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    • 5. 发明授权
    • Method of making high voltage, junction isolation semiconductor device
having dual conductivity type buried regions
    • 制造具有双重导电型掩埋区域的高电压,结隔离半导体器件的方法
    • US5837553A
    • 1998-11-17
    • US683599
    • 1996-07-15
    • Lawrence G. Pearce
    • Lawrence G. Pearce
    • H01L21/331H01L21/74H01L21/761H01L21/265
    • H01L29/66272H01L21/74H01L21/761Y10S148/01Y10S148/011
    • A two masking level process for a dual buried region epitaxial architecture forms a first masking layer on a surface of a P type substrate. The first masking layer exposes first and second surface portions of the substrate for N+ and P+ buried regions. N type impurities are introduced into the substrate through the first masking layer, so as to form N+ doped regions. A second masking layer is then selectively formed on the first masking layer, such that the second masking layer masks the first aperture, but exposes a second portion of the first masking layer that both includes and surrounds the second aperture. Boron impurities are then introduced through the exposed second aperture of the first masking layer, to a P+ doping concentration. That portion of the first masking layer surrounding the second aperture is removed, and boron impurities are then introduced into exposed second and third surface portions of the substrate, thereby forming a third buried region of the second conductivity type that is adjacent to the second doped region. The composite mask is removed from the substrate, and an N type layer is grown. Due to differences in diffusion coefficients, the P dopant (boron) in the second and third buried regions outruns the N dopant in the second buried region, resulting in the formation of an N+ buried region that is encapsulated in a P+ buried region. The P+ buried region is, in turn, laterally surrounded by a P-type buried region, so as to provide the desired compensation of N ions that are autodoped from the first N+ buried region in the epitaxial layer.
    • 用于双掩埋区域外延结构的两个掩模级处理在P型衬底的表面上形成第一掩模层。 第一掩蔽层暴露衬底的第一和第二表面部分用于N +和P +掩埋区域。 通过第一掩模层将N型杂质引入衬底中,以形成N +掺杂区域。 然后在第一掩蔽层上选择性地形成第二掩模层,使得第二掩蔽层掩蔽第一孔,但暴露第一掩蔽层的第二部分,其包括并包围第二孔。 然后将硼杂质通过第一掩模层的暴露的第二孔引入P +掺杂浓度。 去除围绕第二孔的第一掩蔽层的那部分,然后将硼杂质引入衬底的暴露的第二和第三表面部分中,从而形成与第二掺杂区相邻的第二导电类型的第三掩埋区 。 从衬底上去除复合掩模,并生长N型层。 由于扩散系数的差异,第二和第三掩埋区域中的P掺杂剂(硼)超出第二掩埋区域中的N掺杂剂,导致形成封装在P +掩埋区域中的N +掩埋区域。 P +掩埋区又被P型掩埋区横向围绕,从而提供从外延层中的第一N +掩埋区自动掺杂的N离子的期望补偿。