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    • 2. 发明授权
    • Method for manufacturing an optoelectrical component and an
optoelectrical component manufactured according to the method
    • 根据该方法制造的光电元件和光电元件的制造方法
    • US5930438A
    • 1999-07-27
    • US931304
    • 1997-09-16
    • Goran PalmskogOlle Jonny HagelGoran GustafssonPaul Eriksen
    • Goran PalmskogOlle Jonny HagelGoran GustafssonPaul Eriksen
    • G02B6/13G02B6/06G02B6/12G02B6/122G02B6/30G02B6/10
    • G02B6/30G02B6/1221
    • The optoelectrical components which up to now have been used in the fibre-optical region have had waveguides of quartz and glass with hermetic encapsulating, which components have had too high manufacturing costs for profitable use. Through making polymeric single mode (SM) waveguides from plastic, for example, benzocyclobutene polymer (BCB) a simple reliable and inexpensive concept for making waveguides can be obtained. Two of the commercially available grades of BCB/DOW Chemicals have furthermore a refractive index difference which permits manufacturing of buried waveguides with SM characteristics. These two types of BCB material have shown themselves to be especially usable for manufacturing of so-called buried SM waveguides: a heat curable grade (1,4) used for under- and over-cladding for waveguides and a photo-definable derivative (3) used as the waveguide material. Encapsulating of a waveguide chip can in this way be made with plastics, at the same time as the connector interface can be formed in the end surfaces of the components.
    • 目前已经在光纤区域中使用的光电组件已经具有石英和玻璃的波导,具有气密封装,这些部件具有太高的制造成本以获得有利的使用。 通过从塑料制造聚合单模(SM)波导,例如苯并环丁烯聚合物(BCB),可以获得制造波导的简单可靠且廉价的概念。 两种商业级BCB / DOW Chemicals还具有折射率差异,其允许制造具有SM特性的掩埋波导。 这两种类型的BCB材料已经显示出自己特别可用于制造所谓的掩埋SM波导:用于波导的低于和过度包覆的可热固化等级(1,4)和可光学定义的衍生物(3 )用作波导材料。 以这种方式,可以用塑料制造波导芯片的封装,同时可以在部件的端面中形成连接器接口。
    • 4. 发明申请
    • Organic electronic circuit and method for making the same
    • 有机电子电路及其制作方法
    • US20060046344A1
    • 2006-03-02
    • US11185861
    • 2005-07-21
    • Rickard LiljedahlMats SandbergGoran GustafssonHans Gudesen
    • Rickard LiljedahlMats SandbergGoran GustafssonHans Gudesen
    • H01L51/40
    • G11C11/22B82Y10/00
    • In an organic electronic circuit (C), particularly a memory circuit with an organic ferroelectric or electret material (2) the active material comprises fluorine atoms and consists of various organic materials. The active material is located between a first electrode and a second electrode. A cell with a capacitor-like structure is defined in the active material and can be accessed for an addressing operation via a first and a second electrode. At least one of these electrodes (1a, 1b) comprises a layer of chemically modified gold. In a passive matrix-addressable electronic device, particularly a ferroelectric or electret memory device, circuits (C) of this kind with the active material as a ferroelectric or electret memory material form the elements of a matrix-addressable array and define the memory cells provided between first and second set of addressing electrodes. At least the electrodes of at least one of the sets then comprise at least a layer of gold. A method in the fabrication of the organic electronic circuit (C) the method comprises steps for depositing a layer of gold as at least one layer of at least one electrode and treating an exposed surface of this layer chemically, whereafter the layer of active material can be deposited on the top of the processed surface of this electrode.
