专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07648369B2 Interposer with electrical contact button and method 失效
标题翻译：内插器与电气接触按钮和方法
公开(公告)号：US07648369B2
公开(公告)日：2010-01-19
申请号：US11561273
申请日：2006-11-17
申请人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, Jr.
发明人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, Jr.
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译：具有设置在载体中的一个或多个中空电触点按钮的插入器。中间层通过在载体的通孔中设置牺牲柱而形成。通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。

2. 发明申请

US20070087588A1 INTERPOSER WITH ELECTRICAL CONTACT BUTTON AND METHOD 失效
标题翻译：带电接点按钮和方法的插座
公开(公告)号：US20070087588A1
公开(公告)日：2007-04-19
申请号：US11561273
申请日：2006-11-17
申请人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
发明人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译：具有设置在载体中的一个或多个中空电触点按钮的插入器。中间层通过在载体的通孔中设置牺牲柱而形成。通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。

3. 发明申请

US20060009050A1 Interposer with electrical contact button and method 有权
公开(公告)号：US20060009050A1
公开(公告)日：2006-01-12
申请号：US11220324
申请日：2005-09-06
申请人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
发明人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.

4. 发明授权

US07823278B2 Method for fabricating electrical contact buttons 有权
标题翻译：电触点按钮的制造方法
公开(公告)号：US07823278B2
公开(公告)日：2010-11-02
申请号：US11220324
申请日：2005-09-06
申请人： Gareth G Hougham , Keith E Fogel , Joanna Rosner , Paul A Lauro , Sherif Goma , Joseph Zinter, Jr.
发明人： Gareth G Hougham , Keith E Fogel , Joanna Rosner , Paul A Lauro , Sherif Goma , Joseph Zinter, Jr.
IPC分类号： H05K3/02
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译：具有设置在载体中的一个或多个中空电触点按钮的插入器。中间层通过在载体的通孔中设置牺牲柱而形成。通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。

5. 发明申请

US20080036084A1 Laser release process for very thin Si-carrier build 审中-公开
标题翻译：用于非常薄的Si载体构建的激光释放过程
公开(公告)号：US20080036084A1
公开(公告)日：2008-02-14
申请号：US11341458
申请日：2006-01-30
申请人： Leena Buchwalter , Paul Andry , Matthew Farinelli , Sherif Goma , Raymond Horton , Edmund Sprogis
发明人： Leena Buchwalter , Paul Andry , Matthew Farinelli , Sherif Goma , Raymond Horton , Edmund Sprogis
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L21/67092 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68354 , H01L2224/11003 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , Y10S414/139 , H01L2924/00 , H01L2224/0401
摘要： A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.
摘要翻译：提供了用于避免载波边缘破裂的集成电路模块的激光释放和玻璃切屑去除工艺。

6. 发明申请

US20070200572A1 Structure for coupling probes of probe device to corresponding electrical contacts on product substrate 有权
标题翻译：将探针装置的探头耦合到产品基板上的相应电触点的结构
公开(公告)号：US20070200572A1
公开(公告)日：2007-08-30
申请号：US11355726
申请日：2006-02-16
申请人： Ronald Breton , S. Chey , Steven Cordes , Matthew Farinelli , Michael Fregeau , Sherif Goma , Gene Patrick , Mohammed Shaikh
发明人： Ronald Breton , S. Chey , Steven Cordes , Matthew Farinelli , Michael Fregeau , Sherif Goma , Gene Patrick , Mohammed Shaikh
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R31/2863
摘要： An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate comprising a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.
摘要翻译：一种用于测试集成电路装置的装置包括具有多个探针的探针装置，第一基板包括具有第一表面的产品基板和设置在其第一表面上的电触点阵列，以及设置在探针和用于将探针电耦合到布置在产品基板的第一表面上的相应的电触点的第一基板。

7. 发明申请

US20090044405A1 Interposer with Electrical Contact Button and Method 审中-公开
标题翻译：内插器与电触点按钮和方法
公开(公告)号：US20090044405A1
公开(公告)日：2009-02-19
申请号：US12032008
申请日：2008-02-15
申请人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, JR.
发明人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, JR.
IPC分类号： H01R9/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译：具有设置在载体中的一个或多个中空电触点按钮的插入器。中间层通过在载体的通孔中设置牺牲柱而形成。通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。

8. 发明申请

US20060027934A1 Silicon chip carrier with conductive through-vias and method for fabricating same 审中-公开
标题翻译：具有导电通孔的硅芯片载体及其制造方法
公开(公告)号：US20060027934A1
公开(公告)日：2006-02-09
申请号：US11242221
申请日：2005-10-03
申请人： Daniel Edelstein , Paul Andry , Leena Buchwalter , Jon Casey , Sherif Goma , Raymond Horton , Gareth Hougham , Michael Lane , Xiao Liu , Chirag Patel , Edmund Sprogis , Michelle Steen , Brian Sundlof , Cornelia Tsang , George Walker , Yu-Ting Cheng , Kenneth Ocheltree , Robert Montoye
发明人： Daniel Edelstein , Paul Andry , Leena Buchwalter , Jon Casey , Sherif Goma , Raymond Horton , Gareth Hougham , Michael Lane , Xiao Liu , Chirag Patel , Edmund Sprogis , Michelle Steen , Brian Sundlof , Cornelia Tsang , George Walker , Yu-Ting Cheng , Kenneth Ocheltree , Robert Montoye
IPC分类号： H01L23/48
CPC分类号： H01L23/49883 , H01L21/486 , H01L21/76898 , H01L23/49827 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.
摘要翻译：一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于或者与衬底的密切匹配。导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯，具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。

9. 发明申请

US20080094085A1 Metalized Elastomeric Probe Structure 有权
标题翻译：金属弹性体探针结构
公开(公告)号：US20080094085A1
公开(公告)日：2008-04-24
申请号：US11718283
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： G01R1/073 , G01R31/26
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
摘要翻译：提供了一种用于电子设备的探针结构。一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。探针结构包括适于连接到测试装置的一个或多个其它接触结构。

10. 发明申请

US20080030209A1 INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME 失效
标题翻译：中间件结构及其制造方法
公开(公告)号：US20080030209A1
公开(公告)日：2008-02-07
申请号：US11741345
申请日：2007-04-27
申请人： Steven Cordes , Matthew Farinelli , Sherif Goma
发明人： Steven Cordes , Matthew Farinelli , Sherif Goma
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R3/00 , H05K3/06 , H05K3/4007 , H05K3/4038
摘要： Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described, Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 μm.
摘要翻译：描述了用于半导体工业的柔性和刚性插入件及其制造方法。自动催化方法用于最小化与柔性插入物的生产相关的成本，同时提高产量和寿命。电接触区域容易隔离，并且由于插入器的所有部分一次镀覆，因此腐蚀的风险降低。从插入件的柔性部分突出的引线可容纳更多种待测试的部件。刚性插入件包括从固定到基板的探针垫突出的销。针的刚度穿过待测接触垫上的氧化物。易于使用的半导体材料和工艺用于制造根据本发明的柔性和刚性插入件。柔性和刚性内插器可以容纳低至25毫米的音高。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式