
摘要： A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.
摘要翻译：一种用于从晶片释放处理器的方法，所述晶片包括集成电路（IC），包括使用包含热固性聚合物的粘合剂将所述处理器附接到所述晶片，所述处理器包括在约193的波长范围内是透明的材料纳米（nm）至约400nm; 使用激光器通过处理器烧蚀粘合剂，其中基于处理材料的透明度选择激光的波长; 并将处理器与晶片分离。

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