    • 在有机电子电路(C)中,特别是具有有机铁电或驻极体材料的存储电路(2),活性材料包含氟原子并由各种有机材料组成。 活性材料位于第一电极和第二电极之间。 具有电容器状结构的电池被限定在活性材料中,并且可以经由第一和第二电极进行寻址操作。 这些电极(1a,1b)中的至少一个包括化学改性金层。 在无源矩阵寻址电子器件中,特别是铁电或驻极体存储器件中,具有作为铁电或驻极体存储器材料的活性材料的这种电路(C)形成矩阵寻址阵列的元件,并且限定提供的存储器单元 在第一和第二组寻址电极之间。 至少所述组中的至少一个的电极至少包括一层金。 有机电子电路(C)的制造方法包括以下步骤:将金层沉积为至少一层至少一个电极,并化学处理该层的暴露表面,此后活性材料层可以 沉积在该电极的被处理表面的顶部。
    • 5. 发明申请
    • Organic electronic circuit and method for making the same
    • 有机电子电路及其制作方法
    • US20060091435A1
    • 2006-05-04
    • US11185860
    • 2005-07-21
    • Rickard LiljedahlGoran Gustafsson
    • Rickard LiljedahlGoran Gustafsson
    • H01L29/94
    • G11C11/22B82Y10/00
    • In an organic electronic circuit (C), particularly a memory circuit with an organic ferroelectric or electret material (2) the active material comprises fluorine atoms and consists of various organic materials. The active material is located between first and second electrode sets constituting respectively bottom and top electrodes (1a;1b) of the device. A cell with a capacitor-like structure is defined in the active material (2) and can be accessed for an addressing operation via the electrodes. At least one top electrode (1b) comprises a layer of gold in contact with active material. A second layer (12) on the top electrode (1b) comprises conducting material different from gold or can alternatively also be made of gold. A via connection (13) extends between the second electrode layer (12) and a bottom electrode (1a) or another electrode (1b) in the bottom electrode layer. In case the second electrode layer (12) is made of gold the via metal of the via connection can also be gold and integral with the second electrode layer (12). In a method for establishing a top via electrode connection in the device (M), a first top electrode layer of gold is deposited and a via hole etched therethrough and down to the bottom electrode layer, and via metal is deposited to form a via connection (13) and then a second top electrode layer (12) is deposited above the first electrode layer of gold and contacting the via connection.
    • 在有机电子电路(C)中,特别是具有有机铁电或驻极体材料的存储电路(2),活性材料包含氟原子并由各种有机材料组成。 活性材料位于构成装置的底部和顶部电极(1a,1b)的第一和第二电极组之间。 具有电容器状结构的电池被限定在活性材料(2)中,并且可以通过电极进行寻址操作。 至少一个顶部电极(1b)包括与活性材料接触的金属层。 顶部电极(1b)上的第二层(12)包括与金不同的导电材料,或者也可以由金制成。 通孔连接(13)在底部电极层中的第二电极层(12)和底部电极(1a)或另一个电极(1b)之间延伸。 在第二电极层(12)由金制成的情况下,通孔连接的通孔金属也可以是金并且与第二电极层(12)成一体。 在用于在器件(M)中建立顶部通孔电极连接的方法中,沉积金的第一顶部电极层,并且蚀刻通孔并向下蚀刻到底部电极层,并且通过金属沉积以形成通孔连接 (13),然后在金的第一电极层上方沉积第二顶电极层(12),并接触通孔连接。
    • 7. 发明申请
    • Method for making a ferroelectric memory cell in a ferroelectric memory device, and a ferroelectric memory device
    • 在铁电存储器件中制造铁电存储单元的方法和铁电存储器件
    • US20060073658A1
    • 2006-04-06
    • US11294392
    • 2005-12-06
    • Henrik LjungcrantzNiclas EdvardssonJohan CarlssonGoran Gustafsson
    • Henrik LjungcrantzNiclas EdvardssonJohan CarlssonGoran Gustafsson
    • H01L21/8242H01L21/20H01L21/00
    • H01L21/32051H01L27/11502
    • In a method for making ferroelectric memory cells in a ferroelectric memory device a first electrode comprising at least one metal layer and optionally at least one metal oxide layer is formed on a silicon substrate which has an optional insulating layer of silicon dioxide. A ferroelectric layer consisting of a thin film of ferroelectric polymer is formed on the top of the first electrode layer and at least a second electrode comprising at least one metal layer and at least one metal oxide layer is formed on the ferroelectric layer. The second electrode is deposited by thermal evaporation of a high-purity evaporation source from an effusion cell onto the ferroelectric layer in a vacuum chamber filled with a gas or a gas mixture. A ferroelectric memory device wherein the memory cell has been made with the above method, comprises at least a first and a second set of respectively parallel electrodes, wherein the electrodes in a set are provided orthogonally to the electrodes of a nearest following set and with memory cells formed in a ferroelectric layer provided between successive electrode sets, such that memory cells are defined in the crossings between the electrodes which contact the ferroelectric layer on each side thereof.
    • 在铁电存储器件中制造铁电存储单元的方法中,在具有任选的二氧化硅绝缘层的硅衬底上形成包括至少一个金属层和任选的至少一个金属氧化物层的第一电极。 在第一电极层的顶部形成由铁电聚合物薄膜构成的铁电层,并且在铁电层上形成至少包含至少一个金属层和至少一个金属氧化物层的第二电极。 通过在填充有气体或气体混合物的真空室中将高纯度蒸发源从渗出室热蒸发到铁电层上来沉积第二电极。 具有上述方法制造存储单元的铁电存储器件包括至少第一组和第二组分别平行的电极,其中一组中的电极与最接近的组的电极和记忆体正交地设置 形成在连续的电极组之间的铁电体层中形成的单元,使得存储单元被限定在与其每一侧接触铁电体层的电极之间的交叉中。
    • 8. 发明授权
    • Organic electronic circuit and method for making the same
    • 有机电子电路及其制作方法
    • US07291859B2
    • 2007-11-06
    • US11185860
    • 2005-07-21
    • Rickard LiljedahlGoran Gustafsson
    • Rickard LiljedahlGoran Gustafsson
    • H01L35/24
    • G11C11/22B82Y10/00
    • In an organic electronic circuit, particularly memory circuit with an organic ferroelectric or electret material the active material comprises fluorine atoms and consists of various organic materials. The active material is located between first and second electrode sets constituting respectively bottom and top electrodes of the device. A cell with a capacitor like structure is defined in the active material and can be accessed for an addressing operation via the electrodes. At least one top electrode comprises a layer of gold in contact with active material. A second layer on the top electrode comprises conducting material different from gold or can alternatively also be made of gold. A via connection extends between the second electrode layer and a bottom electrode or another electrode in the bottom electrode layer. In case the second electrode layer is made of gold the via metal of the via connection can also be gold and integral with the second electrode layer. In a method for establishing a top via electrode connection in the device, a first top electrode layer of gold is deposited and a via hole etched therethrough and down to the bottom electrode layer, and via metal is deposited to form a via connection and then a second top electrode layer is deposited above the first electrode layer of gold and contacting the via connection.
    • 在有机电子电路中,特别是具有有机铁电或驻极体材料的存储电路,活性材料包含氟原子并由各种有机材料组成。 活性物质位于构成装置的底部和顶部电极的第一和第二电极组之间。 具有电容器结构的电池被定义在活性材料中,并且可以通过电极进行寻址操作。 至少一个顶部电极包括与活性材料接触的金属层。 顶部电极上的第二层包括与金不同的导电材料,或者也可以由金制成。 通孔连接在第二电极层和下电极层中的底电极或另一电极之间延伸。 在第二电极层由金制成的情况下,通孔连接的通孔金属也可以是金并且与第二电极层成一体。 在用于在器件中建立顶部通孔电极连接的方法中,沉积金的第一顶部电极层,并且蚀刻通孔并向下蚀刻到底部电极层,并且通过金属沉积以形成通孔连接,然后将 第二顶部电极层沉积在金的第一电极层上方并接触通孔连接。